Organic light emitting diode (OLED) devices are disclosed that include a first layer; a backfill layer having a structured first side and a second side; a planarization layer having a structured first side and a second side; and a second layer; wherein the second side of the backfill layer is coincident with and adjacent to the first layer, the second side of the planarization layer is coincident with and adjacent to the second layer, the structured first side of the backfill layer and structured first side of the planarization layer form a structured interface, the refractive index of the backfill later is index matched to the first layer, and the refractive index of the planarization layer is index matched to the second layer.

A method of producing a molded product, the method including: pressing a mold having a surface including at least one of a concave part or a convex part against a photocurable positive electron beam resist; obtaining a molded product of the positive electron beam resist having a surface including a concave part and a convex part by irradiating the photocurable positive electron beam resist pressed against the resist with light to cure the resist; and partially decomposing the molded product of the positive electron beam resist in a region subjected to irradiation with an electron beam by irradiating the surface of the molded product of the positive electron beam resist with the electron beam.

A molding apparatus that molds a composition on a substrate with a mold includes a mold holding unit configured to hold the mold, a substrate holding unit configured to hold the substrate, a first elastic member configured to apply a first elastic force to the mold holding unit in a direction away from the substrate holding unit, and a control unit configured to cause the mold holding unit to move in the direction away from the substrate holding unit in a case where the control unit determines that an abnormality has occurred.

A method of forming a transparent, electrically-conductive film and an associated film. The method can be a transfer method. A region of a substrate is provided with a binder that includes metal nanostructures suspended in a photosensitive polymeric material. A donor substrate can be used. Photolithography is used to pattern the binder. The patterned binder is developed using a developing fluid that: (i) removes a portion of the photosensitive polymeric material according to a pattern of the binder, and (ii) includes a nanostructure etchant that etches the metal nanostructures.

A combined radiation and functional layer application system includes one or more radiation sources and a commonly located functional layer application unit configured to dispose a functional layer over the surface of a fixed target ahead of the radiation sources during relative motion between the target and the radiation sources/application unit. System and method embodiments include those in which the target is stationary or moving, and embodiments in which the functional layer is applied as a liquid or as a solid laminate. Embodiments relate to application of an oxygen-blocking layer of a printing plate prior to exposure to actinic radiation. Certain solid laminate embodiments include a two-roll system for positioning the laminate for cutting adjacent a trailing edge of the plate.

A transfer film includes a temporary support; and a photosensitive transparent resin layer positioned on the temporary support, in which the photosensitive transparent resin layer includes a binder polymer, an ethylenically unsaturated compound, a photopolymerization initiator, and a compound capable of reacting with acid due to heating, and the compound capable of reacting with acid due to heating includes a polymerizable group. In addition, an electrode protective film using the transfer film, a laminate, a capacitive input device, and a manufacturing method of a touch panel are provided.

The present invention provides an imprint apparatus that forms a pattern in an imprint material on a substrate using a mold including a pattern region, the apparatus comprising: a stage configured to be movable while holding the substrate; and a dispenser configured to discharge the imprint material, wherein a sensor, a receptor, and a mark are provided around a holding region where the substrate is held, in an upper surface of the stage, and the upper surface of the stage includes a first region that passes below the pattern region during movement of the stage between a position below the dispenser and a position below the mold, and a second region that does not pass below the pattern region during the movement, and the sensor, the receptor, and the mark are arranged in the second region.

A shadow mask for patterned vapor deposition of an organic light-emitting diode (OLED) material includes a ceramic membrane under tensile stress with a plurality of through-apertures forming an aperture array through which a vaporized deposition material can pass. A multilayer peripheral support is attached to a rear surface with a hollow portion beneath the aperture array. A compressively-stressed interlayer balances the tensile stress of the ceramic membrane. A shadow mask module with multiple shadow masks is also provided and includes a rigid carrier having plural windows with a shadow mask positioned in each window. To make the module, shadow mask blanks are affixed to each carrier window followed by etching of apertures and support layers. In this way extremely flat masks with precise aperture patterns are formed.

Provided are a transfer film for a silver conductive material protective film, including a temporary support, and a photosensitive layer which is provided on the temporary support, and includes at least one selected from the group consisting of a binder polymer and a polymerizable compound, and a photopolymerization initiator, in which an amount of free chloride ions included in the photosensitive layer is 20 ppm or less, and a mass content average value of C log P values in all the binder polymer and polymerizable compound included in the photosensitive layer is 2.75 or more; a manufacturing method of a patterned silver conductive material using the transfer film for a silver conductive material protective film; a laminate including, in the following order, a substrate, a silver conductive material, and a cured resin layer, in which an amount of free chloride ions included in the cured resin layer is 20 ppm or less, and a C log P value of a cured resin component included in the cured resin layer is 2.75 or more; and a touch panel.

A process for the production of three-dimensional structures involves generating stepped structures in the micrometer to millimeter range. A novel possibility for realizing microstructures for micromechanical and high-performance electronic structures allows a substantially free shaping of and high-throughput production of stepped structures is met according to the invention by coating a copper-clad substrate at least once with a first photoresist for generating a defined height of at least one structure step and coating the first photoresist at least once with a second photoresist for generating a defined height of at least one further structure step, wherein the first photoresist and the second photoresist have different photosensitivities and transmission characteristics which generate structure-forming regions at least of the first photoresist and second photoresist by exposing with different wavelengths and radiation doses and after developing. The structure-forming regions at least partially overlap one another and form a stepped three-dimensional structure.