An imaging lens module has an optical axis, an object side and an image side. The imaging lens module includes a plastic barrel, an optical lens assembly, an image-side assembled element and a light blocking element assembly. The plastic barrel includes a first contacting surface, which is close to an image-side end of the plastic barrel. The image-side assembled element is disposed close to the image-side end of the plastic barrel. The image-side assembled element is in a tube shape and extends from the object side to the image side. The image-side assembled element includes a second contacting surface and an inner protruding portion, and the second contacting surface is disposed close to an object-side end of the image-side assembled element and correspondingly to the first contacting surface. The plastic barrel and the image-side assembled element contact each other via the first contacting surface and the second contacting surface.

A bonded structure (14) includes a first member (15), a second member (16), and an adhesive body (17). The second member (16) includes a support (18). The support (18) includes a facing surface and a side surface. The facing surface faces the first member (15). The side surface is inclined outward as viewed from the first member side. The adhesive body (17) is located between the first member (15) and the second member (16). The adhesive body (17) extends from the facing surface to the side surface. The adhesive body (17) has a fillet shape at an end thereof by the side surface. The adhesive body (17) fixes the first member (15) to the second member (16).

The present disclosure relates to a sensor package, a method of manufacturing the same, and an imaging device that can achieve downsizing and height reduction and suppress occurrence of a flare. A sensor package includes: a solid-state imaging element that generates a pixel signal by photoelectric conversion in accordance with a light amount of incident light; a circuit board electrically connected to the solid-state imaging element; a sensor package substrate that is arranged on an incident light side of the solid-state imaging element and brings the solid-state imaging element into a sealed state; and a lens formed on a lower surface of the sensor package substrate, the lower surface being located on a side of the solid-state imaging element. The present disclosure can be applied to, for example, the imaging device or the like.

Method of assembling an optical device in which a circuit board is provided supporting an imager, and a support is provided for supporting the circuit board. A first adhesive layer is applied to a mating region of at least one of the circuit board and the support. The circuit board is fixed to the support using at least one fastener. The first adhesive layer is compressed between the mating regions once the circuit board is fastened. The first adhesive layer is then cured for forming a stabilised imager assembly. A lens is then fixed to the stabilised imager assembly using a second adhesive layer, where fixing includes positioning the lens on the support to align its focal plane with the imager and then curing the second adhesive layer.

A cemented lens may include a first lens and a second lens connected via an adhesive layer. The first lens may include a convex surface facing toward the second lens, and a first flange surrounding an outer circumference of the convex surface. The second lens may include a concave surface connected to the convex surface, and a second flange surrounding an outer circumference of the concave surface. One of the first and second flange may include a projection protruding toward an other of the first and second flange. The other of the first and second flange may include an opposed portion opposed to a side surface of the projection Ga is a distance between the convex surface and the concave surface, and Gb is a distance between the side surface and the opposed portion, and the following expression: Gb<Ga may be satisfied.

A multi-group lens assembly (10), a camera module (100), and an electronic device (200) therefore are provided. The multi-group lens assembly (10) includes at least two group units (11 and 12). At least a first gap (15) is provided between the at least two adjacent group units (11 and 12) to compensate a difference between the multi-group lens assembly (10) and an optical design system, thus allowing an optical system of the multi-group lens assembly conform to the optical design system of the present invention.

An optical system can include a receiver secured to a first optical component and a flexure arrangement secured to a second optical component. The flexure arrangement can include a plurality of flexures, each with a free end that can extend away from the second optical component and into a corresponding cavity of the receiver. Each of the cavities can be sized to receive adhesive that secures the corresponding flexure within the cavity when the adhesive has hardened, and to permit adjustment of the corresponding flexure within the cavity, before the adhesive has hardened, to adjust an alignment of the first and second optical components relative to multiple degrees of freedom.

A lens module of reduced size includes a circuit board, a mounting base, and electronic components. The mounting base is disposed on the circuit board, and includes a base plate and a first flange surrounding edges of the base plate. A portion of the bottom surface of the base plate includes a first area, a second area, a third area, and a fourth area. The first flange includes a first flange portion disposed on the first area and a second flange portion disposed on the second area. The electronic components are disposed on the circuit board, and disposed under at least one of the third area and the fourth area.

An easy-to-assemble endoscope lens unit installed at a head tube of an insertion tube within an endoscope. The components of the endoscopic lens unit include a base having two extended holes, with each hole having an axis. The axes of the two extended holes being substantially parallel to one another, and each extended hole having an axis length that is greater than its radius length. The endoscopic lens unit further includes a camera lens, accommodated in one of the extended holes, with a front portion of the camera lens exposed at the base. Additionally, a projection lens is accommodated in the other extended hole, with the front portion of the projection lens also exposed at the base. The projection lens is used to project a projectile and display a predetermined pattern onto the projectile. An adhesive is applied to the base and at least one of the camera and projection lenses.

The present embodiment relates to a camera module comprising: a bobbin, which has a through-hole formed therein; a lens module, which is accommodated in the through-hole and is coupled to the bobbin; a protrusion formed to protrude from the outer peripheral surface of the lens module; and a recess formed to be recessed from the inner peripheral surface of the bobbin so as to accommodate at least a part of the protrusion, wherein the recess comprises a first guide portion, which extends downwards from the upper end of the bobbin, and a second guide portion, which extends so as to slope from the first guide portion.