An electro-optic device, such as an optical modulator, comprises: a driver for generating a plurality of identical time-synchronized copies of an input electrical signal, and a photonic integrated circuit, including an optical waveguide structure and a plurality of phase-modulating electro-optical modulator segments. Each one of the modulator segments configured to receive a respective one of the plurality of the copies of the input electrical signal. Instead of incorporating a required phase delay between the copies of the input electrical signal into the driver structure, a multi-layer interconnect substrate is provided that includes a plurality of insulating layers alternating with a plurality of conductive layers. The plurality of conductive layers are configured to include a plurality of delay lines, each one of the plurality of delay lines electrically coupled in between the driver and the photonic integrated circuit configured to transmit a respective one of the plurality of copies of the first input electrical signal.

A method includes: producing a light beam made up of pulses having a wavelength in the deep ultraviolet range, each pulse having a first temporal coherence defined by a first temporal coherence length and each pulse being defined by a pulse duration; for one or more pulses, modulating the optical phase over the pulse duration of the pulse to produce a modified pulse having a second temporal coherence defined by a second temporal coherence length that is less than the first temporal coherence length of the pulse; forming a light beam of pulses at least from the modified pulses; and directing the formed light beam of pulses toward a substrate within a lithography exposure apparatus.

Optical modulators with semiconductor based optical waveguides interacting with an RF waveguide in a traveling wave structure. The semiconductor optical waveguide generally comprise a p-n junction along the waveguide. To reduce the phase walk-off between the optical signal and the RF signal, the traveling wave structure can comprise one or more compensation sections where the phase walk-off is reversed. The compensation sections can comprise a change in dopant concentrations, extra length for the optical waveguide and/or extra length for the RF waveguide. Corresponding methods are described.

Apparatus include a photoelastic modulator (PEM) optical element, a controller having a frequency generator configured to produce a frequency signal at a selected frequency based on a clock signal of the controller wherein the controller is configured to produce a PEM driving signal based on the frequency signal, a PEM transducer coupled to the PEM optical element and the controller and configured to drive the PEM with the PEM driving signal, and a detector optically coupled to the PEM optical element and configured to receive a PEM modulated output and to produce a PEM detection signal that includes a PEM modulation signal, wherein the controller is configured to receive the PEM detection signal and to extract the PEM modulation signal from the PEM detection signal using the frequency signal and the clock signal.

An integrated circuit interposer includes a semiconductor substrate layer; a first metal contact layer including a first metal contact section that includes metal contacts arranged for electrically coupling to a first semiconductor die in a controlled collapsed chip connection, and a second metal contact section that includes metal contacts arranged for electrically coupling to a second semiconductor die in a controlled collapsed chip connection. A first patterned layer includes individually photomask patterned metal path sections. A second patterned layer includes individually photomask patterned waveguide sections, including a first waveguide that crosses at least one boundary between individually photomask patterned waveguide sections. A first modulator is coupled to the first waveguide for modulating an optical wave in the first waveguide based on an electrical signal received at a first metal contact in the first metal contact section, and a second modulator is coupled to the first waveguide for modulating the optical wave based on an electrical signal received at a second metal contact in the first metal contact section or the second metal contact section.

Systems and methods are provided for an integrated chip. An integrated chip includes a package substrate including a plurality of first layers and a plurality of second layers, each second layer being disposed between a respective adjacent pair of the first layers. A transceiver unit is disposed above the package substrate. A waveguide unit including a plurality of waveguides having top and bottom walls formed in the first layers of the package substrate and sidewalls formed in the second layers of the package substrate.

An optical modulator includes: an optical waveguide element including an optical waveguide formed on a substrate and a signal electrode for controlling a light wave propagating through the optical waveguide; a drive circuit for outputting two high-frequency signals; and two terminating resistors for respectively terminating outputs of the two high-frequency signals from the drive circuit. The output of one of the high-frequency signals of the drive circuit propagates through the signal electrode of the optical waveguide element and is terminated by a first terminating resistor which is one of the terminating resistors. The output of the other of the high-frequency signals of the drive circuit is terminated by a second terminating resistor which is the other of the terminating resistors. A resistance value of the second terminating resistor is greater than a resistance value of the first terminating resistor.

An optical module includes: a housing having a first face and a second face parallel to the first face; a first block fixed to the first face of the housing by a first adhesive; an integrated circuit (IC) fixed to the first block by a second adhesive having a thickness larger than a thickness of the first adhesive; a thermoelectric cooler (TEC) fixed to the second face of the housing; an optical circuit element fixed to the TEC; and an interconnection board mounted on the IC and the optical circuit element, the interconnection board being configured to electrically couple the IC to the optical circuit element. The first block is sandwiched between the housing and the IC. The TEC is sandwiched between the housing and the optical circuit element.

According to one embodiment, an optical module includes: a lid having a first face and a second face, the lid including a bump, a wiring, and a through via; an optical circuit element; a first integrated circuit (IC); a first block bonded to the first IC by a first adhesive; a temperature control element bonded to the optical circuit element; and a housing having an opening and a third face provided inside the opening, the housing being configured to house the first IC, the optical circuit element, the first block, and the temperature control element, the third face being bonded to the first block and the temperature control element by a second adhesive, the housing being hermetically sealed with the lid.

An optical modulator circuit includes first and second electrodes, first and second p-n junction segments (PNJSs), and first and second optical waveguides. The first PNJS includes a first modulating p-n junction (MPNJ) in series with a first non-modulating device (NMD) that are connected to the first and second electrodes, respectively, where the first NMD includes a first substantially larger capacitance than the first MPNJ. The second PNJS includes a second NMD in series with a second MPNJ that are connected to the first and second electrodes, respectively, where the second NMD includes a second substantially larger capacitance than the second MPNJ. The first and second optical waveguides superimpose the first and second MPNJs, respectively, where the first and second MPNJs are configured to modulate a refractive index of the first and second optical waveguides, respectively, based on the substantially larger capacitance of the first NMD and the second NMD.