In one example, an apparatus comprises: a lens assembly comprising one or more polymer layers, each layer including a lens portion and an extension portion and an image sensor positioned below the lens assembly and bonded to the lens assembly via a bonding layer and configured to sense light that passes through the lens portion of the one or more polymer layers.

A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.

In one example, an apparatus comprises: a lens assembly comprising one or more polymer layers, each layer including a lens portion and an extension portion and an image sensor positioned below the lens assembly and bonded to the lens assembly via a bonding layer and configured to sense light that passes through the lens portion of the one or more polymer layers.

In one example, a display includes an array of display pixels. Each display pixel includes at least one light-emitting diode. At least one of the display pixels includes an image sensor.

Provided is a camera module including: a laminated lens structure in which substrates with lenses, each of which has a lens disposed inside a through-hole formed in the substrate, are bonded by direct bonding and laminated, the laminated lens structure including a plurality of optical units each of which has a plurality of the lenses laminated in an optical axis direction; and at least one of a light absorbing film and a blocking plate provided between the adjacent optical units.

The present disclosure relates to an imaging device capable of achieving miniaturization and height reduction of a device configuration and reducing generation of a flare or a ghost. A light shielding film is formed in a region including a side surface portion of a lens formed on a solid-state imaging element. The present disclosure is applicable to an imaging device.

The present disclosure relates to an imaging device capable of achieving miniaturization and height reduction of a device configuration, reducing generation of a flare or a ghost, and preventing separation of a lens. Side surfaces of a lens provided on a solid-state imaging element form a multistep shape. Angles formed by the side surfaces forming the multistep shape with respect to an incident direction of incident light differ from each other. The present disclosure is applicable to an imaging device.

An endoscope lens unit includes a first optical device which includes a first glass plate including a first side surface, a second optical device which includes a second glass plate including a second side surface having the same external dimension as an external dimension of the first side surface, a spacer which includes a third side surface and which defines a distance between the first glass plate and the second glass plate, and a light shielding resin which covers the first side surface, the second side surface, and the third side surface, at least part of the third side surface being located closer to an optical axis than the first side surface and the second side surface and constituting a bottom of a recess, the first glass plate and the second glass plate defining wall surfaces of the recess, the recess being filled with the light shielding resin.

A fabrication method for stretchable/conformable electronic and optoelectronic circuits and the resulting circuits. The method may utilize a variety of electronic materials including, but not limited to Silicon, GaAs, InSb, PbSe, CdTe, organic semiconductors, metal oxide semiconductors and related alloys or hybrid combinations of the aforementioned materials. While a wide range of fabricated electronic/optoelectronic devices, circuits, and systems could be manufactured using the embodied technology, a hemispherical image sensor is an exemplary advantageous optoelectronic device that is enabled by this technology. Other applications include but are not limited to wearable electronics, flexible devices for the internet-of-things, and advanced imaging systems.

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.