In an aspect, a method for making a metal-containing material comprises steps of: forming a metal-containing hydrogel from an aqueous precursor mixture using a photopolymerization; wherein the aqueous precursor mixture comprises water, one or more aqueous photosensitive binders, and one or more aqueous metal salts; and thermally treating the metal-containing hydrogel to form the metal-containing material; wherein the metal-containing hydrogel is exposed to a thermal-treatment atmosphere during the step of thermally treating; wherein a composition of the metal-containing material is at least partially determined by a composition of the thermal-treatment atmosphere during the thermally treating step.

A first object of the present invention is to provide a transfer film that is capable of forming a resist pattern having excellent resolution. In addition, a second object of the present invention is to provide a transfer film that is capable of forming a resin pattern having excellent planarity. Further, a third object of the present invention is to provide a manufacturing method for a laminate, a manufacturing method for a circuit wire, and a manufacturing method for an electronic device, using the above-described transfer film.

The transfer film of the present invention is a transfer film having a temporary support and a composition layer disposed on the temporary support, in which the composition layer includes a photosensitive resin layer and a water-soluble resin layer, where the transfer film is obtained by laminating the temporary support, the water-soluble resin layer, and the photosensitive resin layer in this order or obtained by laminating the temporary support, the photosensitive resin layer, and the water-soluble resin layer in this order.

The water-soluble resin layer contains a compound A having a group represented by General Formula (1).

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In the formula, * represents a bonding position.

In an aspect, a thermosettable composition comprises an imide extended compound and a reactive monomer that is free-radically crosslinkable with the reactive end groups of the imide extended compound to produce a crosslinked network. A thermoset composite can be derived from the thermosettable composition and a multilayer article can include the thermoset composite in the form of a layer. The article can be an antenna, a bond ply, a semiconductor substrate build-up/redistribution layer dielectric film, a circuit board, resin-coated-copper (RCC), or a flexible core.

A photosensitive resin composition includes: (A) a binder resin; (B) a photopolymerizable monomer; (C) a photopolymerization initiator; (D) a quantum dot surface-modified with a compound having a thiol group at one terminal end and an alkoxy group, a cycloalkyl group, a carboxyl group, or a hydroxy group at the other terminal end; and (E) a solvent. A curable composition includes: (A′) a resin; (B′) a quantum dot surface-modified with a compound represented by Chemical Formula 1 or Chemical Formula 2; and (C′) a solvent. A method of manufacturing the surface-modified quantum dot, and a color filter manufactured using the photosensitive resin composition or the curable composition are also disclosed. ##STR00001##

A quantum-dot light emitting diode includes, in sequential order from bottom to top, a LED light source, a quantum-dot photoresist layer and a barrier layer. The quantum-dot photoresist layer has a thickness lower than 20 μm and is formed by specific material, so as to decrease a step difference between the quantum-dot photoresist layer and a light exit surface of the LED light source, to improve coating property of the barrier material and make sure that the coating of the barrier material can be implemented by dry coating or wet coating; the barrier material is not easy to crack to cause air leakage and oxidation because of thermal expansion and contraction, so as to increase the success rate of side packaging and the reliability of the process, and extend the reliability of the material.

A photocurable composition includes a nanomaterial selected to emit radiation in a first wavelength band in the visible light range in response to absorption of radiation in a second wavelength band in the UV or visible light range. The second wavelength band is different than the first wavelength band. The photocurable composition further includes one or more (meth)acrylate monomers, a thiol crosslinker, and a photoinitiator that initiates polymerization of the one or more (meth)acrylate monomers in response to absorption of radiation in the second wavelength band. A light-emitting device includes a plurality of light-emitting diodes and the cured photocurable composition in contact with a surface through which radiation in a first wavelength band in the UV or visible light range is emitted from each of the light-emitting diodes

A circuit pattern is quickly created or changed by exposing the circuit pattern on a board without using a photo mask on which the circuit pattern is formed. There is provided a circuit pattern manufacturing apparatus including a forming unit that forms a circuit pattern by irradiating, with a light beam, a circuit pattern forming sheet including an insulating sheet base material layer and a mixture layer made of a mixture containing a conductive material and a photo-curing resin. The forming unit includes, as an optical engine, a housing, a laser diode, a prism mirror, an inclined mirror, a bottom mirror, and a driving mirror.

The disclosure provides high refractive index ceramic material nanoimprint lithography (NIL) gratings having a relatively lower amount of carbon compared to traditional NIL gratings, and methods of making and using thereof, and devices including such gratings. The ceramic material includes one or more of titanium oxide, zirconium oxide, hafnium oxide, tungsten oxide, zinc tellurium, gallium phosphide, or any combination or derivative thereof.

This disclosure relates to a dielectric film forming composition that includes a plurality of (meth)acrylate containing compounds, at least one fully imidized polyimide polymer, and at least one solvent.

The present invention belongs to the field of functional materials, and particularly relates to a directly printable image recording material, a preparation method and application thereof. The image recording material comprises 25 to 78.8 parts by mass of a photopolymerizable monomer, 0.2 to 5 parts by mass of a photoinitiator, 20 to 70 parts by mass of an inert component, and 0.05 to 2 parts by mass of a thermal polymerization inhibitor, and has an initial viscosity of 200 to 800 mPa.Math.s. The photopolymerizable monomer includes a thiol monomer and an olefin monomer, at least one of which is a silicon-based monomer with polyhedral oligomeric silsesquioxane as a silicon core. By introducing a POSS-based thiol or olefin monomer into the photopolymerizable monomer in combination with other material components, the recording material is allowed to have an initial viscosity of 200 to 800 mPa.Math.s, and meanwhile, the low thermal conductivity characteristic of the POSS-based photopolymerizable monomer is utilized, so that image storage quality is ensured, continuous industrial production of the image recording material is achieved, the process cost is reduced and the production efficiency is improved.