Patent classifications
G01R35/007
FOUR-TERMINAL-PAIR ALTERNATING CURRENT QUANTUM RESISTANCE DISSEMINATION BRIDGE AND RELATED METHOD
A four-terminal-pair AC quantum resistance dissemination bridge and related methods are provided. The bridge includes: a supply transformer IVD1, a Kelvin branch A1, a Wagner branch A0, the first and second current sources A2, A3, an injection inductive voltage divider A4, a ratio transformer IVD2, the first and second four-terminal AC resistor connection points Z1, Z2, chokes H, and null indicators D. An isolated inductive winding LO is wound along the ratio transformer IVD2 and supplies excitation current to primary winding of injection inductive voltage divider A4 to avoid the mutual influence among various balance networks and rapid balance of the bridge can be realized. By changing turn ratio of primary winding L3 and secondary winding L4 of the second inductive voltage divider T2, the phase shift can be realized through only one set of capacitors for imaginary part error compensation, the bridge with multiple frequency points can be obtained.
SYSTEM, DEVICE AND METHODS FOR DETECTION OF UNSANCTIONED HARDWARE MODIFICATION OF A PRODUCT'S AC CIRCUIT
Provided herein are systems, devices and methods for detection of unsanctioned implantation of a powerline communication module in a product under test, without the need to disassemble the product under test.
Low profile millimeterwave load pull tuner
A low-profile impedance tuner uses a cam-driven piston-like vertical movement of a metallic tuning probe inside a low loss slabline, controlled by an eccentrically centered disc (cam), which is attached to the axis of a stepper motor and rotates parallel to the slabline walls. The structure combines the benefits of low profile rotating tuning probe control with the benign reflection factor phase trajectory of block tuning probes; this is critical for accurate interpolation and impedance synthesis (tuning) strategies using a limited number of calibration points, especially at high microwave and millimeter-wave frequencies.
APPARATUS AND METHOD FOR CALIBRATING A BATTERY EMULATOR
An apparatus or method for calibrating a battery emulator is proposed. The battery emulator emulates a plurality of cells connected in series, wherein each emulated cell has taps over which at least one emulated quantity is tapped, wherein the apparatus comprises a switching apparatus via which a calibration standard is switchably connectable with different taps.
Comb signal generator and method of providing a phase and amplitude reference
A comb signal generator that includes at least two signal sources that each provide a signal, wherein the signals provided by the at least two signal sources are shaped similarly. The com signal generator also has a combining circuit connected with the at least two signal sources, wherein the combining circuit is configured to combine the signals provided by the at least two signal sources, thereby generating a combined signal. Further, the com signal generator includes a clipping circuit connected with the combining circuit, wherein the clipping circuit is configured to receive and process the combined signal, thereby generating a comb signal. Further, a method of providing a phase and amplitude reference is described.
MEASUREMENT ACCESSORY DEVICE
A measurement accessory device connectable to a measurement apparatus or to a device under test wherein the measurement accessory device comprises means for providing characteristic data of said measurement accessory device in machine readable form used by said measurement apparatus during measurement of said device under test.
MAGNETIC FIELD CALIBRATION DEVICE AND METHOD OF CALIBRATING MAGNETISM MEASUREMENT DEVICE USING THE SAME
A magnetic field calibration device is used to calibrate a magnetism measurement device having a plurality of magnetic sensors and includes a first holder having a first holding surface, a second holder having a second holding surface having a fixed relative positional relation with the first holding surface, and magnetism generating parts fixed to the first holding surface and the second holding surface. Thus, calibration can be completed with a single operation by assigning the first and second holding surfaces of the magnetic field calibration device respectively to the first and second measurement surfaces of the magnetism measurement device. In addition, since the relative positional relation between the first and second holding surfaces is fixed, measurement results obtained from the individual measurement surfaces match each other.
METHODS AND DEVICES FOR HIGH STABILITY PRECISION VOLTAGE DIVIDERS
Resistor voltage dividers are commonly used to create reference voltages, or to reduce the magnitude of a voltage so it can be measured. Many measurements in test and measurement or calibration applications regularly require accuracies within the sub-part per million (ppm) range, e.g. 0.1 ppm to 1.0 ppm. However, the continued drive for improved accuracy in calibration, standards, and measurements on circuits and components means many measurements and measurement systems are operating at 50 parts per billion (ppb) and below to approximately 10 ppb. At these levels even relatively simple passive elements such as voltage dividers cannot be used without calibration and that these calibrations may be required at frequencies substantially higher than the other elements within the test and measurement equipment. Accordingly, the inventors have established a self-contained voltage divider with internal calibration allowing the voltage divider to be calibrated for every measurement if necessary.
SURFACE PHOTOVOLTAGE CALIBRATION STANDARD
A method of preparing an iron-implanted semiconductor wafer for use in surface photovoltage iron mapping and other evaluation techniques. A semiconductor wafer is implanted with iron through the at least two different regions of the front surface of the semiconductor at different iron implantation densities, and the iron-implanted semiconductor wafer is annealed at a temperature and duration sufficient to diffuse implanted iron into the bulk region of the semiconductor wafer.
TEST STANDARDS AND METHODS FOR IMPEDANCE CALIBRATION OF A PROBE SYSTEM, AND PROBE SYSTEMS THAT INCLUDE THE TEST STANDARDS OR UTILIZE THE METHODS
Test standards and methods for impedance calibration of a probe system and probe systems that include the test standards and/or utilize the methods are disclosed herein. The test standards include at least one test structure. In some embodiments, the test standard further includes an alignment structure that is associated with the test structure. In some embodiments, the test standards include a plurality of test structures. In some embodiments, the plurality of test structures includes a thin film thru test structure and a thin film offset test structure. In some embodiments, the plurality of test structures is positioned to simultaneously contact a plurality of probe regions of a probe head. The methods include methods of calibrating a probe system.