Patent classifications
G02F2201/127
OPTICAL MODULATOR WITH FOLDED CAPACITIVE LOADING SLOW-WAVE ELECTRODE
An optical waveguide modulator device includes two optical waveguides forming a Mach-Zehnder interferometer structure and two co-planar waveguide (CPW) traveling-wave electrodes (TWEs). Each optical waveguide includes a plurality of segmented phase tuning sections (phasers). The segmented phasers are folded multiple times and the segments are perpendicular to the TWE electrodes. The phase of the optical signal passing through the optical waveguide is electrically tunable by electrical signals applied to the optical modulator device through the two CPW TWE electrodes. The lengths of the connecting sections between adjacent phaser segments are design such that the wave fronts of microwave and optical wave can be matched after each phaser segment. The CPW TWE electrodes are connected by a plurality of capacitive loading phaser segments, which can effectively reduce the characteristic impedance of the TWE electrodes.
Segmented traveling wave optical modulators and related methods
A segmented traveling wave Mach Zehnder optical modulator is described. The segmented traveling wave Mach Zehnder optical modulator may comprise two or more radio frequency (RF) segments, and each RF segment may be configured to support a modulating RF signal. The modulating RF signals may be configured to modulate an optical signal propagating along an optical path of the segmented traveling wave Mach Zehnder optical modulator. The RF modulating signal in the second RF segment may be generated by amplifying the modulating RF signal of the first RF segment, using an RF amplifier. The RF amplifier may be configured to amplify a band-pass spectral portion of the modulating RF signal.
RF crossing in an optical modulator for equalization
An optical modulator includes an optical waveguide extending a length; and a plurality of Radio Frequency (RF) electrodes configured to modulate an optical signal in the optical waveguide, wherein the RF electrodes include an RF crossing located an end of the length and that is configured to equalize the optical signal. The optical signal is equalized via destructive interference after the RF crossing for attenuating modulation amplitude. At or near the end of the length, high frequencies of the optical signal are already strongly attenuated whereas low frequencies of the optical signal are not such that the low frequencies are equalized after the RF crossing.
ELECTRO-OPTIC MODULATOR AND ELECTRO-OPTIC DEVICE
An electro-optic modulator is provided. The electro-optic modulator includes: an optical splitter; a first optical waveguide and a second optical waveguide; traveling wave electrodes including a first grounding electrode, a first signal electrode, a second signal electrode, and a second grounding electrode; extension electrodes including at least one first signal sub-electrode and two second signal sub-electrodes, where the two second signal sub-electrodes are arranged on both sides of the at least one first signal sub-electrode and the first signal electrode is electrically connected to the first signal sub-electrodes, and the second signal electrode is electrically connected to the second signal sub-electrodes.
Distributed traveling-wave mach-zehnder modulator driver
A distributed traveling-wave Mach-Zehnder modulator driver having a plurality of modulation stages that operate cooperatively (in-phase) to provide a signal suitable for use in a 100 Gb/s optical fiber transmitter at power levels that are compatible with conventional semiconductor devices and conventional semiconductor processing is described.
Photonic integrated circuit package
Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including multiple electrodes configured to receive the electrical signal, where at least one characteristics of a segment of the traveling wave active optical element is changed based on the electrical signal received by a corresponding electrode of the multiple electrodes; a ground electrode; and multiple bond contacts; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and multiple conductive vias electrically coupled to the conductive trace, where each conductive via of the multiple conductive vias is bonded with a respective bond contact of the multiple bond contacts of the photonic integrated circuit chip.
Photonic integrated circuit package
Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including a lumped active optical element; an electrode configured to receive an electrical signal, where at least one characteristics of the lumped active optical element is changed based on the electrical signal received by the electrode; a ground electrode; and a bond contact electrically coupled to the electrode; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and a conductive via bonded with the bond contact of the photonic integrated circuit chip, the conductive via electrically coupled to the conductive trace to provide the electrical signal to the electrode of the photonic integrated circuit chip.
Advanced techniques for improving high-efficiency optical modulators
Improved optical interferometric modulators have a small waveguide spacing so that the waveguide pair are close to the central electrode, to enhance electro-optic interaction. Asymmetric waveguides with differential indices are used to effectively de-couple the waveguide pair. Multiple sections of asymmetric waveguide pairs with alternating differential indices are used to achieve chirp-free operation. Another version of the device utilizes transmission-line electrode that weave closer to one of the waveguide pair alternately between sections. Another version of the device utilizes waveguide structure that one of the waveguide is closer to the central electrode in alternate section. To improve efficiency further, a DC bias is provided on the outer electrodes configured as an RF-ground but DC-float electrodes. Another improvement is to have a slot is cut underneath the waveguide region to effectively reduce to thickness of the substrate. These improvements lead to higher modulator efficiency.
LIGHT MODULATION ELEMENT
A light modulation element constituted by a substrate type optical waveguide has a Mach-Zehnder interferometer; and a traveling wave electrode having a signal electrode arranged at least between a first phase modulator and a second phase modulator and electrically connected to both of the first phase modulator and the second phase modulator. A polarity of a semiconductor region of the first phase modulator connected to the signal electrode and a plurality of a semiconductor region of the second phase modulator connected to the signal electrode are different from each other.
GSG track-type radio-frequency electrode, silicon-based traveling-wave electrode light modulator, and preparation method
The present invention discloses a GSG track-type radio-frequency electrode, a silicon-based traveling-wave electrode light modulator, and a preparation method, and relates to the field of high-speed electro-optical chips. The GSG track-type radio-frequency electrode includes a GSG-type planar electrode, where a track electrode used for delaying an electric field is periodically added to one side or dual sides of the GSG-type planar electrode, and the track electrode is connected to a ground electrode of the GSG-type planar electrode. The silicon-based traveling-wave electrode light modulator includes the GSG track-type radio-frequency electrode and a conventional silicon-based traveling-wave electrode light modulator, and the GSG track-type radio-frequency electrode is connected to an active region of the silicon-based traveling-wave electrode light modulator by using through holes between electrode layers. The present invention can improve parameter design freedom of an electrode and realize effective signal parameter matching.