A membrane cleaning apparatus for removing particles from a membrane, the apparatus including: a membrane support for supporting the membrane; and a pressure pulse generating mechanism including one or more laser energy sources configured to generate a pressure pulse in a gas. The one or more energy laser sources may be focused to generate a pressure pulse in a gaseous atmosphere. The pressure pulse serves to dislodge particles on the membrane.

A membrane cleaning apparatus for removing particles from a membrane, the apparatus including: a membrane support for supporting the membrane; and a pressure pulse generating mechanism including one or more laser energy sources configured to generate a pressure pulse in a gas. The one or more energy laser sources may be focused to generate a pressure pulse in a gaseous atmosphere. The pressure pulse serves to dislodge particles on the membrane.

A method of determining a pellicle compensation correction which compensates for a distortion of a patterning device resultant from mounting of a pellicle onto the patterning device. The method includes determining a pellicle induced distortion from a first shape associated with the patterning device without the pellicle mounted and a second shape associated with the patterning device with the pellicle mounted, the pellicle induced distortion describing the distortion of the patterning device due to the pellicle being mounted. The determined pellicle induced distortion is then used to calculate the pellicle compensation correction for a lithographic exposure step using the patterning device.

A method of determining a pellicle compensation correction which compensates for a distortion of a patterning device resultant from mounting of a pellicle onto the patterning device. The method includes determining a pellicle induced distortion from a first shape associated with the patterning device without the pellicle mounted and a second shape associated with the patterning device with the pellicle mounted, the pellicle induced distortion describing the distortion of the patterning device due to the pellicle being mounted. The determined pellicle induced distortion is then used to calculate the pellicle compensation correction for a lithographic exposure step using the patterning device.

An apparatus and a method for cleaning a partial area of a substrate, in particular a photomask, are described. The apparatus has a cleaning head having a lower surface configured to be arranged above and in close proximity to the substrate area to be cleaned, the lower surface having a central opening formed therein, a first annular groove, surrounding the central opening, and at least a second groove, arranged between the first annular groove and the central opening, the first annular groove being fluidly connected to a first port allowing connection to an external supply source and the second annular groove being fluidly connected to a second port allowing connection to an external supply source, a tape supply mechanism arranged to supply an abrasive tape to the central opening in the lower surface of the cleaning head, such that a portion of the abrasive tape protrudes therefrom and a liquid media conduit having an outlet arranged to supply a liquid to a backside of the abrasive tape at or at the vicinity of the central opening. In the method a protruding portion of an abrasive tape, which protrudes from a central opening of a cleaning head is placed in contact with the area of the substrate to be cleaned to thereby bring a lower surface of the cleaning head in close proximity to the substrate area to be cleaned. A liquid is supplied to a backside of the abrasive tape at or at the vicinity of the central opening of the cleaning head, such that at least the portion of the abrasive tape protruding from the central opening is wetted, and a relative movement is caused between the abrasive tape and the surface area of the substrate to be cleaned. The method also encompasses applying a cleaning fluid to the substrate area to be cleaned via at least one first groove or the at least one second groove in the lower surface of the substrate and applying a suction force to the other groove.

An apparatus and a method for cleaning a partial area of a substrate, in particular a photomask, are described. The apparatus has a cleaning head having a lower surface configured to be arranged above and in close proximity to the substrate area to be cleaned, the lower surface having a central opening formed therein, a first annular groove, surrounding the central opening, and at least a second groove, arranged between the first annular groove and the central opening, the first annular groove being fluidly connected to a first port allowing connection to an external supply source and the second annular groove being fluidly connected to a second port allowing connection to an external supply source, a tape supply mechanism arranged to supply an abrasive tape to the central opening in the lower surface of the cleaning head, such that a portion of the abrasive tape protrudes therefrom and a liquid media conduit having an outlet arranged to supply a liquid to a backside of the abrasive tape at or at the vicinity of the central opening. In the method a protruding portion of an abrasive tape, which protrudes from a central opening of a cleaning head is placed in contact with the area of the substrate to be cleaned to thereby bring a lower surface of the cleaning head in close proximity to the substrate area to be cleaned. A liquid is supplied to a backside of the abrasive tape at or at the vicinity of the central opening of the cleaning head, such that at least the portion of the abrasive tape protruding from the central opening is wetted, and a relative movement is caused between the abrasive tape and the surface area of the substrate to be cleaned. The method also encompasses applying a cleaning fluid to the substrate area to be cleaned via at least one first groove or the at least one second groove in the lower surface of the substrate and applying a suction force to the other groove.

Disclosed is a reticle with multiple different sets of redundant mask patterns. Each set allows for patterning of a layer at a specific level of an integrated circuit (IC) chip design on a target region of a wafer using a vote-taking technique to avoid defects. The different sets further allow the same reticle to be used to pattern layers at different levels in the same IC chip design or to pattern layers at the same level or at different levels in different IC chip designs. Each mask pattern is individually framed with alignment marks to facilitate alignment minimize overlay errors. Optionally, redundant mask patterns in the same set are distributed across the reticle (as opposed to being located within the same general area) in order to minimize reticle overheating during patterning using the vote-taking technique. Also disclosed are a photolithography system and a photolithography method that employ such a reticle.

Disclosed is a reticle with multiple different sets of redundant mask patterns. Each set allows for patterning of a layer at a specific level of an integrated circuit (IC) chip design on a target region of a wafer using a vote-taking technique to avoid defects. The different sets further allow the same reticle to be used to pattern layers at different levels in the same IC chip design or to pattern layers at the same level or at different levels in different IC chip designs. Each mask pattern is individually framed with alignment marks to facilitate alignment minimize overlay errors. Optionally, redundant mask patterns in the same set are distributed across the reticle (as opposed to being located within the same general area) in order to minimize reticle overheating during patterning using the vote-taking technique. Also disclosed are a photolithography system and a photolithography method that employ such a reticle.

A method and apparatus for removing a pellicle from a photomask wherein the adhesive between the pellicle frame and photomask is cooled sufficiently to allow the adhesive property of the adhesive to diminish to the point where the adhesive will release from the photomask with little or no mechanical force and leaving minimal adhesive on the photomask. The adhesive is cooled by way of manifolds containing coolant being brought in contact with the pellicle frame or by way of a coolant spray nozzles spraying coolant directly onto the pellicle frame.

A method and apparatus for removing a pellicle from a photomask wherein the adhesive between the pellicle frame and photomask is cooled sufficiently to allow the adhesive property of the adhesive to diminish to the point where the adhesive will release from the photomask with little or no mechanical force and leaving minimal adhesive on the photomask. The adhesive is cooled by way of manifolds containing coolant being brought in contact with the pellicle frame or by way of a coolant spray nozzles spraying coolant directly onto the pellicle frame.