The present disclosure provides an apparatus for a semiconductor lithography process. The apparatus includes a mask defining a circuit pattern to be transferred. The apparatus further includes a pellicle including a pattern formed in a first surface, wherein the pellicle is attached to the mask at the first surface. The apparatus also includes an adhesive material layer disposed between the mask and the first surface. The pattern may include a plurality of capillaries. Each capillary of the plurality of capillaries may have a dimension in a plane of the first surface between about 1 μm and about 500 μm. Each capillary of the plurality of capillaries may have a ratio of depth to width greater than or equal to about 100. The adhesive material layer may include an adhesive having a glass transition temperature (T.sub.g) greater than room temperature.

The present disclosure provides an apparatus for a semiconductor lithography process. The apparatus includes a mask defining a circuit pattern to be transferred. The apparatus further includes a pellicle including a pattern formed in a first surface, wherein the pellicle is attached to the mask at the first surface. The apparatus also includes an adhesive material layer disposed between the mask and the first surface. The pattern may include a plurality of capillaries. Each capillary of the plurality of capillaries may have a dimension in a plane of the first surface between about 1 μm and about 500 μm. Each capillary of the plurality of capillaries may have a ratio of depth to width greater than or equal to about 100. The adhesive material layer may include an adhesive having a glass transition temperature (T.sub.g) greater than room temperature.

A pellicle for a reflective mask includes a pellicle body, a pellicle frame below the pellicle body to support the pellicle body, and a pattern structure in at least a part of a surface of the pellicle body, wherein the pattern structure includes a plurality of patterns.

A pellicle for a reflective mask includes a pellicle body, a pellicle frame below the pellicle body to support the pellicle body, and a pattern structure in at least a part of a surface of the pellicle body, wherein the pattern structure includes a plurality of patterns.

There is provided a pellicle wherein the pellicle frame is formed with a protrusion which extends either inward or outward from the pellicle frame so that an air passage (vent hole) can extend in it to turn upward or downward to open in the atmosphere or in the pellicle closed space (the space interior to the pellicle frame) so that it is possible to secure a wider opening area for filtration to enable prompt air ventilation whereby the pellicle membrane does not undergo extreme inflation or deflation and thus the pellicle membrane is protected from damages.

There is provided a pellicle wherein the pellicle frame is formed with a protrusion which extends either inward or outward from the pellicle frame so that an air passage (vent hole) can extend in it to turn upward or downward to open in the atmosphere or in the pellicle closed space (the space interior to the pellicle frame) so that it is possible to secure a wider opening area for filtration to enable prompt air ventilation whereby the pellicle membrane does not undergo extreme inflation or deflation and thus the pellicle membrane is protected from damages.

A pellicle frame and a pellicle made with it is proposed in which at least one pair of the side bars of the frame are made to have a deflection (bow) which has an amount or a distance of displacement measured at the middle point of the side bar accounting for 0.01 through 1% of the length of the respective side bar.

A pellicle frame and a pellicle made with it is proposed in which at least one pair of the side bars of the frame are made to have a deflection (bow) which has an amount or a distance of displacement measured at the middle point of the side bar accounting for 0.01 through 1% of the length of the respective side bar.

The present invention is directed to a pellicle frame of a pellicle for use in photolithography, comprising: a coating of a layer containing a para-xylylene-based polymer. The invention can inhibit release of sulfate ions, ammonium ions and so on from the pellicle frame and thereby reduce the occurrence of haze under exposure environment.

The present invention is directed to a pellicle frame of a pellicle for use in photolithography, comprising: a coating of a layer containing a para-xylylene-based polymer. The invention can inhibit release of sulfate ions, ammonium ions and so on from the pellicle frame and thereby reduce the occurrence of haze under exposure environment.