A Kelvin probe system is provided. The invention is achieved using a rotating Kelvin probe head comprising a Kelvin probe face is provided on a side face of the Kelvin probe head.

A method for generating corrected measured current in an Intelligent Electronic Device (IED) that is a true representation of primary current in an electrical network is disclosed. The method uses regression and a first threshold on measured sampled values from CT to detect a deviation instance that indicates a possibility of saturation. Wavelet and second threshold based detection of instances of saturation is then done. Then a regression based correction that uses a dynamic correction factor is implemented in real time to obtain corrected sampled values i.e. corrected measured current. Ending of correction is done based upon a predetermined selection criterion, The generated corrected measured current is used for protection and control functions in the IED. A CT output re-generation module as a functional module in the IED for implementing the method as described above is also disclosed.

The present invention relates to a reference voltage temperature coefficient calibration circuit. The circuit comprises: an operational amplifier comprising an input pair transistor, a load pair transistor, and a bias current source, an inverted input terminal of the operational amplifier being connected to an output terminal of the operational amplifier; and an adjustable current module connected in parallel to the load pair transistor, the adjustable current module being configured to generate an adjusting current, the adjusting current being used to adjust an offset current flowing through the input pair transistor, wherein the adjusting current is related to a current of the bias current source and an order of Kelvin temperature. The present invention is applicable to calibration of first-order to high-order temperature coefficients of a reference voltage in a circuit, and has universality.

A capacitive sensor includes sensor electrode structure and a controller operating the sensor. The sensor also includes test drive electrode structure or a reference capacitor, the controller operating the test drive electrode structure or the reference capacitor to test operability of the sensor.

There is provided a test module for testing a fingerprint sensing device comprising: an electrically conductive bottom element comprising an exterior surface portion configured to contact a sensing surface of the fingerprint sensing device; an electrically conductive intermediate element, connected to the bottom element on a side opposing the exterior surface, the intermediate element comprising a flexible material enabling the bottom element to change alignment in response to an applied force occurring when the exterior surface is pressed against a surface being tilted with respect to the exterior surface of the bottom element; and a top element configured connect the test module to a test fixture. There is also provided a method for testing a fingerprint sensing device using the described test module.

A probe calibration device that includes a first offset element having a substantially rectangular first aperture. The probe calibration device includes a tuned pass element disposed adjacent to the first offset element. The tuned pass element has a non-rectangular second aperture. The probe calibration device includes a second offset element disposed adjacent to the tuned pass element and on a side opposite the first offset element. The second offset element has a substantially rectangular third aperture. The probe calibration device includes a backing element disposed adjacent to the second offset element. The first offset element, the tuned pass element, the second offset element and the backing element form a cavity.

There is provided a test module for testing a fingerprint sensing device comprising: an electrically conductive bottom element comprising an exterior surface portion configured to contact a sensing surface of the fingerprint sensing device; an electrically conductive intermediate element, connected to the bottom element on a side opposing the exterior surface, the intermediate element comprising a flexible material enabling the bottom element to change alignment in response to an applied force occurring when the exterior surface is pressed against a surface being tilted with respect to the exterior surface of the bottom element; and a top element configured connect the test module to a test fixture. There is also provided a method for testing a fingerprint sensing device using the described test module.

A method of preparing an iron-implanted semiconductor wafer for use in surface photovoltage iron mapping and other evaluation techniques. A semiconductor wafer is implanted with iron through the at least two different regions of the front surface of the semiconductor at different iron implantation densities, and the iron-implanted semiconductor wafer is annealed at a temperature and duration sufficient to diffuse implanted iron into the bulk region of the semiconductor wafer.

Disclosed is a process for characterizing a fixture component of a test fixture. The fixture component comprises a test instrument interface and a device under test, DUT, interface. The process comprises connecting a test instrument to the test instrument interface; sequentially establishing a plurality of characterization setups for the fixture component; and characterizing at least one scattering, S, parameter of the respectively established characterization setup. The establishing respectively comprises one of: providing an open circuit at the DUT interface, providing a short circuit at the DUT interface, providing a further fixture component of the test fixture at the DUT interface via mated connectors, and providing a DUT at the DUT interface. This avoids inaccuracies, high cost and availability issues in connection with lead-out structures of test fixtures.

Provided herein are systems, devices and methods for detection of unsanctioned implantation of a powerline communication module in a product under test, without the need to disassemble the product under test.