An optical apparatus includes plural optical lens groups, an optical sensor and a casing. After a light beam passes through any of the plural optical lens groups, a travelling direction of the light beam is changed. Moreover, after the light beam passes through at least one of the plural optical lens groups, the light beam is sensed by the optical sensor and converted into an image signal by the optical sensor. The plural optical lens groups and the optical sensor are accommodated and fixed within the casing. The optical apparatus has a single optical lens module, and is able to implement different optical function simultaneously. Consequently, the overall volume of the optical apparatus is minimized, and the fabricating cost of the optical apparatus is reduced.

An image acquisition device includes an imager including a light receiver, a light shield, a light condenser, and a light emitter. The light shield includes a light transmitting substrate, a light shielding layer, and an opening in the light shielding layer. A light transmitting layer having a refractive index smaller than that of the substrate is between the light condenser and the light shield. When a diameter of a light receiving surface of the light reception element is d, a diameter of the opening is a, a pitch of the light reception elements is p, a refractive index of the light transmitting layer is n1, a refractive index of the substrate is n2, and a distance between the light reception element and the light shielding layer is h, Arctan((p-a/2-d/2)/h)≧Arcsin(n1/n2).

A camera module includes a circuit board; an image sensor mounted on the circuit board and electrically connected with the circuit boards, the image sensor comprising an array of focal planes; a barrel mounted on the circuit board with a cavity formed between the barrel and the circuit board, the image sensor being received in the cavity; and a lens stack array mounted to the barrel and spaced from the image sensor, the lens stack array comprising a plurality of first lens stacks, second lens stacks, third lens stacks, each of the lens stacks corresponding to one of the focal planes. The first lens stacks, the second lens stacks and the third lens stacks have different field of view and are combined in a single camera module, which enables a compact solution in a form of single camera module that traditionally requires multiple camera modules.

A five-surface wide field-of view compound lens incudes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a first biplanar substrate, and a second biplanar substrate. The first lens is plano-concave; the second, the third lens, and the fourth lens are plano-convex; the fifth lens is a plano-gull-wing lens. The first biplanar substrate is between the second lens and the third lens. The second biplanar substrate is between the fourth lens and the fifth lens. The first lens has a first Abbe number. The second lens has a second Abbe number less than the first Abbe number. A camera module includes the five-surface wide FOV compound lens and a glass substrate having a planar surface adjoining a first planar surface of the first lens, the first lens being between the glass substrate and the second lens.

The present disclosure provides a lens. The lens includes at least two layers of glass wafers, each glass wafer is provided with a lens array including a plurality of lens units, glue is provided around a periphery of each of the lens unit, the lens units of two adjacent layers of glass wafers are correspondingly arranged one to one, and are adhered via the glue, the glass wafer is further provided with an air hole. In the lens provided by the present disclosure, through providing an air hole on the glass wafer of the lens, so that when two adjacent glass wafers are stacked via the glue, air in the sealed space can be exhausted through the air hole, and through filling glue in the air hole of the outermost layer of glass wafer, the sealing effect is achieved, which can avoid packaging defects, and improve product yield.

An optical power prism that may be used in folded lens systems that consists of a glass prism and a glass lens attached to a surface of the prism using a thin layer of optical glue or by optical contact. The glass lens does not have a flange and thus the prism can be smaller than prisms used in conventional power prisms with the same lens effective area, thus reducing the Z-height of the power prism when compared to conventional power prisms. An optical glass may be used for the lens that has a higher refractive index than can be provided by optical plastic which allows the lens to be thinner than plastic lenses. The lenses may be formed by molding a glass wafer to form lens shapes on a first surface of the wafer; the molded wafer is then ground from a second surface to singulate the lenses.

A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.

An ultra-small camera module with wide field of view includes (a) a wafer-level lens system for forming, on an image plane, an image of a wide field-of-view scene, wherein the wafer-level lens system includes (i) a distal planar surface positioned closest to the scene and no more than 2.5 millimeters away from the image plane in direction along optical axis of the wafer-level lens system, and (ii) a plurality of lens elements optically coupled in series along the optical axis, each of the lens elements having a curved surface, and (b) an image sensor mechanically coupled to the wafer-level lens system and including a rectangular array of photosensitive pixels, positioned at the image plane, for capturing the image, wherein cross section of the ultra-small camera module, orthogonal to the optical axis, is rectangular with side lengths no greater than 1.5 millimeters.

A lens plate includes a transparent substrate wafer, and a plurality of lenses and spacers that are formed of a single portion of material on the transparent substrate wafer. An assembly includes a first lens plate that includes a first transparent substrate wafer, a plurality of first lenses and a plurality of spacers, the first lenses and spacers being formed of a single portion of material on said first transparent substrate wafer. The assembly also includes a second lens plate that includes a second transparent substrate wafer and a plurality of second lenses formed thereon, each of the plurality of second lenses corresponding to a respective one of the plurality of first lenses. The lens plates are aligned such that each of the plurality of first lenses aligns with the respective one of the plurality of second lenses, and the lens plates are bonded to one another.

Wafer-level optical elements and the concave spacer-wafer apertures in which they are formed are disclosed. The wafer-level optical elements include a spacer wafer comprising a plurality of apertures. Each aperture has a concave shape in a planar cross-section of the spacer wafer and an overflow region intersecting the planar cross-section. The wafer-level optical elements also include an array of optical elements, each optical element of the array being formed of cured flowable material within a respective one of the plurality of apertures. A portion of the cured flowable material forming each optical element extends into the overflow region of the respective aperture of the plurality of apertures. The spacer wafer includes a plurality of apertures, each of the plurality of apertures having a concave shape in a planar cross-section of the spacer wafer. Each of the plurality of apertures includes an overflow region intersecting the planar cross-section.