Provided are a salt capable of producing a resist pattern with satisfactory CD uniformity (CDU), an acid generator, and a resist composition comprising the same. Disclosed are a salt represented by formula (I), an acid generator, and a resist composition comprising the same:

##STR00001##

wherein R.sup.4, R.sup.5, R.sup.7 and R.sup.8 each represent a halogen atom, a haloalkyl group or a hydrocarbon group; A.sup.1 and A.sup.2 each represent a hydrocarbon group, the hydrocarbon group may have a substituent, and —CH.sub.2— included in the hydrocarbon group may be replaced by —O—, —CO—, —S— or —SO.sub.2—; ml represents an integer of 1 to 5, m2, m4, m5 and m8 represent an integer of 0 to 5, m7 represents an integer of 0 to 4, 1≤m1+m7≤5, 0≤m2+m8≤5; and AI.sup.− represents an organic anion.

Provided are a salt capable of producing a resist pattern with satisfactory CD uniformity (CDU), an acid generator, and a resist composition comprising the same. Disclosed are a salt represented by formula (I), an acid generator, and a resist composition comprising the same:

##STR00001##

wherein R.sup.4, R.sup.5, R.sup.7 and R.sup.8 each represent a halogen atom, a haloalkyl group or a hydrocarbon group; A.sup.1 and A.sup.2 each represent a hydrocarbon group, the hydrocarbon group may have a substituent, and —CH.sub.2— included in the hydrocarbon group may be replaced by —O—, —CO—, —S— or —SO.sub.2—; ml represents an integer of 1 to 5, m2, m4, m5 and m8 represent an integer of 0 to 5, m7 represents an integer of 0 to 4, 1≤m1+m7≤5, 0≤m2+m8≤5; and AI.sup.− represents an organic anion.

A radiation-sensitive resin composition includes: a polymer which has a first structural unit including a phenolic hydroxyl group, and a second structural unit represented by formula (1); and a radiation-sensitive acid generating agent which has a compound represented by formula (2). R.sup.1 represents a hydrogen atom, or the like; R.sup.2 represents a hydrogen atom or the like; and R.sup.3 represents a divalent monocyclic alicyclic hydrocarbon group having 3 to 12 ring atoms. Ar.sup.1 represents a group obtained by removing (q+1) hydrogen atoms on an aromatic ring from an arene formed by condensation of at least two benzene rings; R.sup.4 represents a monovalent organic group having 1 to 20 carbon atoms; q is an integer of 0 to 7; and R.sup.5 represents a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms, or the like.

##STR00001##

A radiation-sensitive resin composition includes: a polymer which has a first structural unit including a phenolic hydroxyl group, and a second structural unit represented by formula (1); and a radiation-sensitive acid generating agent which has a compound represented by formula (2). R.sup.1 represents a hydrogen atom, or the like; R.sup.2 represents a hydrogen atom or the like; and R.sup.3 represents a divalent monocyclic alicyclic hydrocarbon group having 3 to 12 ring atoms. Ar.sup.1 represents a group obtained by removing (q+1) hydrogen atoms on an aromatic ring from an arene formed by condensation of at least two benzene rings; R.sup.4 represents a monovalent organic group having 1 to 20 carbon atoms; q is an integer of 0 to 7; and R.sup.5 represents a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms, or the like.

##STR00001##

This disclosure generally provides compositions with improved thermal aging resistance, crack resistance and flux compatibility, wherein the resin composition comprising: (a) an epoxy resin comprising a compound having two or more epoxy groups per molecule; (b) a binder comprising a compound having at least one carboxyl group per molecule; (c) a photopolymerization initiator; and (d) a filler composition comprising silica, talc and wollastonite.

