Patent classifications
G02B7/181
OPTICAL WAVELENGTH CONVERSION DEVICE
Provided is an optical wavelength conversion device in which heat of an optical wavelength conversion member can be dissipated efficiently while the joint strength between the optical wavelength conversion member and a heat dissipation member is maintained. In the present disclosure, the optical wavelength conversion device includes an optical wavelength conversion member configured to convert the wavelength of incident light; a heat dissipation member which is more excellent in heat dissipation than the optical wavelength conversion member; and a joint portion which joins the optical wavelength conversion member and the heat dissipation member together. The optical wavelength conversion member includes a plate-shaped ceramic fluorescent body and a reflecting film disposed on a heat dissipation member-side surface of the ceramic fluorescent body. The joint portion has a thermal conductivity of 120 W/mK or more. The joint portion has a melting point of 240 C. or higher.
A Kinematic Optical Mount with Stabilizing Locking Clamp
A stabilizing locking clamp for a kinematic optical mount includes a clamp plate configured for optical access and a plurality of clamp actuators affixed to the clamp plate. The clamp actuators are positioned such that each clamp actuator exerts a force on a front plate of the kinematic optical mount in a push-push configuration. A stabilizing kinematic optical mount includes a kinematic optical mount and a plurality of clamp arms, each clamp arm including a clamp actuator positioned to exert a force on a front plate of the kinematic optical mount in a push-push configuration. The stabilizing locking clamp and stabilizing kinematic optical mount reduce temperature-dependent and vibration-induced changes in pitch and yaw, thereby improving pointing stability for optical setups that rely on critical beam alignment.
MIRROR HOLDING STRUCTURE, MIRROR STRUCTURE, IMAGE DISPLAY SYSTEM AND MOVABLE OBJECT
A mirror holding structure includes: a holder; at least one protrusion part provided to one of a mirror body and the holder; at least one reception part provided to the other of the mirror body and the holder and having an insertion hole in which the at least one protrusion part is to be inserted; and at least one elastic part located between an outer peripheral surface of the at least one protrusion part and an inner peripheral surface of the insertion hole and being elastic.
Multi-material mirror system
A mirror system is disclosed. The mirror system can include a primary mirror, and a secondary mirror supported relative to the primary mirror. The primary mirror and the secondary mirror can have different coefficients of thermal expansion (CTE). A negative CTE strut is also disclosed. The negative CTE strut can include a main body portion. The negative CTE strut can also include a first coupling portion and a second coupling portion disposed opposite one another about the main body portion and defining a strut length. The first and second coupling portions can each be configured to interface with an external structure. In addition, the negative CTE strut can include an offsetting extension member having a first end coupled to the main body portion and a second end coupled to the first coupling portion by an intermediate extension member. The first end can be between the first coupling portion and the second end. The first and second ends can define an offset length parallel to the strut length. When the negative CTE strut increases in temperature, the offset length can be configured to increase due to thermal expansion of the offsetting extension member sufficient to cause the strut length to decrease.
Isothermalized mirror assembly
An isothermalized mirror assembly is a mirror structure that uses a heat pipe to isothermalize heat loads. The isothermalized mirror assembly includes at least one mirror unit and a quantity of thermally-convective fluid. The mirror unit includes a vacuum enclosure, a capillary medium, at least one reflector, and a plurality of cross supports. The vacuum enclosure is the structural base of the isothermalized mirror assembly and is used to retain a vacuum and the thermally-convective fluid. The cross supports are mounted within the vacuum enclosure and increases the structural integrity of the vacuum enclosure. The capillary medium is mounted across the interior of the vacuum enclosure and about each cross support. The capillary medium and the thermally-convective fluid work in conjunction to form a heat pipe within the vacuum enclosure. The reflector is externally mounted to the vacuum enclosure in order to redirect EM radiation.
Space Optical System with Integrated Sensor Mounts
A space optical system is disclosed. The space optical system can include a primary support structure in support of a primary mirror. The space optical system can also include a sensor mounting structure coupled to the primary support structure and extending to an exterior of space optical system. The space optical system can further include first and second sensors mounted on the sensor mounting structure. In one aspect, the sensor mounting structure can comprise a thermally and mechanically stable, non-zero CTE material.
All-reflective solar coronagraph sensor and thermal control subsystem
An coronagraph optical system and method for continuously imaging a wide field of view that includes the Sun. Examples of the coronagraph optical system include an all-reflective foreoptics assembly that receives light rays from a viewed scene and a direct solar image of the Sun, a sensor assembly configured to produce an image of the viewed scene, an all-reflective relay optics assembly configured to receive the light rays from the foreoptics assembly and to reflect the light rays to the sensor assembly, and a solar rejection optical component positioned between the foreoptics assembly and the relay optics assembly and dynamically configurable such that the direct solar image of the Sun is reflected away from the relay optics assembly and the light rays are reflected to the relay optics assembly while an entrance aperture of the foreoptics assembly is continuously positioned towards the Sun.
TELESCOPE HAVING IMPROVED PERFORMANCE
A telescope including a fastener plate, a primary mirror carried by a front face of the plate, and a secondary mirror held facing the primary mirror by a support, wherein the support includes a primary sleeve mounted around the primary mirror, a secondary sleeve mounted around the secondary mirror, and arms connecting the secondary sleeve to the primary sleeve, and in that the arms are curved towards the primary mirror.
Isothermalized Mirror Assembly
An isothermalized mirror assembly is a mirror structure that uses a heat pipe to isothermalize heat loads. The isothermalized mirror assembly includes at least one mirror unit and a quantity of thermally-convective fluid. The mirror unit includes a vacuum enclosure, a capillary medium, at least one reflector, and a plurality of cross supports. The vacuum enclosure is the structural base of the isothermalized mirror assembly and is used to retain a vacuum and the thermally-convective fluid. The cross supports are mounted within the vacuum enclosure and increases the structural integrity of the vacuum enclosure. The capillary medium is mounted across the interior of the vacuum enclosure and about each cross support. The capillary medium and the thermally-convective fluid work in conjunction to form a heat pipe within the vacuum enclosure. The reflector is externally mounted to the vacuum enclosure in order to redirect EM radiation.
DMD assembly and DLP projection device
The DMD assembly in present disclosure includes a base mounted on a first side of a driver board; a chip substrate; a DMD chip mounted on the chip substrate; and a fixing frame fixed with driver board on the first side; a second side of the base includes a mounting groove configured to mount the chip substrate; the fixing frame includes an insertion hole, and the base is received in the insertion hole; an elastic protrusion is positioned beside the inserting hole, and the elastic protrusion comprises a fixing portion and a pressing portion, the fixing portion is connected to the fixing frame on a side of the fixing frame facing away from the driver board, the pressing portion is positioned on the fixing portion; a surface of the pressing portion facing the chip substrate contacts the chip substrate to clamp the chip substrate against the base.