A photoresist underlayer composition, comprising: a first polymer comprising a crosslinkable group; a second polymer comprising: a first repeating unit comprising a repeating unit comprising a photoacid generator, and a second repeating unit comprising a hydroxy-substituted C.sub.1-30 alkyl group, a hydroxy-substituted C.sub.3-30 cycloalkyl group, or a hydroxy-substituted C.sub.6-30 aryl group; an acid catalyst; and a solvent.

A photosensitive resin composition comprising (A) a silicone resin comprising recurring units having formula (a1) and recurring units having formula (b1), (B) a filler, and (C) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which can be processed into a fine pattern in thick film form, has improved film properties like crack resistance, and is reliable as protective film. ##STR00001##

A photosensitive resin composition comprising (A) a silicone resin comprising recurring units having formula (a1) and recurring units having formula (b1), (B) a filler, and (C) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which can be processed into a fine pattern in thick film form, has improved film properties like crack resistance, and is reliable as protective film. ##STR00001##

The present specification relates to a compound represented by Chemical Formula 1, a photoresist fluorescent resin composition including the same, and a color conversion film, a backlight unit and a display apparatus manufactured using the same.

The present specification relates to a compound represented by Chemical Formula 1, a photoresist fluorescent resin composition including the same, and a color conversion film manufactured using the same, a backlight unit and a display apparatus.

Provided is a matte-like cured coating film that is provided on a substrate such as a wiring boar, in which scratches are unnoticeable. The cured coating film is a cured coating film of a curable resin composition provided on the substrate. The cured coating film satisfies Gs (20°)≤5 and Gs (85°)≥35 and has a ratio R represented by the formula R={Gs (85°)/Gs (60°)}/{Gs (60°)/Gs (20°)} ranging from 0.35 to 4.0, where Gs (20°), Gs (60°), and Gs (85°) are 20° gloss, 60° gloss, and 85° gloss on a surface of the cured coating film measured according to JIS Z 8741-1997, respectively.

A method for processing a substrate is described. The method includes forming a metal containing resist layer onto a substrate, patterning the metal containing resist layer, and performing a post exposure bake on the metal containing resist layer. The post exposure bake on the metal containing resist layer is a field guided post exposure bake operation and includes the use of an electric field to guide the ions or charged species within the metal containing resist layer. The field guided post exposure bake operation may be paired with a post development field guided bake operation.

A photosensitive resin composition is provided comprising (A) 100 pbw of a phenolic hydroxyl group-containing resin, and (B) 0.1-18 pbw of an epoxy additive in the form of a compound containing 1-8 epoxy groups per molecule, containing nitrogen, sulfur or phosphorus, and having a molecular weight of 50-6,000. The composition has an improved bonding force to metal wirings.

[Problem] To provide a photosensitive resin composition having high dissolution rate in the exposed area and excellent dissolution contrast (resolution).

[Solution] (A) a polyimide precursor which is a reaction product of diamine compound and dicarboxylic acid and (B) a photosensitive agent, the diamine compound comprising at least one selected from the group consisting of compounds represented by the formulae (1) and (2):

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Provided is a photosensitive resin composition which comprises (A) a polymer comprising repeating units represented by formula (A1) and at least one kind of repeating units selected from among repeating units represented by formula (A2) and repeating units represented by formula (A3), (B) an epoxy compound containing four or more epoxy groups on average in the molecule, (C) a photoacid generator, (D) a benzotriazole compound and/or an imidazole compound, and (E) an organic solvent.

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