Patent classifications
G03F1/64
APPARATUS FOR REMOVING A PELLICLE FRAME FROM A PHOTOMASK AND THE METHOD THEREOF
An apparatus for removing a pellicle frame from a photomask includes a shower head and a gripper. The shower head is configured to provide an air curtain between the pellicle frame and a patterned area of the photomask. The gripper is configured to secure the pellicle frame from a direction against the flow blown from the air curtain. The flow is substantially directed toward a periphery of the photomask. A method of removing a pellicle frame from a photomask includes providing an air curtain between the pellicle frame and a patterned area of the photomask, and generating a temperature difference between the photomask and the pellicle frame. The flow of the air curtain is substantially directed toward a periphery of the photomask. The temperature of the photomask is higher than the temperature of the pellicle frame.
Self-supporting film, self-supporting structure, method for manufacturing self-supporting film, and pellicle
Provided is a self-supporting film that has an anti-reflection function independently, so that the self-supporting film exhibits excellent optical characteristics as a result. A self-supporting film has a rugged-structure layer having periodic rugged shapes formed on a surface thereof, with these periodic rugged shapes being formed on at least one surface. The average thickness of the self-supporting film ranges from 0.2 m to 20.0 m. The rugged-structure layer has a yield strain of 1% or greater and a tensile elongation of 10% or greater.
Self-supporting film, self-supporting structure, method for manufacturing self-supporting film, and pellicle
Provided is a self-supporting film that has an anti-reflection function independently, so that the self-supporting film exhibits excellent optical characteristics as a result. A self-supporting film has a rugged-structure layer having periodic rugged shapes formed on a surface thereof, with these periodic rugged shapes being formed on at least one surface. The average thickness of the self-supporting film ranges from 0.2 m to 20.0 m. The rugged-structure layer has a yield strain of 1% or greater and a tensile elongation of 10% or greater.
PELLICLE AND PELLICLE ASSEMBLY
- David Ferdinand Vles ,
- Erik Achilles Abegg ,
- Aage BENDIKSEN ,
- Derk Servatius Gertruda BROUNS ,
- Pradeep K. Govil ,
- Paul Janssen ,
- Maxim Aleksandrovich Nasalevich ,
- Arnould Willem NOTENBOOM ,
- Mária Péter ,
- Marcus Adrianus Van De Kerkhof ,
- Willem Joan Van der Zande ,
- Pieter-Jan VAN-ZWOL ,
- Johannes Petrus Martinus Bernardus Vermeulen ,
- Willem-Pieter Voorthuijzen ,
- James Norman Wiley
A pellicle suitable for use with a patterning device for a lithographic apparatus. The pellicle comprising at least one breakage region which is configured to preferentially break, during normal use in a lithographic apparatus, prior to breakage of remaining regions of the pellicle. At least one breakage region comprises a region of the pellicle which has a reduced thickness when compared to surrounding regions of the pellicle.
PELLICLE AND PELLICLE ASSEMBLY
- David Ferdinand Vles ,
- Erik Achilles Abegg ,
- Aage BENDIKSEN ,
- Derk Servatius Gertruda BROUNS ,
- Pradeep K. Govil ,
- Paul Janssen ,
- Maxim Aleksandrovich Nasalevich ,
- Arnould Willem NOTENBOOM ,
- Mária Péter ,
- Marcus Adrianus Van De Kerkhof ,
- Willem Joan Van der Zande ,
- Pieter-Jan VAN-ZWOL ,
- Johannes Petrus Martinus Bernardus Vermeulen ,
- Willem-Pieter Voorthuijzen ,
- James Norman Wiley
A pellicle suitable for use with a patterning device for a lithographic apparatus. The pellicle comprising at least one breakage region which is configured to preferentially break, during normal use in a lithographic apparatus, prior to breakage of remaining regions of the pellicle. At least one breakage region comprises a region of the pellicle which has a reduced thickness when compared to surrounding regions of the pellicle.
