The present disclosure provides a semiconductor fabrication method. The method includes modifying an edge portion of a wafer such that the edge portion are prevented from resist coating; coating a resist layer on the front surface of the wafer, wherein the resist layer is free from the edge portion of the wafer; and performing an exposing process to the resist layer.

A method of forming a photoresist layer includes: forming alignment electrodes on a base; mixing color QRs and photoresist to form a mixed material; coating the mixed material on the base; applying the base coated with the mixed material with positive and negative voltages so that the long axes of the color QRs align horizontally under the effect of the horizontal electric fields generated by the alignment electrodes; vacuum-drying the base coated with the mixed material to enhance the viscosity of the photoresist; interrupting electricity at a designated point to form a photoresist layer, wherein the long axes of QRs remain aligned horizontally; the color film substrate includes color resist films; when a backlight source emits blue light to the color film substrate, a color filter is disposed on top of the red color film to filtrate the blue light.

Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.

A dispensing system includes a dispense material supply that contains a dispense material and a dispensing pump connected downstream from the dispense material supply. The dispensing pump includes a body made of a first electrically conductive material, one or more first electrical contacts that are disposed on the body of the dispensing pump, and one or more first connection wires that are coupled between each one of the one or more first electrical contacts and ground. The dispensing system also includes a dispensing nozzle connected downstream from the dispensing pump and includes a tube made of a second electrically conductive material, one or more second electrical contacts that are disposed on an outer surface of the tube, and one or more second connection wires that are coupled between each one of the one or more second electrical contacts and the ground.