G03F7/085

POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS

A positive resist composition is provided comprising (A) an acid generator in the form of a sulfonium salt consisting of a fluorine-containing sulfonate anion and a fluorine-containing sulfonium cation, (B) a quencher in the form of a sulfonium salt containing at least two fluorine atoms in its cation or containing at least 5 fluorine atoms in its anion and cation, and (C) a base polymer comprising repeat units (a1) having a carboxy group whose hydrogen is substituted by an acid labile group and/or repeat units (a2) having a phenolic hydroxy group whose hydrogen is substituted by an acid labile group. The resist composition exhibits a high sensitivity, high resolution and improved LWR or CDU.

Alkali-soluble resin, photosensitive resin composition, photosensitive sheet, cured film, interlayer insulating film or semiconductor protective film, production method for relief pattern of cured film, and electronic component or semiconductor device

The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X.sup.1 represents a divalent organic group having 2 to 100 carbon atoms, Y.sup.1 and Y.sup.2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X.sup.2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n.sup.1 and n.sup.2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X.sup.1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X.sup.1 and X.sup.2, and (II) an organic group having a diphenyl ether structure is contained as Y.sup.1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y.sup.1 and Y.sup.2.

NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATION FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT

The present invention is a negative photosensitive resin composition including: (A) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a crosslinkable polymer compound containing a structural unit represented by the following general formula (1) and having a group crosslinked with the component (A); (C) a compound that generates an acid by light; and (D) a heat crosslinking agent. An object of the present invention is to provide a negative photosensitive resin composition that enables formation of a fine pattern with high rectangularity and high resolution, has excellent mechanical characteristics even when cured at low temperatures, and furthermore, has no degradation in adhesive force between before and after a high temperature and high humidity test.

##STR00001##

COLOR PHOTORESIST, COLOR FILTER, AND MANUFACTURING METHOD THEREOF

A color photoresist comprises a curable resin, a polyfunctional monomer, an initiator, a solvent, a colorant, and an additive, wherein the additive is a non-metal catalyst catalyzing a cross-coupling photoreaction to be performed among compounds having a carbon-carbon single bond, compounds having a carbon-oxygen single bond, and compounds having a carbon-nitrogen single bond under ultraviolet light. The present disclosure further provides a color filter manufactured by the above color photoresist and a manufacturing method thereof.

Photosensitive resin composition and cured film prepared therefrom

The present invention relates to a photosensitive resin composition that is excellent in adhesiveness and sensitivity. Specifically, the photosensitive resin composition is capable of providing a cured film that is excellent in transparency, sensitivity, chemical resistance, and adhesiveness upon immersion in a stripper. Thus, the cured film can be effectively used in a liquid crystal display, an organic EL display, and the like.

ALTERNATING COPOLYMER, METHOD OF PRODUCING ALTERNATING COPOLYMER, METHOD OF PRODUCING POLYMERIC COMPOUND, AND METHOD OF FORMING RESIST PATTERN

An alternating copolymer including a structural unit (a0-1) represented by general formula (a0-1) and a structural unit (a0-2) represented by general formula (a0-2) in which Rp.sup.01 represents a hydrogen atom or the like; Vp.sup.01 represents a single bond or a divalent linking group; Rp.sup.02 and Rp.sup.03 each independently represents a hydrocarbon group which may have a substituent, or Rp.sup.02 and Rp.sup.03 are mutually bonded to form a ring; Rp.sup.04 represents a hydrogen atom, a C1-C5 alkyl group or a C1-C5 halogenated alkyl group; Rp.sup.05 represents an alkyl group, an alkoxy group, a halogen atom, a halogenated alkyl group, a cyano group or a hydroxy group; Rp.sup.06 represents a linear or branched aliphatic hydrocarbon group; and m represents an integer of 0 to 4

##STR00001##

PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, MEMBER FOR TOUCH PANEL, AND METHOD FOR MANUFACTURING CURED FILM

A photosensitive resin composition contains (A) an ethylenically unsaturated group- and carboxyl group-containing photoreactive resin, (B) an epoxy compound, (C) a polyfunctional epoxy compound, and (D) a photopolymerization initiator.

PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, MEMBER FOR TOUCH PANEL, AND METHOD FOR MANUFACTURING CURED FILM

A photosensitive resin composition contains (A) an ethylenically unsaturated group- and carboxyl group-containing photoreactive resin, (B) an epoxy compound, (C) a polyfunctional epoxy compound, and (D) a photopolymerization initiator.

HIGH-RESOLUTION FLEXOGRAPHIC PRINTING PLATE WITH IMPROVED BARRIER LAYER AND ADHESION MODULATING LAYER AND MEANS FOR ITS PRODUCTION

Described is a recording element which is suitable for the production of high-resolution flexographic printing plates by means of digital information transmission that can be imaged with actinic laser radiation and comprises or consists of the following layers: (A) a carrier film, (B) a photopolymerizable layer/relief forming polymer layer which is cross-linkable by actinic radiation, (C) an actinic radiation transparent intermediate layer composite, comprising at least two polymer comprising composite layers lying on top of each other, a first composite layer (C1) acting as blocking layer or barrier layer and a second composite layer (C2) acting as adhesion modulator against the relief forming polymer layer, (D) a recordable template layer comprising a monomeric diazonium compound, and (E1) optionally a peelable protective film or cover film on the recordable template layer (D).

HIGH-RESOLUTION FLEXOGRAPHIC PRINTING PLATE WITH IMPROVED BARRIER LAYER AND ADHESION MODULATING LAYER AND MEANS FOR ITS PRODUCTION

Described is a recording element which is suitable for the production of high-resolution flexographic printing plates by means of digital information transmission that can be imaged with actinic laser radiation and comprises or consists of the following layers: (A) a carrier film, (B) a photopolymerizable layer/relief forming polymer layer which is cross-linkable by actinic radiation, (C) an actinic radiation transparent intermediate layer composite, comprising at least two polymer comprising composite layers lying on top of each other, a first composite layer (C1) acting as blocking layer or barrier layer and a second composite layer (C2) acting as adhesion modulator against the relief forming polymer layer, (D) a recordable template layer comprising a monomeric diazonium compound, and (E1) optionally a peelable protective film or cover film on the recordable template layer (D).