The present invention discloses an optical fibre cable clamping apparatus (100) for clamping an optical fibre cable attached to a base comprising an upper clamp member and a lower clamp member, a grooved fibre extension for placing optical fibre elements and two grooved strength member extensions formed in the upper clamp member and the lower clamp member. In particular, the two grooved strength member extension is coupled to attach two strength members.

A fiber optic and electrical connection system includes a fiber optic cable, a ruggedized fiber optic connector, a ruggedized fiber optic adapter, and a fiber optic enclosure. The cable includes one or more electrically conducting strength members. The connector, the adapter, and the enclosure each have one or more electrical conductors. The cable is terminated by the connector with the conductors of the connector in electrical communication with the strength members. The conductors of the connector electrically contact the conductors of the adapter when the connector and the adapter are mechanically connected. And, the conductors of the adapter electrically contact the conductors of the enclosure when the adapter is mounted on the enclosure.

An optical fibre having a functionalised distal exploration end including a sheath, and a ferrule rigidly connected to the sheath at the distal exploration end, characterised in that the distal exploration end has a functionalised head which is removably attached on the ferrule. Also, a method of assembling the optical fibre.

A passively aligned fan-out apparatus for a multicore fiber (MCF) includes a fan-out assembly that comprises a fan-out substrate, small-clad fibers (SCFs) supported in SCF V-grooves of the fan-out substrate, and alignment rods disposed outboard alignment V-grooves of the fan-out substrate. The SCFs have a distal-end pitch P2D at a distal end of the fan-out substrate greater than the proximal-end pitch P2P of the SCFs at a proximal end of the fan-out substrate. An MCF assembly and/or single mode fiber (SMF) assembly may also be provided as part of the fan-out apparatus.

An electronic device may have a display, a display cover layer, and a sheet-packed coherent fiber bundle. The coherent fiber bundle may have an input surface that receives an image from the display and a corresponding output surface to which the image is transported. The coherent fiber bundle may be placed between the display and the display cover layer and mounted to a housing. The coherent fiber bundle may have fiber cores with bends that help conceal the housing from view and make the display appear borderless. The coherent fiber bundle has filaments formed from elongated strands of binder in which multiple fiber cores are embedded. Sheets of filaments are stacked and fused together to form the coherent fiber bundle. By aligning and fusing the sheets with respect to each other the filaments are packed with a desired density and uniformity.

A remote indicator system comprising a housing and a display unit located remotely from the housing. The housing comprises a first light source and a first end of an end-emitting fibre optic cable. The display unit comprises a second end of the fibre optic cable. The housing includes manual switching means configurable to allow light from the first light source to pass into the first end of the optical fibre cable and further configurable to prevent light from the first light source from passing into the first end of the optical fibre cable.

An optical module according to the present invention includes: an optical device including an optical waveguide chip; an optical fiber block bonded to and arranged on an end face of the optical waveguide chip; an optical fiber that has one end optically connected to the optical waveguide chip via the optical fiber block; an optical fiber holding mechanism for holding the other end of the optical fiber; and an optical fiber carrier. The optical fiber is arranged while being curved from the optical fiber carrier toward the optical fiber block in a U-shape, and a wall structure is formed on the surface of the carrier while being adjacent to the optical fiber at, for example, a position on the outer side of the U-shaped curve of the optical fiber position at which the wall structure reduces a normal force of the optical fiber.

There is provided an optical fiber array that can be easily optically connected to cores of optical waveguides on a connection counterpart substrate without requiring a complicated fabrication process to the connection counterpart substrate and laborious diffusing fusion of the cores. In an array, coating-removed exposed portions of fibers are attached to grooves that are provided on a lower substrate in order to position the optical fibers. Further, the exposed portions are pressed by a lid. Coated portions of the fibers are placed on a flat surface of a concave portion that is provided on the substrate to form a step with the grooves in a state where the exposed portions are attached. Front end parts of the exposed portions of the fibers each have a light collecting portion that collects light beams passing through an inside of the corresponding fiber to reduce an MFD. The light collecting portions are lens-shaped portions that are formed by cutting and are used for optical alignment with the cores of the optical waveguides.

A connection structure of optical waveguide chips includes a base substrate (2003) in which grooves (2013) are formed, spacer optical fibers (2006) each disposed for a corresponding one of the grooves (2013) and fitted in the groove (2013) while partially projecting from the base substrate (2003), and silica-based PLCs (2001, 2002) that are a plurality of optical waveguide chips in each of which grooves (2007) fitted on the projecting portions of the spacer optical fibers (2006) are formed at positions of an optical waveguide layer (2008) facing the grooves (2013), and each of which is mounted on the base substrate (2003) while being supported by the spacer optical fibers (2006). The silica-based PLCs (2001, 2002) are mounted on the base substrate (2003) such that incident/exit end faces of the optical waveguide layers (2008) face each other.

A connection structure of optical waveguide chips includes a base substrate (2003) in which grooves (2013) are formed, spacer optical fibers (2006) each disposed for a corresponding one of the grooves (2013) and fitted in the groove (2013) while partially projecting from the base substrate (2003), and silica-based PLCs (2001, 2002) that are a plurality of optical waveguide chips in each of which grooves (2007) fitted on the projecting portions of the spacer optical fibers (2006) are formed at positions of an optical waveguide layer (2008) facing the grooves (2013), and each of which is mounted on the base substrate (2003) while being supported by the spacer optical fibers (2006). The silica-based PLCs (2001, 2002) are mounted on the base substrate (2003) such that incident/exit end faces of the optical waveguide layers (2008) face each other.