An EO/PO modified 9-phenylacridine photosensitizer having the structure as shown in general formula (I). When the photosensitizer is applied to a photosensitive resin composition, the composition has characteristics of high photosensitivity, high resolution, high solubility, excellent dispersion stability, and excellent developing property, and has good hydrophilicity during development, the amount of sludges in a developer during recycling can be significantly reduced, so that the developer can be used repeatedly and effectively.

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The present invention relates to a curable coating composition, especially a radiation curable coating composition comprising at least one poly(meth)acrylate compound comprising at least 6 (meth)acrylate groups, at least one unsaturated silane compound, and at least one photoinitiator. Said at least one poly(meth)acrylate compound comprising at least 6 (meth)acrylate groups and said at least one unsaturated silane compound represent at least 95% of the weight of polymerizable compounds present in the composition. Upon radiation-curing, the composition provides an abrasion- and/or scratch-resistant coating.

A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).

There is provided a photosensitive resin composition comprising (A) a photopolymerizable compound having an ethylenically unsaturated group and an acid substituent, (B) a curing agent, (C) a photopolymerization initiator, and (D) a photopolymerizable compound, wherein the photopolymerizable compound (D) is a polyfunctional monomer which has a skeleton (X) derived from a polyhydric alcohol and having three or more bonding groups (a), each bonded to another structure and corresponding to a hydroxy group from which the hydrogen atom has been removed, and which has three or more (meth)acryloyl groups bonded directly or indirectly to the bonding groups (a), and wherein at least one (meth)acryloyl group of the three or more (meth)acryloyl groups is bonded to the bonding group(s) (a) via a linking group. There are also provided a dry film using the photosensitive resin composition, a printed wiring board, and a method for producing the printed wiring board.

Disclosed are a semiconductor photoresist composition and a method of forming patterns using the semiconductor photoresist composition. The semiconductor photoresist composition includes an organometallic compound represented by Chemical Formula 1 and a solvent and a method of forming patterns using the same.

A negative working, aqueous base developable, photosensitive photoresist composition and a process of using this composition to produce lithographic images, where this composition is one comprising: a) a polymer containing the four repeat units of structures (1), (2), (3), and (4), but no other types of repeat units; wherein v, x, y and z, respectively, represent the mole % of each repeat units of structures (1), (2), (3) and (4); b) a radical photo-initiator component, which is comprised of at least one radical photo initiator which is activated by a broad absorption of radiation from about 360 nm to about 440 nm; c) a crosslinker component which is either a mixture consisting of crosslinkers of structure (5), (6) and (7), or a single crosslinker of structure (8); d) a radical inhibitor component; e) an optional surfactant component; f) an optional dissolution promoter component; and g) a solvent. The invention also relates to the process of using this negative resist to produce lithographic images. ##STR00001##

The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10.sup.−7 m.sup.2s.sup.−1 or more, and has a volume resistivity of 1.0×10.sup.11 Ω.Math.cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.

A lithographic printing plate precursor is disclosed which comprises a support, a photopolymerizable image recording layer and an overcoat which comprises a low-molecular radical inhibitor. After image-wise exposure, the plate is heated whereby the radical inhibitor diffuses from the overcoat to the image recording layer, resulting in an increase of the daylight stability of the exposed and heated precursor. Such plate is especially suitable for on-press processing.

Provided is a resist underlayer film-forming composition that is used in a lithographic process in semiconductor manufacturing and has excellent storage stability. The resist underlayer film-forming composition contains: a polymer having a disulfide bond in a main chain; a radical trapping agent; and a solvent. The radical trapping agent is preferably a compound having a ring structure or a thioether structure. The ring structure is preferably an aromatic ring structure having 6-40 carbon atoms or a 2,2,6,6-tetramethylpiperidine structure.

Provided is a method of producing a light-emitting element, the method being capable of producing a light-emitting element including a first light emitting layer and banks on the first light emitting layer, without damaging the first light emitting layer. The method of producing a light-emitting element of the present disclosure includes: preparing a base element including a monochromatic first light emitting layer on a substrate; forming a patterned fluororesin film by disposing a photosensitive resin composition at least containing a fluororesin having a crosslinking site and a repeating unit derived from a hydrocarbon containing a fluorine atom, a solvent, and a photopolymerization initiator on the base element such that photosensitive resin composition partitions at least one region of the base element; and baking the patterned fluororesin film at a temperature of 200° C. or lower to cure the patterned fluororesin film.