Patent classifications
G03F7/161
Imprinting system, method of manufacturing semiconductor device, and recording medium
An imprinting system according to an embodiment includes a first measuring device measuring an intensity of light reflected from an end of a shot area of a monitor substrate being an area on which imprinting has been performed, a dripping condition generating device generating a dripping condition of a resin-based mask material on the basis of the measured intensity of light, and an imprinting apparatus performing imprinting using the dripping condition. The imprinting apparatus includes a second measuring device measuring an intensity of light reflected from an end of a first shot area of a production substrate being an area on which imprinting has been performed, and a control unit adjusting arrangement of droplets of a resin-based mask material ejected on a second shot area of the production substrate being an area on which imprinting is to be performed on the basis of an intensity of light reflected from an end of the first shot area.
Imprint method, imprint apparatus, and film formation apparatus
An imprint method includes supplying a first photocurable resist to a first region of an object; irradiating the first resist with first light; forming a second resist over the object; bringing a template into contact with the second resist; and irradiating at least the second resist with second light through the template while the template is in contact with the second resist.
Material for forming organic film, patterning process, and polymer
A material for forming an organic film, including: a polymer having a structure shown by the following general formula (1A) as a partial structure; and an organic solvent, where in the general formula (1A), W1 represents a tetravalent organic group, W2 represents a single bond or a linking group shown by the following formula (1B), R1 represents a hydrogen atom or a monovalent organic group having 1 to 10 carbon atoms, n1 represents an integer of 0 or 1, and n2 and n3 satisfy 0n26,0n36, and 1n2+n36, and where R2 and R3 each independently represent hydrogen or an organic group having 1 to 30 carbon atoms, and the organic group R2 and the organic group R3 optionally bond to each other within a molecule to form a cyclic organic group. ##STR00001##
ORGANOMETALLIC COMPOUNDS AND PURIFICATION OF SUCH ORGANOMETALLIC COMPOUNDS
Disclosed herein are methods of purifying compounds useful for the deposition of high purity tin oxide and high purity compounds purified by those methods. Such compounds are those of the Formula as follows R.sub.xSn-A.sub.4-x
wherein: A is selected from the group consisting of (Y.sub.aR.sub.z) and a 3- to 7-membered N-containing heterocyclic group; each R group is independently selected from the group consisting of an alkyl or aryl group having from 1 to 10 carbon atoms; each R group is independently selected from the group consisting of an alkyl, acyl or aryl group having from 1 to 10 carbon atoms; x is an integer from 0 to 4; a is an integer from 0 to 1; Y is selected from the group consisting of N, O, S, and P; and
z is 1 when Y is O, S or when Y is absent and z is 2 when Y is N or P.
Stereolithography with thermoplastic photopolymers
Stereolithography using solid thermoplastic photopolymer plates/sheets/films provides a new technique to make 3D printed objects. In this new additive manufacturing process, objects are built layer-wise using thermoplastic photopolymers and actinic radiation. The thermoplastic photopolymer compositions consist of a thermoplastic photopolymer layer sandwiched between a transparent flexible base without an anchoring layer and a release film. Un-crosslinked portions of the 3D printed object are removed by heat. Preferred method of radiation exposure is digital light processing (DLP)
TRANSFER UNIT AND APPARATUS FOR TREATING SUBSTRATE
An apparatus for transferring a substrate is provided. A unit for transferring a substrate, includes a support structure, a first hand to place the substrate, a second hand stacked with the first hand and placing the substrate, a first guide rail guiding movement of a first support rod to support the first hand in the support structure, a second guide rail guiding movement of a second support rod in the support structure to support the second hand, and a pressure reducing member reducing pressure of an exhaust fluid passage provided in the support structure. The exhaust fluid passage includes a first fluid passage communicating with the first guide rail, a second fluid passage communicating with the second guide rail, and a third fluid passage formed by combining the first fluid passage with the second fluid passage. The pressure reducing member reduces pressure of the third fluid passage.
SELECTIVE SURFACE PATTERNING VIA NANOIMPRINTING
Substrates comprising dual functional polymer layered surfaces and the preparation thereof by using UV nano-imprinting processes are disclosed. The substrates can be used as flow cells, nanofluidic or microfluidic devices for biological molecules analysis.
Gas permeable superstrate and methods of using the same
A gas permeable superstrate and method using the same is disclosed. The superstrate can include a body and an amorphous fluoropolymer layer on the body. The method of planarization can include dispensing a planarization precursor material over a substrate and contacting the planarization precursor material with a body of a superstrate. In one embodiment, the substrate includes a non-uniform surface topography. The method can also include curing the planarization precursor material to form a planarization layer over the substrate, where curing can be performed while the superstrate is contacting the planarization precursor material.
Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
A pattern is formed on a substrate with forming a layer of a curable composition (A1) containing a polymerizable compound (a1) on a surface of the substrate, then dispensing droplets of a curable composition (A2) containing a polymerizable compound (a2) dropwise discretely onto the curable composition (A1) layer, subsequently sandwiching a mixture layer of the curable composition (A1) and the curable composition (A2) between a mold and the substrate, then irradiating the mixture layer with light to cure the mixture layer, and releasing the mold from the mixture layer after the curing. The curable composition (A1) except a solvent has a viscosity at 25 C. of 40 mPa.Math.s or more and less than 500 mPa.Math.s. The curable composition (A2) except a solvent has a viscosity at 25 C. of 1 mPa.Math.s or more and less than 40 mPa.Math.s.
Reflection type exposure mask and pattern forming method
A reflection type exposure mask includes a substrate, a reflective layer provided on the substrate, and a light absorption layer provided on the surface of the reflective layer. The light absorption layer includes a first absorber and a second absorber. The first absorber extends in a first direction along the surface of the reflective layer. The second absorber extends in a second direction along the surface of the reflective layer, which intersects with the first direction. The thickness of the second absorber in a third direction which is perpendicular to the surface of the reflective layer is thinner than the thickness of the first absorber in the third direction.