An apparatus, including: a plurality of lens tiles; and a base housing and positioning the plurality of lens tiles in an array configuration; the base comprising a plurality of light-occluding barriers, wherein each of the plurality of light-occluding barriers is located between two adjacent of the plurality of lens tiles. Other embodiments are described herein.

Digital camera systems and methods are described that provide a color digital camera with direct luminance detection. The luminance signals are obtained directly from a broadband image sensor channel without interpolation of RGB data. The chrominance signals are obtained from one or more additional image sensor channels comprising red and/or blue color band detection capability. The red and blue signals are directly combined with the luminance image sensor channel signals. The digital camera generates and outputs an image in YCrCb color space by directly combining outputs of the broadband, red and blue sensors.

Digital camera systems and methods are described that provide a color digital camera with direct luminance detection. The luminance signals are obtained directly from a broadband image sensor channel without interpolation of RGB data. The chrominance signals are obtained from one or more additional image sensor channels comprising red and/or blue color band detection capability. The red and blue signals are directly combined with the luminance image sensor channel signals. The digital camera generates and outputs an image in YCrCb color space by directly combining outputs of the broadband, red and blue sensors.

Disclosed is a wavefront sensor for measuring a tilt of a wavefront at an array of locations across a beam of radiation, wherein said wavefront sensor comprises a film, for example of Zirconium, having an indent array comprising an indent at each of said array of locations, such that each indent of the indent array is operable to perform focusing of said radiation. Also disclosed is a radiation source and inspection apparatus comprising such a wavefront sensor.

A vehicular ground illumination module includes first, second and third icon LEDs, and first, second and third masks associated with respective ones of the first, second and third LEDs. A ground illumination LED and a freeform optic of the module function to, when the ground illumination LED electrically powered, illuminate the ground adjacent the side of the vehicle at which the module is mounted, with a ground illumination region of the ground being illuminated at a ground illumination intensity and an icon region of the ground being illuminated at an icon illumination intensity that is less than the ground illumination intensity. When the first, second and third icon LEDs are individually electrically powered to emit light, light emitted by the LEDs passes through the respective masks to project first, second and third projected images that provide animated images at the icon region of the ground adjacent the vehicle.

A design for a micro-lens (i.e., a lens on the scale of micrometers) incorporates existing nanofabrication techniques and can be incorporated into High Concentrating Photovoltaic (HCPV), solar thermal collectors, and traditional flat PV systems. Using the theory of wave optics, the design is able to achieve a high numerical aperture, i.e., it can receive light over a wider range of angles. The design also reduces the distance the focal point shifts as the light source shifts; this eliminates the need for a tracking system in CPV and PV applications. Reducing the lens size also facilitates smaller, lightweight CPV systems, which makes CPV attractive for additional applications. Finally, these concentrators reduce the exchanging area of a typical flat solar thermal system where heat is received, which improves the overall system's efficiency and allows its use also during rigid winter time.

An example optical substrate, according to aspects of the present disclosure, includes a support structure, a plurality of lenses, and a plurality of flexures. Each flexure is engaged with the support structure and a respective lens for allowing independent lateral movements of the lenses during assembly of the optical substrate with another layer of an optical assembly. A first lateral movement provided by a first flexure of the plurality of flexures during the assembly is different from a second lateral movement provided by a second flexure of the plurality of flexures.

Disclosed herein are techniques for aligning a collimator assembly with an array of LEDs. According to certain embodiments, a method includes using lithography to form a first plurality of contact pads and a second plurality of contact pads on a backplane; bonding a plurality of dies to the first plurality of contact pads, wherein each of the plurality of dies comprises a plurality of light emitting diodes; forming a first plurality of features on the second plurality of contact pads; and aligning a plurality of lenses on an assembly with the plurality of dies by coupling a second plurality of features on the assembly with the first plurality of features on the second plurality of contact pads.

An electroluminescent display device includes: a substrate including: a first subpixel, a second subpixel, and a third subpixel, a first electrode in each of the first to third subpixels, an emission layer on the first electrode and including: a first stack emitting first-colored light, and a second stack emitting second-colored light, the second stack being on the first stack, a second electrode on the emission layer, and a light-absorbing layer on the second electrode, wherein the first subpixel emits: light with a red wavelength range, and light with a cyan wavelength range, wherein the second subpixel emits light with a green wavelength range, wherein the third subpixel emits light with a blue wavelength range, and wherein the light-absorbing layer includes a cyan-absorbing material absorbing the light with the cyan wavelength range.

The present technology relates to a solid-state imaging device that can improve the sensitivity of imaging pixels while maintaining AF properties of a focus detecting pixel. The present technology also relates to a method of manufacturing the solid-state imaging device, and an electronic apparatus. The solid-state imaging device includes: a pixel array unit including pixels; first microlenses formed in the respective pixels; a film formed to cover the first microlenses of the respective pixels; and a second microlens formed on the film of the focus detecting pixel among the pixels. The present technology can be applied to CMOS image sensors, for example.