Patent classifications
G02B3/0075
Molded photosensitive assembly of array imaging module
An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
RESIN COMPONENT HOLDING MEMBER, IMAGE DISPLAY DEVICE, AND LIGHT DIFFUSION MEMBER
A resin component holding member is made of a metal material and holds a predetermined resin component. The resin component holding member includes, in at least a region with which the resin component can be in contact, a configuration for preventing alkaline residue caused by chemical treatment from permeating into the resin component.
Light emitting device with self-aligning preformed lens
A light emitting diode (LED) light source is disclosed. The LED light source comprises a lens structure that includes a hemispherical dome with a base. The LED light source comprises a cavity in the base. The cavity has an opening and a taper such that a cross-section area within the cavity is smaller than an area of the opening. The LED light source comprises a light emitting device comprising an LED die contacting the taper. The taper allows for easy insertion of the LED die into the lens structure. The taper serves to accurately align the LED die when the LED die is inserted.
Product alignment using a printed relief
A printing system capable of accurately positioning a lenticular array in registration with a rectilinear raster includes a printer that is capable of printing onto a printable surface. The printer has a main support surface on which the printable surface rests. The system further includes a series of raised parallel relief features being spatially formed along a printable substrate that is supported by the main support surface. The raised parallel relief features are raised to a sufficient height above the printable substrate such that when the lenticular array is disposed upon the raised parallel relief features, each raised parallel relief feature fits and is disposed within a valley formed between two respective adjoining lenticules of the lenticular array.
METASURFACE DEVICE, PREPARATION METHOD THEREOF, AND OPTICAL IMAGING SYSTEM
A metasurface device includes a plurality of metasurface units and a flexible connection structure. The plurality of metasurface units are arranged in a plane shape spaced apart from each other. Each metasurface unit of the plurality of metasurface units includes a substrate and a plurality of nanostructure units arranged on a side of the substrate. The flexible connection structure connects the plurality of metasurface units.
Display device and vehicle
The present disclosure provides a display device and a vehicle, and relate to the field of display technologies. When the present disclosure is applied to a vehicle, a driver and a passenger may see different images, and thus user experience is enhanced. A display device includes: a display panel and a light adjusting structure arranged at a light exiting side of the display panel. The light adjusting structure is configured to adjust a direction of exit light from the display panel, such that first images displayed by all first display units in the display panel and second images displayed by all second display units in the display panel are respectively transmitted to a first visible area and a second visible area.
Electro-optical device, method for manufacturing electro-optical device, and member for manufacturing electro-optical device
An electro-optical device includes a transmissive substrate, a lens surface, a transmissive lens layer, an optical path adjustment layer that adjusts an optical path length of light passing through the lens surface, a wiring layer that includes a transmissive light transmitting portion and a wiring portion including wiring and that is disposed in contact with the optical path adjustment layer on an opposite side of the optical path adjustment layer from the lens layer, a transmissive pixel electrode disposed on an opposite side of the wiring layer from the optical path adjustment layer and overlapping the light transmitting portion in plan view, a first mark disposed between the substrate and the optical path adjustment layer and being in contact with the substrate, and a second mark disposed between the optical path adjustment layer and the wiring layer and being in contact with the optical path adjustment layer.
Solid-state imaging device, production method, and electronic apparatus
The present technology relates to a solid-state imaging device, a production method, and an electronic apparatus that can prevent sensitivity unevenness from generating. The solid-state imaging device includes a pixel array unit having a plurality of pixels, a microlens formed by laminating a plurality of lens layers for the every pixel, and a film formed between the lens layers with a uniform film thickness having a refractive index lower than a refractive index of the lens layer. The present technology is applicable to an amplification type solid-state imaging device such as a surface irradiation type or rear irradiation type CMOS image sensor, and a charge transfer type solid-state imaging device such as a CCD image sensor.
Laminated lens structure, camera module, and method for manufacturing laminated lens structure
To prevent the resin from oozing out during the lens molding due to the capillary action. A laminated lens structure according to the present disclosure includes: a plurality of lens structures including a substrate provided with an opening part, a lens inserted into the opening part to be fixed to the substrate, and a recessed part provided at an area in which a lateral face of the opening part and a surface of the substrate are intersected, and recessed more than the surface of the substrate. The lenses are arrayed in an optical axis direction by the substrates being joined. This configuration makes it possible to prevent the resin from oozing out during the lens molding due to the capillary action.
VEHICULAR GROUND ILLUMINATION AND ICON PROJECTION MODULE
A vehicular ground illumination module includes first, second and third icon LEDs, and first, second and third masks associated with respective ones of the first, second and third LEDs. A ground illumination LED and a freeform optic of the module function to, when the ground illumination LED electrically powered, illuminate the ground adjacent the side of the vehicle at which the module is mounted, with a ground illumination region of the ground being illuminated at a ground illumination intensity and an icon region of the ground being illuminated at an icon illumination intensity that is less than the ground illumination intensity. When the first, second and third icon LEDs are individually electrically powered to emit light, light emitted by the LEDs passes through the respective masks to project first, second and third projected images that provide animated images at the icon region of the ground adjacent the vehicle.