Ligand-capped inorganic particles, dispersions of the ligand-capped inorganic particles, and films composed of the ligand-capped inorganic particles are provided. Also provided are methods of patterning the films and electronic, photonic, and optoelectronic devices that incorporate the films. The ligands include bifunctional ligands and two-component ligand systems that include a photosensitive group, cation, or molecule.

Ligand-capped inorganic particles, dispersions of the ligand-capped inorganic particles, and films composed of the ligand-capped inorganic particles are provided. Also provided are methods of patterning the films and electronic, photonic, and optoelectronic devices that incorporate the films. The ligands include bifunctional ligands and two-component ligand systems that include a photosensitive group, cation, or molecule.

The present invention provides a positive photosensitive resin composition having high light transmittance, high heat resistance, and excellent pattern processability. The present invention provides a positive photosensitive resin composition containing polysiloxane (A), a naphthoquinonediazide compound (B), and a solvent (C); in which the polysiloxane (A) has at least one structure selected from the following general formulae (1) to (3), and has at least one structure selected from the following general formulae (4) to (6); ##STR00001##
in which, in the general formulae (1) to (3), R.sup.4 represents a C.sub.2-C.sub.6 hydrocarbon group having an unsaturated double bond; R.sup.1 represents a single bond or a C.sub.1-C.sub.4 alkylene group; R.sup.2 in the general formula (2) represents a hydrogen atom or a C.sub.1-C.sub.4 alkyl group; and R.sup.3 in the general formula (3) represents an organic group; ##STR00002##
in which R.sup.2 in general formula (5) represents a hydrogen atom or a C.sub.1-C.sub.4 alkyl group; and R.sup.3 in the general formula (6) represents an organic group.

The present invention provides a positive photosensitive resin composition having high light transmittance, high heat resistance, and excellent pattern processability. The present invention provides a positive photosensitive resin composition containing polysiloxane (A), a naphthoquinonediazide compound (B), and a solvent (C); in which the polysiloxane (A) has at least one structure selected from the following general formulae (1) to (3), and has at least one structure selected from the following general formulae (4) to (6); ##STR00001##
in which, in the general formulae (1) to (3), R.sup.4 represents a C.sub.2-C.sub.6 hydrocarbon group having an unsaturated double bond; R.sup.1 represents a single bond or a C.sub.1-C.sub.4 alkylene group; R.sup.2 in the general formula (2) represents a hydrogen atom or a C.sub.1-C.sub.4 alkyl group; and R.sup.3 in the general formula (3) represents an organic group; ##STR00002##
in which R.sup.2 in general formula (5) represents a hydrogen atom or a C.sub.1-C.sub.4 alkyl group; and R.sup.3 in the general formula (6) represents an organic group.

According to several embodiments, a composition of matter includes: a three-dimensional structure comprising photo polymerized molecules. At least some of the photo polymerized molecules further comprise one or more protected click-chemistry compatible functional groups; and at least portions of one or more surfaces of the three-dimensional structure are functionalized with one or more of the protected click-chemistry compatible functional groups. An additive manufacturing resin suitable for fabricating a click-chemistry compatible composition of matter includes: a photo polymerizable compound; and a click-chemistry compatible compound. A method of forming an additive manufacturing resin suitable for fabricating a click-chemistry compatible composition of matter includes: reacting a compound comprising a terminal alkyne group or a terminal azide group with a protecting reagent to form a protected reactive diluent precursor, reacting the precursor with a compound to form a protected reactive diluent; and mixing the protected reactive diluent with a photo polymerizable compound.

According to several embodiments, a composition of matter includes: a three-dimensional structure comprising photo polymerized molecules. At least some of the photo polymerized molecules further comprise one or more protected click-chemistry compatible functional groups; and at least portions of one or more surfaces of the three-dimensional structure are functionalized with one or more of the protected click-chemistry compatible functional groups. An additive manufacturing resin suitable for fabricating a click-chemistry compatible composition of matter includes: a photo polymerizable compound; and a click-chemistry compatible compound. A method of forming an additive manufacturing resin suitable for fabricating a click-chemistry compatible composition of matter includes: reacting a compound comprising a terminal alkyne group or a terminal azide group with a protecting reagent to form a protected reactive diluent precursor, reacting the precursor with a compound to form a protected reactive diluent; and mixing the protected reactive diluent with a photo polymerizable compound.

The present invention provides a positive photosensitive resin composition having high light transmittance, high heat resistance, and excellent pattern processability. The present invention provides a positive photosensitive resin composition containing polysiloxane (A), a naphthoquinonediazide compound (B), and a solvent (C); in which the polysiloxane (A) has at least one structure selected from the following general formulae (1) to (3), and has at least one structure selected from the following general formulae (4) to (6);

##STR00001##

in which, in the general formulae (1) to (3), R.sup.4 represents a C.sub.2-C.sub.6 hydrocarbon group having an unsaturated double bond; R.sup.1 represents a single bond or a C.sub.1-C.sub.4 alkylene group; R.sup.2 in the general formula (2) represents a hydrogen atom or a C.sub.1-C.sub.4 alkyl group; and R.sup.3 in the general formula (3) represents an organic group;

##STR00002##

in which R.sup.2 in general formula (5) represents a hydrogen atom or a C.sub.1-C.sub.4 alkyl group; and R.sup.3 in the general formula (6) represents an organic group.

The present invention provides a positive photosensitive resin composition having high light transmittance, high heat resistance, and excellent pattern processability. The present invention provides a positive photosensitive resin composition containing polysiloxane (A), a naphthoquinonediazide compound (B), and a solvent (C); in which the polysiloxane (A) has at least one structure selected from the following general formulae (1) to (3), and has at least one structure selected from the following general formulae (4) to (6);

##STR00001##

in which, in the general formulae (1) to (3), R.sup.4 represents a C.sub.2-C.sub.6 hydrocarbon group having an unsaturated double bond; R.sup.1 represents a single bond or a C.sub.1-C.sub.4 alkylene group; R.sup.2 in the general formula (2) represents a hydrogen atom or a C.sub.1-C.sub.4 alkyl group; and R.sup.3 in the general formula (3) represents an organic group;

##STR00002##

in which R.sup.2 in general formula (5) represents a hydrogen atom or a C.sub.1-C.sub.4 alkyl group; and R.sup.3 in the general formula (6) represents an organic group.

According to several embodiments, a composition of matter includes: a three-dimensional structure comprising photo polymerized molecules. At least some of the photo polymerized molecules further comprise one or more protected click-chemistry compatible functional groups; and at least portions of one or more surfaces of the three-dimensional structure are functionalized with one or more of the protected click-chemistry compatible functional groups.

According to several embodiments, a composition of matter includes: a three-dimensional structure comprising photo polymerized molecules. At least some of the photo polymerized molecules further comprise one or more protected click-chemistry compatible functional groups; and at least portions of one or more surfaces of the three-dimensional structure are functionalized with one or more of the protected click-chemistry compatible functional groups.