G02B13/143

BEAM IMAGING AND PROFILING DEVICE

Exemplary aspects of the present invention are directed to an imaging sensor system for beams in the 1-200 nm spectral regions. The system may include a downconverter for converting the beam to visible light, optical filter elements, and relay optics for directing the visible light to the imaging detector. The relay optics convey the image and/or optical beam profile intensity to a 2-D imaging array such as CMOS, CCD (or other imaging detector device). The system can be used in a vacuum or in ambient non-vacuum conditions which may include a purged environment.

MICROPARTICLE MEASUREMENT DEVICE, MICROPARTICLE SORTING DEVICE, MICROPARTICLE MEASUREMENT SYSTEM, AND MICROPARTICLE SORTING SYSTEM
20220146403 · 2022-05-12 ·

To provide a microparticle measurement technology capable of supporting excitation light in a wideband wavelength range.

The present technology provides a microparticle measurement device provided with a plurality of objective lenses for excitation light irradiation used for irradiating microparticles flowing through a flow path with excitation light, in which at least one of the objective lenses for excitation light irradiation is used for detecting scattered light emitted from the microparticles by the excitation light with which the microparticles are irradiated through another one of the objective lenses for excitation light irradiation.

Projection exposure method and projection exposure apparatus for microlithography
11181826 · 2021-11-23 · ·

A projection exposure method and apparatus are disclosed for exposing a radiation-sensitive substrate with at least one image of a pattern of a mask under the control of an operating control system of a projection exposure apparatus, part of the pattern lying in an illumination region is imaged onto the image field on the substrate with the aid of a projection lens, wherein all rays of the projection radiation contributing to the image generation in the image field form a projection beam path.

INFRARED BAND PASS FILTER HAVING LAYERS WITH REFRACTION INDEX GREATER THAN 3.5
20230314678 · 2023-10-05 · ·

The present disclosure relates to an infrared band pass filter, which comprises a first multilayer film. The first multilayer film including a plurality of Si:NH layers and a low refraction index layer. The plurality of low refraction index layers are stacked with Si:NH layers alternatively; wherein the difference between the refraction index of Si:NH layer and the refraction index of the low refraction index layer is greater than 0.5. The infrared band pass filter has a pass band in a wavelength range of 800 nm and 1100 nm, and when the incident angle is changed from 0 degrees to 30 degrees, the center wavelength of the pass band is shifted less than 12 nm, and the infrared band pass filter of the present disclosure can be used to enhance the 3D image resolution when applied to a 3D imaging system.

Infrared band pass filter having layers with refraction index greater than 3.5

The present disclosure relates to an infrared band pass filter, which comprises a first multilayer film. The first multilayer film including a plurality of Si:NH layers and a low refraction index layer. The plurality of low refraction index layers are stacked with Si:NH layers alternatively; wherein the difference between the refraction index of Si:NH layer and the refraction index of the low refraction index layer is greater than 0.5. The infrared band pass filter has a pass band in a wavelength range of 800 nm and 1100 nm, and when the incident angle is changed from 0 degrees to 30 degrees, the center wavelength of the pass band is shifted less than 12 nm, and the infrared band pass filter of the present disclosure can be used to enhance the 3D image resolution when applied to a 3D imaging system.

Optical lens system

An optical lens system using ultraviolet for imaging includes, in order from a magnified side to a minified side, a first lens group of positive refractive power and a second lens group of positive refractive power. The second lens group includes at least one cemented lens and at least one aspheric lens. The optical lens system satisfies the condition of TE.sub.(λ=400)>94%, where TE.sub.(λ=400) denotes an overall transmittance of all of the lenses in the optical lens system measured at a wavelength of 400 nm and is equal to a product of respective internal transmittances of all of the lenses measured at a wavelength of 400 nm.

MICROSCOPY WITH ULTRAVIOLET SURFACE EXCITATION (MUSE) IMAGING IMPLEMENTED ON A MOBILE DEVICE
20220283421 · 2022-09-08 ·

A external accessory can allow a mobile device to perform microscopy imaging with Type-C ultraviolet (UVC) light excitation. The external accessory includes a compound lens placed in front of a camera lens of the mobile device. A light transparent optical window configured to be placed in front of the compound lens and positioned such that a front surface of the optical window overlaps the front focal plane of the compound lens. One or more light emitting diode (LED) that emits UVC light positioned at one or more side-edges of the optical window. The one or more LED emits UVC light through the optical window so that the UVC light undergoes total internal reflection. An externally triggered LED driver configured to power and control the LED(s).

METHODS FOR MICROSCOPY WITH ULTRAVIOLET SURFACE EXCITATION (MUSE) IMAGING
20220268701 · 2022-08-25 ·

Described herein are methods for imaging a fluorescent bioassay (including a substrate, such as dispersed cellular sample, exposed to one or more exogenous fluorophore and/or fluorescent probe that accumulate in a structure of interest). The bioassay can be excited with Type-C ultraviolet (UVC) light produced by one or more light emitting diode (LED). The UVC can have a center wavelength that causes emission by the fluorescent bioassay. A digital optical device can collect a signal emitted from the fluorescent bioassay in response to the excitation. The methods relate in particular to Microscopy with Ultraviolet Surface Excitation (MUSE) imaging.

Method for figure control of optical surfaces
11443950 · 2022-09-13 · ·

A method for figuring an optical surface of an optical element to achieve a target profile for the optical surface includes: applying a removal process to an extended region of the optical surface extending along a first direction to remove material from the extended region of the optical surface; adjusting a position of the optical surface relative to the removal process along a second direction perpendicular to the first direction to remove material from additional extended regions of the optical surface extending along the first direction at each of different positions of the optical surface along the second direction; and repeating the applying of the removal process and the adjusting of the optical surface relative to the removal process for each of multiple rotational orientations of the optical surface about a third direction perpendicular to the first and second directions to achieve the target profile of the optical surface.

Projection lens, projection exposure apparatus and projection exposure method
10969694 · 2021-04-06 · ·

A refractive projection lens for imaging a pattern in an object plane of the projection lens into an image plane of the projection lens via electromagnetic radiation of a mercury vapor lamp includes a multiplicity of lens elements are arranged along an optical axis between the object and image planes. The lens elements image a pattern in the object plane into the image plane with a reducing imaging scale. The lens elements include first lens elements made of a first material with a relatively low Abbe number and a second lens elements made of a second material with a higher Abbe number relative to the first material.