Patent classifications
G02F1/21
OPTICAL DEVICE AND OPTICAL COMMUNICATION APPARATUS
An optical device includes a thin film Lithium Niobate (LN) layer, a first optical waveguide, and a second optical waveguide. The thin film LN layer is an X-cut or a Y-cut LN layer. The first optical waveguide is an optical waveguide that is formed on the thin film LN layer along a direction that is substantially perpendicular to a Z direction of a crystal axis of the thin film LN layer. The second optical waveguide is an optical waveguide that is routed and connected to the first optical waveguide. At least a part of a core of the first optical waveguide is made thicker than a core of the second optical waveguide.
ANALOG OPTICAL LINK FOR A MOVEABLE ACTUATOR IN A DATA STORAGE SYSTEM
Apparatus and method for transferring data in a data storage system, such as but not limited to a hard disc drive (HDD). An optical link is provided between an analog front end (AFE) of a data storage device controller circuit (SOC) and a preamplifier/driver circuit (preamp) mounted to a rotary actuator to transfer an analog domain signal. A selected component is extracted from the signal using a modulation element such as a micro-resonance ring (MRR) or a Mach-Zehnder Interferometer Modulation (MZM) device. The extracted component is forwarded to a processing circuit to facilitate a transfer of data between a local memory and a non-volatile memory (NVM). The optical link includes a flexible portion in a flex circuit affixed to the rotary actuator and which supports the preamp. Multiplexed read, write, and power control signals are concurrently transmitted via the optical link. The link can concurrently service multiple head-disc assemblies (HDAs).
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A laminate (22) is formed on a semiconductor substrate (10). Two or more grooves (54) are formed in the laminate (22). A mesa (24) with two grooves among the two or more grooves (54) positioned on both sides is formed. An insulating resin film (30) is embedded into the two or more grooves (54). A first opening (32) is formed at the insulating resin film (30) embedded in one of the two or more grooves (54) and an electrode (46) extracted upward from a bottom surface (36) is formed. A first side surface (34) of the insulating resin film (30) is inclined in a forward tapered direction.
Combinatorial Optimization Problem Processor and Method
A differential phase modulation Mach-Zehnder optical modulator includes a first phase modulation unit and a second phase modulation unit; an optical interference circuit that receives a polarized clock pulse train that was modulated by the differential phase modulation Mach-Zehnder optical modulator, and allows a predetermined interaction in the Ising model to occur at a period corresponding to the N pulses of the polarized clock pulse train; and a multiplexer/demultiplexer that receives the N initialization optical pulses that create a neutral state with respect to interactions between the elements and receives an output light pulse train from the optical interference circuit, couples the initialization optical pulses with output of the optical interference circuit, demultiplexes the initialization optical pulses and the output light pulse train, outputs a demultiplexed first phase modulation signal to the first phase modulation unit, and outputs a demultiplexed second phase modulation signal to a delay unit.
COMPUTING WITH OPTICAL SIGNAL
A computing apparatus is provided. The apparatus includes: an input port to receive a first optical signal; a matrix calculation unit having a transmission matrix and configured to use the transmission matrix to process the first optical signal to obtain a second optical signal, where the second optical signal has a complex amplitude, and the transmission matrix is a unitary matrix M′; a real part obtaining unit optically coupled to the matrix calculation unit and configured to obtain, from the second optical signal, a third optical signal representing a real part of a complex amplitude of the second optical signal; and an output port configured to output an optical signal.
OPTICAL TRANSMITTER, OPTICAL TRANSCEIVER, AND METHOD OF CONTROLLING BIAS VOLTAGE OF ELECTRO-OPTIC MODULATOR
In an optical transmitter having an electro-optic modulator with first child MZI and a second child MZI nested to form a parent MZI, and a processor that controls the bias voltages of electro-optic modulator. In the first section of a control loop, the processor simultaneously superimposes different dither signals onto the first bias voltage of the first child MZI and 1.0 the second bias voltage of the second child MZI, and extracts the first phase error information for the first child MZI and the first-round third phase error for the parent MZI from a first monitoring result. In the second section of the control loop, the processor simultaneously superimposes different dither signals onto the first and second bias voltages, and extracts the second phase error information for the second child MZI and the second-round third phase error for the parent MZI from a second monitoring result.
PROVIDING DRIVE SIGNALS FOR A DIFFERENTIAL DRIVE MODULATOR
An optical waveguide structure forms an MZI in proximity to an electro-optic material. A first (second) electrical input port is configured to receive a first (second) drive signal. The second drive signal has a negative amplitude relative to the first drive signal. A first (second) transmission line is configured to propagate a first (second) electromagnetic wave over at least a portion of a first (second) optical waveguide arm to apply an optical phase modulation. A drive signal interconnection structure is configured to provide a first electrical connection between the first electrical input port and an electrode shared by the transmission lines, and a second electrical connection between the second electrical input port and respective electrodes of the transmission lines; and is configured to preserve relative phase shifts between the drive signals. Input impedances at the first and second electrical input ports are substantially equal to each other.
OPTICAL SIGNAL TRANSMITTER INCLUDING FOLDED COUPLING CONFIGURATION OF LASER SOURCE TO MICROWAVE PHOTONIC INTEGRATED CIRCUIT
A compact optical device, such as an optical transmitter or transceiver, including a folded configuration, where an optical signal generated by a laser source propagates in a first direction, then is redirected in an orthogonal direction, and then redirected again to propagate in a second direction opposite the first direction. In accordance with the folded configuration, the optical signal from the laser source is coupled to a Mach-Zehnder interferometer (MZI) modulator that includes a thin-film lithium niobate (TFLN) waveguide coupled to a radio frequency (RF) transmission line to produce an RF signal modulated optical signal for remote transmission.
OPTICAL MODULATOR AND METHOD OF MANUFACTURING OPTICAL MODULATOR
An optical modulator includes a first mesa waveguide extending in a first direction, and a second mesa waveguide. The first mesa waveguide includes a p-type first semiconductor layer disposed over a substrate, a core layer disposed over the first semiconductor layer, a p-type second semiconductor layer disposed over the core layer, and an n-type third semiconductor layer disposed over the core layer. The second semiconductor layer and the third semiconductor layer are arranged adjacent to each other in the first direction. An electrode is disposed over the third semiconductor layer. A joining surface between the second semiconductor layer and the third semiconductor layer is inclined with respect to a surface orthogonal to the first direction.
OPTICAL DEVICE AND OPTICAL COMMUNICATION DEVICE
An optical device includes an optical waveguide, a buffer layer that is layered on the optical waveguide, and an opening that is formed at least in the buffer layer above a part near a side surface of the optical waveguide. The optical device further includes an electrode that is layered in the opening and that is configured to apply a signal to the optical waveguide and a silicon layer that is layered on the buffer layer excluding the opening.