Methods of fabricating three-dimensional objects featuring properties of a soft bodily tissue and three-dimensional objects featuring properties of a soft bodily tissue or of an organ comprising same are provided.

Provided is a curable resin composition containing quantum dots (A), a compound (B-1) having a first functional group and a second functional group, a resin (C), a photopolymerizable compound (D), and a photopolymerization initiator (E), wherein the first functional group is a carboxy group and the second functional group is a carboxy group or a thiol group.

A curable resin or adhesive composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and at least one energy converting material, preferably a phosphor, capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.

A colored resin composition containing an alkali-soluble resin (A), a colorant (B), an organic solvent (C), and a photosensitizer (D), the colored resin composition containing at least a zirconia compound particle as the colorant (B), wherein the zirconia compound particle contains zirconium nitride having a crystallite size of 10 nm or more and 60 nm or less, and the crystallite size is determined from a half width of a peak derived from a (111) plane in an X-ray diffraction spectrum using a CuKα ray as an X-ray source. The present invention provides a highly sensitive colored resin composition by improving light transmissivity in the ultraviolet region (wavelength 365 nm) generally used in photolithography and by improving a light shielding property in the visible region.

A quantum dot, and a quantum dot composite and a device including the same, wherein the quantum dot includes a seed including a first semiconductor nanocrystal, a quantum well layer disposed on the seed and a shell disposed on the quantum well layer, the shell including a second semiconductor nanocrystal, and wherein the quantum dot does not include cadmium, wherein the first semiconductor nanocrystal includes a first zinc chalcogenide, wherein the second semiconductor nanocrystal includes a second zinc chalcogenide, and the quantum well layer includes an alloy semiconductor nanocrystal including indium (In), phosphorus (P), and gallium (Ga), and wherein a bandgap energy of the alloy semiconductor nanocrystal is less than a bandgap energy of the first semiconductor nanocrystal and less than a bandgap energy of the second semiconductor nanocrystal.

Provided are a photosensitive resin composition including (A) a binder resin including a first binder resin and a second binder resin, (B) a photopolymerizable monomer, (C) a photopolymerization initiator, (D) a black inorganic pigment, (E) an inorganic scatterer, and (F) a solvent, wherein the first binder resin has a higher refractive index than the second binder resin, the first binder resin is included in an amount equal to or less than that of the second binder resin, and a primary particle diameter of the black inorganic pigment is less than or equal to 45 nm, a photosensitive resin layer using the same, and a display device including the photosensitive resin layer.

To provide a negative type photosensitive composition which is capable of forming a cured film having good light shielding properties and high reflectance. [Means for Solution] A negative type photosensitive composition comprising an alkali-soluble resin having a particular structure, a reflectance modifier, a polymerization initiator, and a solvent.

Provide are a composition with which a pattern (patterned cured film) with excellent light shielding properties and suppressed undercut can be formed; a light shielding film; a solid-state imaging element; an image display device; and a method for manufacturing a cured film.

The composition includes carbon black, barium sulfate, one or more kinds selected from the group consisting of copper phthalocyanine and a copper phthalocyanine derivative, an acid generator, and a crosslinking agent having a crosslinkable group which is crosslinked by an acid.

Provided is a method for manufacturing a conductive pattern forming member that is formed on a substrate and that has excellent resistance to ion migration between a conductive pattern and a photosensitive resin layer, while suppressing generation of residues in the dissolution and removal of unexposed portions. This method for manufacturing a conductive pattern forming member includes: a coating step of applying, onto surfaces of a layer A formed of a resin (a) having a carboxyl group, and a transparent electrode layer B, the layers A and B being formed over a substrate, a composition C containing conductive particles and a resin (c) having a double bond and a carboxyl group to obtain a coating film C; a drying step of drying the coating film C to obtain a dry film C; an exposure step of exposing the dry film C to light to obtain an exposed film C; a developing step of developing the exposed film C to obtain a pattern C; and a curing step of curing the pattern C to obtain a conductive pattern C, wherein particles having a particle diameter of 0.3 to 2.0 μm account for 80% or more of the conductive particles.

A low dielectric constant (Dk) and dissipation factor (Df) of solder resistant mask composition having excellent photo and thermocurability, and high developability resolution with an alkaline aqueous solution, wherein the dielectric constant is below 3.20 (1 GHz), and the dissipation factor is less than 0.015 (1 GHz); and wherein the composition comprises (A) a photopolymerizable prepolymer; (B) a photopolymerizable vinyl monomer; (C) an epoxy compound; (D) a photopolymerization initiator; (E) an inorganic filler; (F) a catalyst; and (G) an organic solvent.