Embodiments are disclosed for a coupling element with embedded modal filtering for a laser and/or a photodiode. An example system includes a laser and an optical coupling element. The laser is configured to emit an optical signal. The optical coupling element is configured to receive the optical signal emitted by the laser. The optical coupling element is also configured to be connected to an optical fiber such that, in operation, the optical signal is transmitted from the laser to the optical fiber via the optical coupling element. Furthermore, the coupling element comprises a tapered section that provides modal filtering of the optical signal.

A process of making a diverging-light fiber optics illumination delivery system includes providing a micro-post comprising a glass-ceramic light-scattering element that includes at least one of a ceramic, a glass ceramic, an immiscible glass, a porous glass, opal glass, amorphous glass, an aerated glass, and a nanostructured glass; and fusion-splicing the glass-ceramic micro-post to the optical fiber by pulling an arc between electrodes across a gap formed by the optical fiber and the glass-ceramic micro-post; maintaining the arc for a time sufficiently long to make facing surfaces of the optical fiber and the micro-post one of malleable and molten; and pushing and thereby fusing together the facing surfaces of the optical fiber and the micro-post. Some embodiments can include fusing the glass-ceramic micro-post to the optical fiber by applying a laser beam to heat up at least one of the facing surfaces of the optical fiber and the glass-ceramic micro-post.

An optical fiber (F2) having a length defining a longitudinal direction is disclosed. The optical fiber (F2) has at least two fiber cores (C21, C22) extending along the length of the optical fiber (F2), and an optical coupling member (OCM2) is arranged at a proximal optical fiber end of the optical fiber (F2). The coupling member (OCM2) has a first distal end face (OF2) optically connected to the proximal optical fiber end, and a proximal second end face (IF2) spaced apart from the first distal end face (OF2) in the longitudinal direction of the optical fiber (F2), the optical coupling member (OCM2) being configured to couple light into each of the fiber cores (C21, C22, C23).

A mirror and method of fabricating the mirror, the method comprising: providing a silicon-on-insulator substrate, the substrate comprising: a silicon support layer; a buried oxide (BOX) layer on top of the silicon support layer; and a silicon device layer on top of the BOX layer; creating a via in the silicon device layer, the via extending to the BOX layer; etching away a portion of the BOX layer starting at the via and extending laterally away from the via in a first direction to create a channel between the silicon device layer and silicon support layer; applying an anisotropic etch via the channel to regions of the silicon device layer and silicon support layer adjacent to the channel; the anisotropic etch following an orientation plane of the silicon device layer and silicon support layer to create a cavity underneath an overhanging portion of the silicon device layer; the overhanging portion defining a planar underside surface for vertically coupling light into and out of the silicon device layer; and applying a metal coating to the underside surface.

A mirror and method of fabricating the mirror, the method comprising: providing a silicon-on-insulator substrate, the substrate comprising: a silicon support layer; a buried oxide (BOX) layer on top of the silicon support layer; and a silicon device layer on top of the BOX layer; creating a via in the silicon device layer, the via extending to the BOX layer; etching away a portion of the BOX layer starting at the via and extending laterally away from the via in a first direction to create a channel between the silicon device layer and silicon support layer; applying an anisotropic etch via the channel to regions of the silicon device layer and silicon support layer adjacent to the channel; the anisotropic etch following an orientation plane of the silicon device layer and silicon support layer to create a cavity underneath an overhanging portion of the silicon device layer; the overhanging portion defining a planar underside surface for vertically coupling light into and out of the silicon device layer; and applying a metal coating to the underside surface.

This optical communication device (1) is provided with a plurality of light-receiving elements (11) and a plurality of optical fibers (12). The plurality of optical fibers each includes a light-incident end portion (12a) for communication light and a light-emission end portion (12b) for communication light. The plurality of light-emission end portions is each arranged near each of the plurality of light-receiving elements. The plurality of light-incident end portions is each configured to be capable of being arranged in a predetermined position in a predetermined direction.

An integrated optical device fabricated in the back end of line process located within the vertical span of the metal stack and having one or more advantages over a corresponding integrated optical device fabricated in the silicon on insulator layer.

A photonic integrated circuit (PIC) having a substrate in which vertically coupled photodetectors and in-line optical modulators are integrated to enable vertical coupling of light using a fiber assembly block (FAB), with the planar end surface thereof being attached to a substantially planar main surface of the substrate. In an example embodiment, the photodetectors are buried in deep vias formed in the substrate, and the in-line optical modulators are waveguide-connected to the corresponding vertical-coupling optical gratings. The photodetectors and optical gratings may be arranged in a linear array along the main surface of the substrate to enable uncomplicated optical alignment of end segments of the optical fibers in the FAB with the corresponding photodetectors and optical gratings for vertical coupling of light therebetween. In some embodiments, the FAB may have more than one hundred optical fibers. In some embodiments, the PIC can be implemented using the silicon photonics material platform.

A photonic integrated circuit (PIC) having a substrate in which vertically coupled photodetectors and in-line optical modulators are integrated to enable vertical coupling of light using a fiber assembly block (FAB), with the planar end surface thereof being attached to a substantially planar main surface of the substrate. In an example embodiment, the photodetectors are buried in deep vias formed in the substrate, and the in-line optical modulators are waveguide-connected to the corresponding vertical-coupling optical gratings. The photodetectors and optical gratings may be arranged in a linear array along the main surface of the substrate to enable uncomplicated optical alignment of end segments of the optical fibers in the FAB with the corresponding photodetectors and optical gratings for vertical coupling of light therebetween. In some embodiments, the FAB may have more than one hundred optical fibers. In some embodiments, the PIC can be implemented using the silicon photonics material platform.

The present invention relates to an optical fiber device for removing cladding light, an apparatus and a method for etching the same. The optical fiber device comprises: a first optical fiber section through an N.sup.th optical fiber section arranged in sequence along a light travelling direction; and a first tapered coupling section coupling a K.sup.th optical fiber section and a (K+1).sup.th optical fiber section, where the K.sup.th optical fiber section is any one of the first optical fiber section through the N.sup.th optical fiber section and the (K+1) optical fiber section is any one of the first optical fiber section through the N.sup.th optical fiber section adjacent to the K.sup.th optical fiber section, wherein the K.sup.th optical fiber section comprises: at least one first subsection and at least one second subsection alternately arranged along the light travelling direction, each of the at least one first subsection having a diameter D.sub.2K−1 and a length L.sub.2K−1; and each of the at least one second subsection having a diameter D.sub.2K and a length L.sub.2K; and a second tapered coupling section coupling the first subsection and the second subsection adjacent to the first subsection, wherein the diameter D.sub.2K−1 and the length L.sub.2K−1 of the first subsection and the diameter D.sub.2K and the length L.sub.2K of the second subsection of the K.sup.th optical fiber section and a diameter D.sub.2K+1 and a length L.sub.2K+1 of the first subsection and a diameter D.sub.2K+2 and a length L.sub.2K+2 of the second subsection of the (K+1).sup.th optical section satisfy D.sub.2K−1>D.sub.2K, D.sub.2K+1>D.sub.2K+2, L.sub.2K−1>L.sub.2K+1, L.sub.2K>L.sub.2K+2 and D.sub.2K−1=D.sub.2K+1, and satisfy D.sub.2K>D.sub.2K+2 for odd K and D.sub.2K<D.sub.2K+2 for even K (where N is a natural number, and K is any natural number satisfying 1≤K≤N−1).