Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing found on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.

The invention relates to a method for determining an imaging function of a mask inspection microscope, wherein the mask inspection microscope comprises an imaging optical element, a tube, a recording device, an object stage, an illumination unit for measurement with transmitted light and an illumination unit for measurement in reflection, comprising the following method steps: a) measuring the intensities in the pupil plane of the imaging optical element in a reflective measurement, b) measuring the intensities in the pupil plane of the imaging optical element in a transmitted-light measurement, d) Determining the imaging function of the intensities of the imaging optical element, d) determining the imaging function of the intensities of the illumination optical element comprised in the illumination unit for the transmitted-light measurement. Furthermore, the invention relates to a mask inspection microscope for determining the deviation of an actual structure from a desired structure on an object, comprising an imaging optical element, a tube, a recording device, an additional optical module, an illumination unit for measurement with transmitted light, an illumination unit for measurement in reflection, and an object stage, wherein the object stage is configured to move to a position with a deviation of less than 100 nm, in particular of less than 20 nm, a calculation unit, in which the calculation unit is configured to calibrate the mask inspection microscope.

In the embodiment in association with the present disclosure, an apparatus and method for multilayer thin film thickness measurement using single-shot angle-resolved spectral reflectometry are provided which allow simultaneously obtaining the absolute reflectance and phase data of a measurement object over a broad wavelength range and wide incident angle according to various polarization states by a single-shot measurement.

A method is provided for determining the distance between two optical boundary surfaces spaced apart from each other in a first direction. A first image is ascertained wherein the plane into which the pattern acquired coincides with a first of two optical boundary surfaces or has the smallest distance to the first optical boundary surface in a first direction. A position of the first image in the first direction is determined. A second image is ascertained wherein the plane into which the pattern acquired coincides with a second of two optical boundary surfaces or has the smallest distance to the second optical boundary surface in the first direction. The position of the second image in the first direction is determined. The distance is calculated by means of determined positions of the first and second image.

A method for programming a three-dimensional (3D) workpiece scan path for a metrology system comprising a 3D motion control system, a first type of Z-height sensing system, and a second type of Z-height sensing system that provides less precise surface Z-height measurements over a broader Z-height measuring range. The method comprises: placing a representative workpiece on a stage of the metrology system, defining at least a first workpiece scan path segment for the representative workpiece, determining preliminary actual surface Z-height measurements along the first workpiece scan path segment, and determining a precise 3D scan path for moving the first type of Z-height sensing system to perform precise surface Z-height measurements. The precise 3D scan path is based on the determined preliminary actual surface Z-height measurements. The precise 3D scan path may be used for performing precise surface Z-height measurements or stored to be used in an inspection program.

Disclosed is a metrology device (1600) configured to produce measurement illumination comprising a plurality of illumination beams, each of said illumination beams being spatially incoherent or pseudo-spatially incoherent and comprising multiple pupil points in an illumination pupil of the metrology device. Each pupil point in each one of said plurality of illumination beams has a corresponding pupil point in at least one of the other illumination beams of said plurality of illumination beams thereby defining multiple sets of corresponding pupil points, and the pupil points of each set of corresponding pupil points are spatially coherent with respect to each other.

The object of the invention relates to an objective changing and focussing apparatus (10) for microscopes (100) containing a plurality of objectives (12), and having an optical axis Z, the essence of which is that it contains—a first rail system (16a) having a first guide rail (17a) fixed to the microscope (100) and a first moving member (18a) guided by the first guide rail (17a), wherein the first rail system (16a) is arranged along an axis X perpendicular to the optical axis Z, —a first drive unit (20a) in drive connection with the first rail system (16a), —a plurality of objective interface elements (24), adapted for being connected to the objectives (12), arranged next to one another along the X axis and fixed to the first moving member (18a) movably along the Z axis, —a second rail system (16b) having a second guide rail (17b) fixed to the microscope (100) and a second moving member (18b) guided by the second guide rail (17b), wherein the second rail system (16b) is arranged parallel to the optical axis Z, and defines a starting position along the X axis, and—a second drive unit (20b) having a second drive connection with the second rail system (16b), and the second moving member (18b) is provided with a lifting element (26) providing a releasable connection with an objective interface (24) located in the starting position. The object of the invention also relates to a microscope containing such an objective changing and focusing apparatus (10).

A portable inspection probe for the inspection of a recessed mating surface of an optical fiber connector is provided. In one variant, the portable inspection probe includes a digital holographic detection module operable to digitally record a hologram of the recessed mating surface, and a rigid probe tip configured to be optically coupled to the digital holographic detection module and shaped to provide optical access to the recessed mating surface. In another variant, the portable inspection probe is to be used with a rigid probe tip connectable thereto, and the digital holographic detection module includes a probing optical assembly not traversed by a reference beam and configured to direct an object beam onto the recessed mating surface and to collect the object beam upon reflection thereof by the recessed mating surface. An inspection system and an inspection method are also provided.

A variable focal length (VFL) lens system is utilized to determine surface Z-height measurements of imaged surfaces. A controller of the system is configured to control a VFL lens (e.g., a tunable acoustic gradient index of refraction lens) to periodically modulate its optical power and thereby periodically modulate a focus position at a first operating frequency, wherein the periodically modulated VFL lens optical power defines a first periodic modulation phase. A phase timing signal is synchronized with a periodic signal in the controller that has the first operating frequency and that has a second periodic modulation phase that has a phase offset relative to the first periodic modulation phase. A phase offset compensating portion is configured to perform a phase offset compensating process that provides Z-height measurements, wherein at least one of Z-height errors or Z-height variations that are related to a phase offset contribution are at least partially eliminated.

There is provided an adapter tip to be employed with an optical-fiber connector endface inspection microscope and an optical-fiber connector endface inspection microscope system suitable for imaging the optical-fiber endface of an angled-polished optical-fiber connector deeply recessed within a connector adapter. The adapter tip or microscope system comprises a relay optical system comprising a Rhomboid prism. The Rhomboid prism being disposed so as to receive light reflected from said optical-fiber endface during inspection and laterally shift the light beam reflected from the angled-polished optical-fiber endface.