A resist composition contains (A) a resin being insoluble or poorly soluble in alkali aqueous solution, but becoming soluble in an alkali aqueous solution by the action of an acid, (B) an acid generator represented by the formula (II), and (D) a compound represented by the formula (I), ##STR00001##
wherein R.sup.1 and R.sup.2, m and n, R.sup.3 and R.sup.4, X.sup.1, R.sup.5 and Z1.sup.+ are defined in the specification.

A reagent that enhances acid generation of a photoacid generator and composition containing such reagent is disclosed.

A pattern forming process is provided comprising the steps of applying a resist composition comprising a polymer comprising recurring units having formula (1a) and/or (1b), an acid generator and a solvent onto a substrate, baking to form a resist film, exposing the resist film to high-energy radiation, baking, and developing in an alkaline developer to form a negative tone pattern.

A compound having a group represented by the formula (Ia): ##STR00001##
wherein R.sup.1 represents a C.sub.1 to C.sub.8 fluorinated alkyl group, R.sup.2 represents a group having an optionally substituted C.sub.5 to C.sub.18 alicyclic hydrocarbon group, and * represents a binding site.

Disclosed herein are an organic processing liquid for resist film patterning which is capable of suppressing the occurrence of defects in resist patterns, and a pattern forming method. Provided is an organic processing liquid for resist film patterning, which is used to carry out at least one of developing or cleaning of a resist film obtained from an actinic ray-sensitive or radiation-sensitive composition, the liquid including an organic solvent, in which the content of an oxidant in the organic processing liquid is 10 mmol/L or less.

Provided are a photocurable composition for imprints, having good releasability and temporal stability of the releasability, a pattern forming method, and a method for manufacturing a device.

This photocurable composition for imprints includes a monofunctional chained aliphatic (meth)acrylate (A1) not containing a fluorine atom, a bifunctional or higher polyfunctional (meth)acrylate (A2) not containing a fluorine atom, a monofunctional (meth)acrylate (B) containing a fluorine atom, and a photopolymerization initiator (C), in which the monofunctional chained aliphatic (meth)acrylate (A1) not containing a fluorine atom has a boiling point of 100° C. to 200° C. at a pressure of 0.67 kPa, and the monofunctional (meth)acrylate (B) containing a fluorine atom has a boiling point of 100° C. to 200° C. at a pressure of 0.67 kPa.

A method of patterning a device includes forming a fluorinated photopolymer layer over a device substrate. The photopolymer layer has a lower portion proximate the device substrate and an upper portion distal the device substrate. The fluorinated photopolymer layer includes a radiation-absorbing dye and a fluorinated photopolymer having a solubility-altering reactive group. The photopolymer layer is exposed to patterned radiation to form exposed and unexposed areas in accordance with the patterned radiation and a developed structure is formed by removing unexposed areas using a developing agent that includes a first fluorinated solvent. The lower portion of the exposed area of the photopolymer layer has a dissolution rate in the developing agent that is at least 5 times higher than a dissolution rate for the upper portion.

Disclosed is a fluorine-containing composition containing a fluorine-containing compound represented by general formula (1) and a fluorine-based solvent.

##STR00001##

A pattern is formed on a substrate with a layer of a curable composition (A1) containing a component (a1) serving as a polymerizable compound on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing at least a component (a2) serving as a polymerizable compound and a component (b2) serving as a photopolymerization initiator dropwise discretely onto the curable composition (A1) layer to lay the droplets, subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold having a pattern and the substrate, then irradiating the mixture layer with light to cure the layer, and releasing the mold from the mixture layer after the curing, a Distance in Hansen space Ra((a1)−(A2)) between the component (a1) serving as a polymerizable compound in the curable composition (A1) and the curable composition (A2) being 6 or less.

A positive photosensitive resin composition according to the present invention contains at least (A) a polysiloxane compound having at least a structural unit of the general formula (1), (B) a photoacid generator or quinone diazide compound and (C) a solvent
[(R.sup.X).sub.bR.sup.1.sub.mSiO.sub.n/2]  (1)
where R.sup.X represents the following group; R.sup.1 each represents a hydrogen atom, C.sub.1-C.sub.3 alkyl group, phenyl group, hydroxy group, C.sub.1-C.sub.3 alkoxy group or C.sub.1-C.sub.3 fluoroalkyl group; b represents an integer of 1 to 3; m represents an integer of 0 to 2; n represents an integer of 1 to 3; and b, m and n satisfy b+m+n=4, ##STR00001##
where X each represents a hydrogen atom or acid labile group; and a represents an integer of 1 to 5. It is possible by the use of this positive photosensitive resin composition to provide a film with high resistance and heat-resistant transparency and provide an electronic component with such a film.