Provided is a positive resist composition capable of improving the adhesion between a resist film formed through pre-baking and a workpiece and reducing changes in the molecular weight of the polymer in the resist film before and after pre-baking step over broader ranges of heating temperature and heating time (at lower heating temperatures) during pre-baking. The positive resist composition comprises a polymer and a solvent, wherein the polymer has a monomer unit (A) represented by the following general formula (I) and a monomer unit (B) represented by the following general formula (II), and wherein the solvent is at least one selected from the group consisting of isoamyl acetate, n-butyl formate, isobutyl formate, n-amyl formate, and isoamyl formate: ##STR00001##

A chemically amplified positive-type photosensitive resin composition capable of forming a resist pattern having excellent cross-sectional perpendicularity of a nonresist section even when a resist pattern is formed on a metal surface, and a method for manufacturing a substrate with a template and a method for manufacturing a plated article using the composition. The composition contains an acid generator, a resin, and a sulfur-containing compound including a sulfur-containing compound and a thiol compound that is different from the sulfur-containing compound.

A chemically amplified positive-type photosensitive resin composition capable of forming a resist pattern having excellent cross-sectional perpendicularity of a nonresist section even when a resist pattern is formed on a metal surface, and a method for manufacturing a substrate with a template and a method for manufacturing a plated article using the composition. The composition contains an acid generator, a resin, and a sulfur-containing compound including a sulfur-containing compound and a thiol compound that is different from the sulfur-containing compound.

A highly-sensitive photosensitive resin composition contains a coloring agent, and can inhibit a coating from coming off in a development step. The photosensitive resin composition according to an embodiment of the present invention contains a binder resin (A), a compound (B) having a triazine ring and represented by formula (1), a radiation-sensitive compound (C), and a coloring agent (D) selected from the group consisting of black dyes and black pigments. In formula (1), R.sup.1, R.sup.2, and R.sup.3 each independently represent a hydroxy group, an alkyl group having 1-5 carbon atoms, an alkenyl group having 2-6 carbon atoms, an alkenyl ether group having 2-6 carbon atoms, an optionally substituted amino group, a halogenated alkyl group, a sulfide group, a mercapto group, a phenyl group, a phenyl ether group, a halogeno group, a naphthyl group, a pyridyl group, a biphenyl group, a morpholino group, a fluorene group, or a carbazole group.

A positive resist composition is provided comprising a base polymer comprising repeat units (a) derived from a triple bond-containing maleimide compound and repeat units (b) adapted to increase solubility in an alkaline developer under the action of acid. A pattern of good profile with a high resolution, reduced edge roughness, and reduced size variations is formed therefrom.

Disclosed are a photosensitive polymer including a repeating unit of Chemical Formula 1 or Chemical Formula 2 derived from a vinyl heteroaromatic compound and a resist composition including the same.

##STR00001##

In Chemical Formula 1 or 2, R.sup.1 and R.sup.2 are hydrogen or a methyl group, X is a carbon, sulfur, or a nitrogen atom, and n is 1 or 2.

The present invention provides a photosensitive resin composition from which a dry resist film having excellent resilience, storage stability and heat resistance can be produced. The photosensitive resin composition according to the present invention includes a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group, a photopolymerization initiator and a thermal curing agent, wherein the thermal curing agent is a polycarbodiimide compound having a carbodiimide group, the carbodiimide group in the polycarbodiimide compound is protected by an amino group that can be dissociated at a temperature equal to or higher than 80° C. and the polycarbodiimide compound has a weight average molecular weight of 400 to 5000 and a carbodiimide equivalent of 180 to 2500.

The present invention provides a photosensitive resin composition from which a dry resist film having excellent resilience, storage stability and heat resistance can be produced. The photosensitive resin composition according to the present invention includes a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group, a photopolymerization initiator and a thermal curing agent, wherein the thermal curing agent is a polycarbodiimide compound having a carbodiimide group, the carbodiimide group in the polycarbodiimide compound is protected by an amino group that can be dissociated at a temperature equal to or higher than 80° C. and the polycarbodiimide compound has a weight average molecular weight of 400 to 5000 and a carbodiimide equivalent of 180 to 2500.

A photosensitive resin composition contains a compound A which has a heterocyclic structure having at least one atom of an oxygen atom, a nitrogen atom, or a sulfur atom in a ring structure, and has at least one functional group selected from the group consisting of —SH, —OH, —COOH, —NH.sub.2, and —CONH.sub.2, an alkali-soluble binder polymer, an ethylenically unsaturated compound, and a photopolymerization initiator.

Provided are a coloring composition for a solid-state imaging element, including a pigment, a compound having a triazine ring, a polymerizable compound, and a photopolymerization initiator, in which the pigment is contained in an amount of 50% by mass or more in a total solid content of the coloring composition, and the compound having a triazine ring includes at least one group selected from an acid group or a basic group, and a maximum value of a molar absorption coefficient of the compound having a triazine ring in a wavelength range of 400 to 700 nm is 3000 L.Math.mol.sup.−1.Math.cm.sup.−1 or less; a film using the coloring composition; a color filter; and a solid-state imaging element.