NOVEL APPROACH FOR ULTRA THIN-FILM TRANSFER AND HANDLING
A method for forming a pellicle apparatus involves forming a device substrate by depositing one or more pellicle layers defined over a base device layer, where a release layer is formed thereover. An adhesive layer is formed over a transparent carrier substrate. The adhesive layer is bonded to the release layer, defining a composite substrate comprised of the device and carrier substrates. The base device layer is removed from the composite structure and a pellicle frame is attached to an outermost one of the pellicle layers. A pellicle region is isolated from a remainder of the composite structure, and an ablation of the release layer is performed through the transparent carrier substrate, defining the pellicle apparatus comprising a pellicle film attached to the pellicle frame. The pellicle apparatus is then from a remaining portion of the composite substrate.
NOVEL APPROACH FOR ULTRA THIN-FILM TRANSFER AND HANDLING
A method for forming a pellicle apparatus involves forming a device substrate by depositing one or more pellicle layers defined over a base device layer, where a release layer is formed thereover. An adhesive layer is formed over a transparent carrier substrate. The adhesive layer is bonded to the release layer, defining a composite substrate comprised of the device and carrier substrates. The base device layer is removed from the composite structure and a pellicle frame is attached to an outermost one of the pellicle layers. A pellicle region is isolated from a remainder of the composite structure, and an ablation of the release layer is performed through the transparent carrier substrate, defining the pellicle apparatus comprising a pellicle film attached to the pellicle frame. The pellicle apparatus is then from a remaining portion of the composite substrate.
PELLICLE, EXPOSURE ORIGINAL PLATE, EXPOSURE DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
A pellicle for EUV exposure that has a high transmittance to EUV light, causes little outgassing, and is not much contaminated, and a method for manufacturing the same are provided. A pellicle (100) includes a pellicle film (101); a support frame (103); and a first adhesive layer (109) provided at an end of the support frame, the end being opposite to an end on which the pellicle film is extended. The pellicle further includes an inorganic layer (111) on a side surface of the first adhesive layer, the side surface extending in a direction crossing a surface of the pellicle film, and the pellicle film being extended on the side surface. The inorganic layer has a mass absorption coefficient (.sub.m) in the range of 510.sup.3 cm.sup.2/g to 210.sup.5 cm.sup.2/g.
PELLICLE, EXPOSURE ORIGINAL PLATE, EXPOSURE DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
A pellicle for EUV exposure that has a high transmittance to EUV light, causes little outgassing, and is not much contaminated, and a method for manufacturing the same are provided. A pellicle (100) includes a pellicle film (101); a support frame (103); and a first adhesive layer (109) provided at an end of the support frame, the end being opposite to an end on which the pellicle film is extended. The pellicle further includes an inorganic layer (111) on a side surface of the first adhesive layer, the side surface extending in a direction crossing a surface of the pellicle film, and the pellicle film being extended on the side surface. The inorganic layer has a mass absorption coefficient (.sub.m) in the range of 510.sup.3 cm.sup.2/g to 210.sup.5 cm.sup.2/g.
Mask assembly and associated methods
A method comprising the steps of receiving a mask assembly comprising a mask and a removable EUV transparent pellicle held by a pellicle frame, removing the pellicle frame and EUV transparent pellicle from the mask, using an inspection tool to inspect the mask pattern on the mask, and subsequently attaching to the mask an EUV transparent pellicle held by a pellicle frame. The method may also comprise the following steps: after removing the pellicle frame and EUV transparent pellicle from the mask, attaching to the mask an alternative pellicle frame holding an alternative pellicle formed from a material which is substantially transparent to an inspection beam of the inspection tool; and after using an inspection tool to inspect the mask pattern on the mask, removing the alternative pellicle held by the alternative pellicle frame from the mask in order to attach to the mask the EUV transparent pellicle held by the pellicle frame.