An optical circuit includes one or more input waveguides, a plurality of output waveguides, and a reflector structure. At least a portion of the reflector structure forms an interface with the one or more input waveguides. The portion of the reflector structure has a smaller refractive index than the one or more input waveguides. An electrical circuit is electrically coupled to the optical circuit. The electrical circuit generates and sends different electrical signals to the reflector structure. In response to the reflector structure receiving the different electrical signals, a carrier concentration level at or near the interface or a temperature at or near the interface changes, such that incident radiation received from the one or more input waveguides is tunably reflected by the reflector structure into a targeted output waveguide of the plurality of output waveguides.

Embodiments described include bus bars for electrochromic or other optical state changing devices. The bus bars are configured to color match and/or provide minimal optical contrast with their surrounding environment in the optical device. Such bus bars may be transparent bus bars.

A photonics integrated circuit includes a first waveguide and a second waveguide. A portion of the first waveguide has a first cladding with a first refractive index. The second waveguide includes a second cladding with a second refractive index different from the first refractive index. Also disclosed is a test circuit for a photonics integrated circuit. The test circuit can be used to determine waveguide losses, and used to tune the waveguide losses.

Disclosed is a photonic structure and associated method. The structure includes a closed-curve waveguide having a first height, as measured from the top surface of an insulator layer, and an outer curved sidewall that extends essentially vertically the full first height (e.g., to minimize signal loss). The structure includes a closed-curve thermal coupler and a heating element. The closed-curve thermal coupler is thermally coupled to and laterally surrounded by the closed-curve waveguide and has a second height that is less than the first height. In some embodiments, the closed-curve waveguide and the closed-curve thermal coupler are continuous portions of the same semiconductor layer having different thicknesses. The heating element is thermally coupled to the closed-curve thermal coupler and thereby indirectly thermally coupled to the closed-curve waveguide. Thus, the heating element is usable for thermally tuning the closed-curve waveguide via the closed-curve thermal coupler to minimize any temperature-dependent resonance shift (TDRS).

An optical modulator includes an optical waveguide through which signal light passes, a split unit that splits the signal light that passes through the optical waveguide, and a pair of phase shifters each of which shifts a phase of signal light that is split by the split unit. Each of the phase shifters includes an in-shifter waveguide through which the signal light passes, and a heater electrode that heats the in-shifter waveguide in accordance with a driving voltage. The in-shifter waveguide includes an inbound waveguide for inputting the signal light coming from the split unit, an outbound waveguide for outputting the signal light, a folded waveguide that connects the inbound waveguide and the outbound waveguide. The heater electrode is arranged in the vicinity of the inbound waveguide and the outbound waveguide.

In various embodiments, a beam-parameter adjustment system and focusing system alters a spatial power distribution of a radiation beam, via thermo-optic effects, before the beam is coupled into an optical fiber or delivered to a workpiece.

A problem is to provide a planar lightwave circuit optical device capable of facilitating mounting of connection to a printed circuit board and realizing downsizing of a device chip. A planar lightwave circuit optical device of the present invention is characterized by mounting an electrical connector (FPC connector) by means of soldering on an electrode pad of an electrical wire connected to an electrical drive unit (such as a heater) in a device formed by using a planar lightwave circuit (PLC).

A portable optic metrology thermal chamber module including a housing defining a thermal chamber, with a thermally isolated environment arranged for holding an optic device under test, the housing having an optic stimulus entry aperture configured for entry of a stimulus beam, from a metrology system stimulus source through the entry aperture onto an entry pupil of the device to an image analyzer, and a module mount coupling to modularly mount the portable optic metrology thermal chamber module to a support of a metrology system of the metrology system stimulus source so as to removably couple the portable optic metrology thermal chamber module as a unit to the support in a predetermined position relative to the metrology system stimulus source, and the housing is sized and shaped so that the portable optic metrology thermal chamber module is portable as a unit for moving to and removing from the predetermined position.

A silicon nitride phased array chip based on a suspended waveguide structure, which includes a silicon nitride waveguide area and a suspended waveguide area. The silicon nitride waveguide area includes a silicon substrate, a silicon dioxide buffer layer, a silicon dioxide cladding layer and a silicon nitride waveguide-based core layer. The silicon nitride waveguide-based core layer includes an optical splitter unit, a first curved waveguide, a thermo-optic phase shifter and a spot-size converter. The suspended waveguide area includes a second curved waveguide and an array grating antenna.

An optical attenuating structure is provided. The optical attenuating structure includes a substrate, a waveguide, doping regions, an optical attenuating member, and a dielectric layer. The waveguide is extended over the substrate. The doping regions are disposed over the substrate, and include a first doping region, a second doping region opposite to the first doping region and separated from the first doping region by the waveguide, a first electrode extended over the substrate and in the first doping region, and a second electrode extended over the substrate and in the second doping region. The first optical attenuating member is coupled with the waveguide and disposed between the waveguide and the first electrode. The dielectric layer is disposed over the substrate and covers the waveguide, the doping regions and the first optical attenuating member.