An imaging lens for use with an operational waveband over any subset of 7.5-13.5 μm may include a first optical element of a first high-index material and a second optical element of a second high-index material, that may have a refractive index greater than 2.2 in the operational waveband, an absorption per mm of less than 75% in the operational waveband, and an absorption per mm of greater than 75% in a visible waveband of 400-650 nm. Optically powered surfaces of the imaging lens may include a sag across their respective clear apertures that are less than 10% of a largest clear aperture of the imaging lens. Respective maximum peak to peak thicknesses of the first and second optical elements may be similar in size, for example within 15 percent of each other. Ratios of maximum peak to peak thickness to clear aperture and, separately, to sag are also provided.

An optical image capturing system includes, along the optical axis in order from an object side to an image side, a first lens, a second lens, a third lens, a fourth lens, and a fifth lens. At least one lens among the first to the fifth lenses has positive refractive power. The fifth lens can have negative refractive power, wherein both surfaces thereof are aspheric, and at least one surface thereof has an inflection point. The lenses in the optical image capturing system which have refractive power include the first to the fifth lenses. The optical image capturing system can increase aperture value and improve the imaging quality for use in compact cameras.

Techniques for facilitating wide field of view (FOV) imaging systems and methods are provided. In one example, an imaging device includes a lens system including a first lens group and a second lens group. The first lens group includes at least one spherical lens element and is associated with a first FOV. The first lens group is configured to transmit electromagnetic radiation associated with a scene. The second lens group includes wafer level optics aspherical lens elements and is associated with a second FOV narrower than the first FOV. The second lens group is configured to transmit the electromagnetic radiation received from the first lens group. The imaging device further includes a detector array including detectors. Each detector is configured to receive a portion of the electromagnetic radiation from the lens system and generate a thermal image based on the electromagnetic radiation. Related methods and systems are also provided.

An optical imaging system includes a first lens, as second lens, a third lens, a fourth lens, and a fifth lens. The first lens includes a positive refractive power and a convex image-side surface. The second lens includes a positive refractive power, and the third lens includes a negative refractive power. The fourth lens includes a positive refractive power, and the fifth lens includes a positive refractive power. The first to fifth lenses are sequentially disposed from an object side toward an imaging plane.

A production method includes fixing ball elements of a semiconductor material to a carrier substrate by means of heat and pressure; and one-sided thinning of the ball elements fixed to the carrier substrate to form plano-convex lens elements of a semiconductor material.

The disclosure discloses a large-aperture infrared metalens camera, which belongs to the technical field of infrared imaging and micro-nano photonics, including a large-aperture metalens, an infrared focal plane array detector, a metalens mechanical assembly and a housing. The large-aperture metalens has an aperture greater than 50 mm and a thickness less than 2 mm, and the distance between the large-aperture metalens and the infrared focal plane array detector is greater than 30 mm. The disclosure adopts strict electromagnetic field values, diffraction design algorithm and large-area semiconductor process manufacturing method to increase the aperture of metalens to 50 mm or more, and considerably improves the focal length and magnification of the camera while ensuring that the F-number of the metalens meets the requirements of signal-to-noise ratio of image. The problems of short focal length, small magnification, and insufficient imaging range of conventional metalens cameras are overcome.

Provided are an optical lens assembly and an electronic apparatus. The optical lens assembly includes a first lens having a positive refractive power, a second lens having a negative refractive power, a third lens having a positive refractive power, a fourth lens having a refractive power, and a moving lens group movable to be inserted in or removed from between the third lens and the fourth lens, wherein the first, second, third, and fourth lenses and the moving lens group are sequentially arranged from an object side to an image side. The moving lens group is moved between the third lens and the fourth lens for infrared (IR) photography.

The present invention achieves an infrared imaging lens which is excellent in performance capability such as aberration despite its wide angle of view and which is adaptable to a far infrared region.

An infrared imaging lens (1) includes: a first lens (L1) having negative refractive power; a second lens (L2) which is a meniscus that is convex to an image surface side; and an image surface side lens group (G) having positive refractive power, the first lens, the second lens, and the image surface side lens group being disposed in this order from an object side to the image surface side, the first lens and the second lens each being made of glass having a refractive index of not less than 2.8 measured at a wavelength of 10 μm, and the infrared imaging lens having a half angle of view of not less than 60°.

An optical imaging system includes a first lens having a positive refractive power and a concave object-side surface, a second lens having a positive refractive power, a third lens having a negative refractive power, a fourth lens having a positive refractive power, and a fifth lens having a positive refractive power and a concave image-side surface. The first through fifth lenses are sequentially disposed in ascending numerical order from an object side of the optical imaging system toward an imaging plane of the optical imaging system.

Systems and methods according to one or more embodiments are provided for annealing a chalcogenide lens at an elevated temperature to accelerate release of internal stress within the chalcogenide lens caused during a molding process that formed the chalcogenide lens. In particular, the annealing process includes gradually heating the chalcogenide lens to a dwell temperature, maintaining the chalcogenide lens at the dwell temperature for a predetermined period of time, and gradually cooling the chalcogenide lens from the dwell temperature. The annealing process stabilizes the shape, the effective focal length, and/or the modulation transfer function of the chalcogenide lens. Associated optical assemblies and infrared imaging devices are also described.