A radiation sensitive composition including a siloxane polymer exhibiting phenoplast crosslinking reactivity as a base resin, which is excellent in resolution and can be used as a radiation sensitive composition capable of allowing a pattern having a desired-shape to be formed with sufficient precision. A radiation sensitive composition including as a silane, a hydrolyzable silane, a hydrolysis product thereof, or a hydrolysis-condensation product thereof; and a photoacid generator, in which the hydrolyzable silane includes hydrolyzable silanes of Formula (1)
R.sup.1.sub.aR.sup.2.sub.bSi(R.sup.3).sub.4-(a+b)  Formula (1)
wherein R.sup.1 is an organic group of Formula (1-2) ##STR00001##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.3 is a hydrolyzable group; and Formula (2)
R.sup.7.sub.cR.sup.8.sub.dSi(R.sup.9).sub.4-(c+d)  Formula (2)
wherein R.sup.7 is an organic group of Formula (2-1) ##STR00002##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.9 is a hydrolyzable group.

A radiation sensitive composition including a siloxane polymer exhibiting phenoplast crosslinking reactivity as a base resin, which is excellent in resolution and can be used as a radiation sensitive composition capable of allowing a pattern having a desired-shape to be formed with sufficient precision. A radiation sensitive composition including as a silane, a hydrolyzable silane, a hydrolysis product thereof, or a hydrolysis-condensation product thereof; and a photoacid generator, in which the hydrolyzable silane includes hydrolyzable silanes of Formula (1)
R.sup.1.sub.aR.sup.2.sub.bSi(R.sup.3).sub.4-(a+b)  Formula (1)
wherein R.sup.1 is an organic group of Formula (1-2) ##STR00001##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.3 is a hydrolyzable group; and Formula (2)
R.sup.7.sub.cR.sup.8.sub.dSi(R.sup.9).sub.4-(c+d)  Formula (2)
wherein R.sup.7 is an organic group of Formula (2-1) ##STR00002##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.9 is a hydrolyzable group.

The invention aims to provide a cured film that is high in sensitivity, able to form a pattern having a small-tapered shape after a development step and after a heat curing step, helpful to depress the difference in the width of patterned openings between before and after the heat curing step, and high in light-shielding capability and also aims to provide a negative type photosensitive resin composition that serves for the production thereof. The negative type photosensitive resin composition includes an alkali-soluble resin (A), a radical polymerizable compound (B), a photo initiator (C1), and a black colorant (Da); the alkali-soluble resin (A) including a first resin (A1) containing one or more selected from the group consisting of polyimide (A1-1), polyimide precursor (A1-2), polybenzoxazole (A1-3), polybenzoxazole precursor (A1-4), and polysiloxane (A1-5); and the radical polymerizable compound (B) including one or more selected from the group consisting of a fluorene backbone-containing radical polymerizable compound (B1) and an indane backbone-containing radical polymerizable compound (B2).

The invention aims to provide a cured film that is high in sensitivity, able to form a pattern having a small-tapered shape after a development step and after a heat curing step, helpful to depress the difference in the width of patterned openings between before and after the heat curing step, and high in light-shielding capability and also aims to provide a negative type photosensitive resin composition that serves for the production thereof. The negative type photosensitive resin composition includes an alkali-soluble resin (A), a radical polymerizable compound (B), a photo initiator (C1), and a black colorant (Da); the alkali-soluble resin (A) including a first resin (A1) containing one or more selected from the group consisting of polyimide (A1-1), polyimide precursor (A1-2), polybenzoxazole (A1-3), polybenzoxazole precursor (A1-4), and polysiloxane (A1-5); and the radical polymerizable compound (B) including one or more selected from the group consisting of a fluorene backbone-containing radical polymerizable compound (B1) and an indane backbone-containing radical polymerizable compound (B2).

A black positive-type photosensitive resin composition with high sensitivity is provided. The photosensitive resin composition of the invention includes (A) a binder resin, (B) a quinonediazide adduct of a phenol compound having 3 or more phenolic hydroxyl groups (hereunder also referred to as “trivalent or greater phenol compound”, and (C) a black coloring agent, wherein the quinonediazide adduct (B) includes (b1) a quinonediazide adduct wherein one of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound is replaced by a structure represented by formula (I) or formula (II), and (b2) a quinonediazide adduct wherein two of the hydroxyl groups of the phenolic hydroxyl groups of the trivalent or greater phenol compound are replaced by structures represented by formula (I) or formula (II), and the total of (b1) and (b2) is at least 60 mol % of the entirety of (B). R.sup.a to R.sup.d and * in the formulas are as defined in the Specification. ##STR00001##