In an embodiment, a slim imager is disclosed. The slim imager includes a substrate including an aperture, an image sensor, and an optics unit. The image sensor is on a bottom side of the substrate, spans the aperture, and has an aperture-facing top surface. The optics unit is on a top side of the substrate, spans the aperture, and includes a transmissive optical element having an aperture-facing bottom surface. A volume partially bound by the aperture-facing top surface and the aperture-facing bottom surface has a refractive index less than 1.01 at visible wavelengths.

An optical system may include a lens assembly that has two or more single-sided wafer level optics (WLO) lenses arranged to propagate light. The optical system can further include an image sensor, wherein the lens assembly is arranged relative to the image sensor to propagate light received at a first surface of the lens assembly, through the two or more single-sided WLO lenses and to the image sensor. In some embodiments, the optical system further includes a camera which includes the lens assembly and the image sensor. In various embodiments, a smart phone, a tablet computer, or another mobile computing device may include such a camera. In some embodiments, the at least two single-sided wafer level optics (WLO) lenses are each separated by a gap G, wherein the gap may be different between each of the single-sided lenses, and the gap G may be zero.

An optical element including a substrate, a first optical film and a second optical film. The first optical film and the second optical film are disposed on at least one side of the substrate and are both formed on the substrate. The first optical film has a first surface facing away from the substrate and a plurality of first optical microstructures disposed on the first surface. The second optical film has a second surface facing away from the substrate and a plurality of second optical microstructures disposed on the second surface. The orthogonal projection of the first optical microstructures on the substrate does not overlap the orthogonal projection of the second optical microstructures on the substrate. A wafer level optical module adopting the optical element is also provided.

The imaging device includes a multiple-property lens that includes a first area having a first property and a second area having a second property different from the first property, an image sensor in which a first light receiving element 25A and a second light receiving element 25B having a different opening size of a light receiving section from the first light receiving element 25A are two-dimensionally arranged, and a crosstalk removal processing unit that removes a crosstalk component from each of a first crosstalk image acquired from the first light receiving element 25A of the image sensor and a second crosstalk image acquired from the second light receiving element to generate a first image and a second image respectively having the first property and the second property of the multiple-property lens.

An optical zoom in a small form factor suitable for use in mobile devices such as cell phones, security cameras, and other small-scale imaging systems. One or more Alvarez lens pairs are provided, and moved transversely to the optical axis. The combination of one or more Alvarez lens pairs and the actuator permits a zoom power of at least 3× with a lateral displacement distance of the optical components of approximately five millimeters or less.

Device and method for producing a plurality of microlenses from a lens material. The method includes: applying lens material intended for the embossing of the microlenses to a plurality of first lens molds distributed on a first embossing side of a first die for embossing of the microlenses, moving the first die and a second die located essentially parallel, in an X-Y plane, and opposite the first die, on top of one another in a Z-direction running essentially perpendicular to the X-Y plane, embossing the microlenses by shaping and curing the lens material, the shaping taking place by moving the first and second embossing sides on top of one another, up to a thickness D.sub.1 of the lens material in the Z-direction, wherein the lens material of each microlens at least during curing is separate from the lens material of each microlens which is adjacent in the X-Y plane.

An optical apparatus includes plural optical lens groups, an optical sensor, at least one lighting member and a casing. After a light beam passes through any of the plural optical lens groups, a travelling direction of the light beam is changed. After the light beam passes through at least one of the plural optical lens groups, the light beam is sensed and converted into an image signal by the optical sensor. The lighting member outputs a source beam. The plural optical lens groups, the optical sensor and the lighting member are accommodated within the casing. The optical apparatus has a single optical lens module, and is able to implement different optical functions simultaneously. Consequently, the overall volume of the optical apparatus is minimized, the fabricating cost of the optical apparatus is reduced, the assembling process is simplified, and the number of components to be assembled is reduced.

An optical imaging lens assembly that may have five lens components. The first, third, and fourth lens components may have positive refractive power. The second and fifth lens components may have negative refractive power. The third lens component may have convex object-side and convex image-side refractive surfaces. The fourth lens component may have convex object-side and concave image-side refractive surfaces. The first lens component may include a wafer lens having a lens element molded on one or both surfaces of a planar substrate or two wafer lenses having a lens element molded on one surface of each of two planar substrates. The wafer lens may include an electrically controlled electrochromic surface having variable light transmittance in response to an applied electrical voltage. The refracting surfaces may be aspheric.

The present disclosure pertains to a wafer level lens stack, which has a substrate, a first, a second lens and an actuator. The substrate has a first side and a second side. The second side is opposite to the first side. The first lens is on the first side of the substrate. The second lens is on the second side of the substrate and the second lens can change its refraction characteristic. The actuator can change the refraction characteristic of the second lens.

The invention relates to an autofocus camera (1) comprising:—an image sensor (10),—an optical block (20) comprising a plurality of lenses with fixed focal length,—an optical device (30) with variable focal length comprising:•a deformable membrane (301),•a support (302) to which a peripheral anchoring area (301c) of said membrane is connected,•a cavity (303) filled with a constant volume of fluid, said cavity being delimited at least in part by said membrane (301) and a support wall (302),•an actuation device (304) of a region (301b) of the membrane located between the peripheral anchoring area (301c) and a central part (301a) of the membrane, configured to bend by application of electrical actuation voltage so as to displace some of the fluid volume towards the centre or towards the periphery of the cavity (303), wherein at least one region distinct from the central part (301a) and of the actuation region (301b) of the membrane is stressed mechanically permanently so as to cause permanent deformation of the central part of the membrane by the fluid, the focal distance of the optical device (30) at rest under the effect of said mechanical stress being different from the focal distance of said optical device at rest prior to application of said stress.