According to an aspect, an active matrix substrate of an X-ray imaging panel includes: an active matrix substrate having a pixel region including a plurality of pixels; and a scintillator that converts X-rays projected onto the X-ray imaging panel to scintillation light. The plurality of pixels include respective photoelectric conversion elements. The active matrix substrate further includes a first planarizing film that covers the photoelectric conversion elements, is formed from an organic resin film, and has a plurality of first contact holes and a first wiring line that is formed in the first contact holes and in a layer upper than the first planarizing film and connected to the photoelectric conversion elements within the first contact holes.

Devices, systems, and methods of using one or more memristors as a radiation sensor are enabled. A memristor can be attractive as a sensor due to its passive low power characteristics. Medical and environment monitoring are contemplated use cases. Sensing radiation as part of a security system (at an airport for example) and screening food for radiation exposure are also possible uses. The memristor as a radiation sensor may possibly provide an inexpensive and easy alternative to personal thermoluminescent dosimeters (TLD). Memristor devices with high current and low power operation may be attached with wearable plastic substrates. An example device includes two metal strips with a 50 μm thick layer of TiO.sub.2 memristor material. The device may be made large relative to traditional memristors which are nanometers in scale but its increased thickness can significantly increase the probability of radiation interaction with the memristor material.

A dynamic X-ray detecting panel, an X-ray detector including the same, and a method of driving an X-ray detector are disclosed. The method of driving the X-ray detector is a method of driving a dynamic X-ray detector including the X-ray detecting panel. The X-ray detecting panel includes multiple pixels arranged in a matrix, each of the pixels includes a readout thin film transistor, a reset thin film transistor, and a photodiode, and line reset, window time, and readout proceed with respect to the multiple pixels in each row.

A method of fabricating radiation sensor dies includes forming a plurality of radiation-sensitive detector elements and a plurality of visible identifiers on at least some of the radiation-sensitive detector elements on a substrate, where each visible identifier is located in a different sub-region of the substrate containing a subset of the radiation-sensitive detector elements, and separating the sub-regions of the substrate from one another to provide a plurality of radiation sensor dies, where the visible identifier on each radiation sensor die uniquely identifies the radiation sensor die with respect to the other radiation sensor dies of the plurality of radiation sensor dies.

A method of fabricating radiation sensor dies includes forming a plurality of radiation-sensitive detector elements and a plurality of visible identifiers on at least some of the radiation-sensitive detector elements on a substrate, where each visible identifier is located in a different sub-region of the substrate containing a subset of the radiation-sensitive detector elements, and separating the sub-regions of the substrate from one another to provide a plurality of radiation sensor dies, where the visible identifier on each radiation sensor die uniquely identifies the radiation sensor die with respect to the other radiation sensor dies of the plurality of radiation sensor dies.

It is described a charge preamplifier device (100) integrated in a chip (200) of semiconductive material comprising: an input (IN) for an input signal (i.sub.IN) and an output (OUT) for an output signal (v.sub.OUT); a substrate (202) of semiconductive material doped according to a first type of conductivity; an electrically insulating layer (204) placed on said substrate (202); a feedback capacitor (C.sub.f) integrated in the chip (200) and comprising a first electrode (3) connected to the input (IN) and a second electrode (2) connected to the output (OUT). The second electrode (2) is formed by a doped conductive region (205) having a second type of conductivity, opposite to the first type of conductivity, and integrated in the substrate (202) in order to face the first electrode (3).

It is described a charge preamplifier device (100) integrated in a chip (200) of semiconductive material comprising: an input (IN) for an input signal (i.sub.IN) and an output (OUT) for an output signal (v.sub.OUT); a substrate (202) of semiconductive material doped according to a first type of conductivity; an electrically insulating layer (204) placed on said substrate (202); a feedback capacitor (C.sub.f) integrated in the chip (200) and comprising a first electrode (3) connected to the input (IN) and a second electrode (2) connected to the output (OUT). The second electrode (2) is formed by a doped conductive region (205) having a second type of conductivity, opposite to the first type of conductivity, and integrated in the substrate (202) in order to face the first electrode (3).

A computed tomography device includes a holding frame and a ring mount, being movably mounted to the holding frame. The ring mount includes an x-ray detector, with a semiconductor material, operable in an equilibrium of statistical states of occupation. In an embodiment, the computed tomography device includes a first power supply, set up to supply power, in an operating state of the computed tomography device, to a first lot of components of the computed tomography device, the first lot of components being arranged on the ring mount for an image generation process; and a second power supply, separable from the first power supply in terms of circuitry, to supply power to a second lot of components of the computed tomography device in a resting state of the computed tomography device, the components of the second lot being set up to hold the semiconductor material in the equilibrium.

A computed tomography device includes a holding frame and a ring mount, being movably mounted to the holding frame. The ring mount includes an x-ray detector, with a semiconductor material, operable in an equilibrium of statistical states of occupation. In an embodiment, the computed tomography device includes a first power supply, set up to supply power, in an operating state of the computed tomography device, to a first lot of components of the computed tomography device, the first lot of components being arranged on the ring mount for an image generation process; and a second power supply, separable from the first power supply in terms of circuitry, to supply power to a second lot of components of the computed tomography device in a resting state of the computed tomography device, the components of the second lot being set up to hold the semiconductor material in the equilibrium.

Multiple interactions, such as Compton scattering, inside a PET detector are used to predict an incident photon's direction for identifying true coincidence events versus scatter/random coincidence events by creating a cone shaped shell projection defining a range of possible flight directions for the incident photon. The disclosed techniques can be used as prior information to improve the image reconstruction process. The disclosed techniques can be implemented in a LYSO/SiPM-based layer stacked detector, which can precisely register multiple interactions' 3D position.