A pellicle including: a pellicle film including a carbon-based film having a carbon content rate of 40 mass % or more; a support frame that supports the pellicle film; and an adhesive layer containing an adhesive, the pellicle having the total amount of aqueous outgas of 5.0×10.sup.−4 Pa.Math.L/sec or less in an atmosphere of 23° C. and 1×10.sup.−3 Pa or less.

A pellicle including: a pellicle film including a carbon-based film having a carbon content rate of 40 mass % or more; a support frame that supports the pellicle film; and an adhesive layer containing an adhesive, the pellicle having the total amount of aqueous outgas of 5.0×10.sup.−4 Pa.Math.L/sec or less in an atmosphere of 23° C. and 1×10.sup.−3 Pa or less.

The present disclosure provides an apparatus for a semiconductor lithography process. The apparatus includes a mask defining a circuit pattern to be transferred. The apparatus further includes a pellicle including a pattern formed in a first surface, wherein the pellicle is attached to the mask at the first surface. The apparatus also includes an adhesive material layer disposed between the mask and the first surface. The pattern may include a plurality of capillaries. Each capillary of the plurality of capillaries may have a dimension in a plane of the first surface between about 1 μm and about 500 μm. Each capillary of the plurality of capillaries may have a ratio of depth to width greater than or equal to about 100. The adhesive material layer may include an adhesive having a glass transition temperature (T.sub.g) greater than room temperature.

The present disclosure provides an apparatus for a semiconductor lithography process. The apparatus includes a mask defining a circuit pattern to be transferred. The apparatus further includes a pellicle including a pattern formed in a first surface, wherein the pellicle is attached to the mask at the first surface. The apparatus also includes an adhesive material layer disposed between the mask and the first surface. The pattern may include a plurality of capillaries. Each capillary of the plurality of capillaries may have a dimension in a plane of the first surface between about 1 μm and about 500 μm. Each capillary of the plurality of capillaries may have a ratio of depth to width greater than or equal to about 100. The adhesive material layer may include an adhesive having a glass transition temperature (T.sub.g) greater than room temperature.

A pellicle includes a frame configured to attach to a photomask, wherein the frame includes a vent hole. The pellicle further includes a filter covering the vent hole, wherein the filter directly connects to an outer surface of the frame. The pellicle further includes a membrane extending over a top surface of the frame. The pellicle further includes a mount between the frame and the membrane, wherein the mount is attachable to the frame by an adhesive.

A pellicle includes a frame configured to attach to a photomask, wherein the frame includes a vent hole. The pellicle further includes a filter covering the vent hole, wherein the filter directly connects to an outer surface of the frame. The pellicle further includes a membrane extending over a top surface of the frame. The pellicle further includes a mount between the frame and the membrane, wherein the mount is attachable to the frame by an adhesive.

In a method of de-mounting a pellicle from a photo mask, the photo mask with the pellicle is placed on a pellicle holder. The pellicle is attached to the photo mask by a plurality of micro structures. The plurality of micro structures are detached from the photo mask by applying a force or energy to the plurality of micro structures before or without applying a pulling force to separate the pellicle from the photo mask. The pellicle is de-mounted from the photo mask. In one or more of the foregoing and following embodiments, the plurality of micro structures are made of an elastomer.

In a method of de-mounting a pellicle from a photo mask, the photo mask with the pellicle is placed on a pellicle holder. The pellicle is attached to the photo mask by a plurality of micro structures. The plurality of micro structures are detached from the photo mask by applying a force or energy to the plurality of micro structures before or without applying a pulling force to separate the pellicle from the photo mask. The pellicle is de-mounted from the photo mask. In one or more of the foregoing and following embodiments, the plurality of micro structures are made of an elastomer.

The present disclosure provides a mask tension frame and a mask tension process, where the mask tension frame includes a frame body and a supporting rib. The frame body is provided with a first surface, a second surface, and an opening. The first surface and the second surface are oppositely disposed, and the opening is recessed in the direction from the first surface toward the second surface. The supporting rib spans the opening of the frame body. A surface of the supporting rib for supporting the mask is higher than the first surface with respect to the second surface. When the mask is being tensed by the mask tension frame, at least a portion of the mask is supported by the supporting rib and at least a portion of the mask adjacent to an edge of the mask is supported by the first surface.

The present disclosure provides a mask tension frame and a mask tension process, where the mask tension frame includes a frame body and a supporting rib. The frame body is provided with a first surface, a second surface, and an opening. The first surface and the second surface are oppositely disposed, and the opening is recessed in the direction from the first surface toward the second surface. The supporting rib spans the opening of the frame body. A surface of the supporting rib for supporting the mask is higher than the first surface with respect to the second surface. When the mask is being tensed by the mask tension frame, at least a portion of the mask is supported by the supporting rib and at least a portion of the mask adjacent to an edge of the mask is supported by the first surface.