Patent classifications
G03F7/2049
Selective composite manufacturing for components having multiple material properties
A method of forming a component having multiple material properties includes forming, by additive manufacturing, a particle containment structure on a base layer; filling the particle containment structure with a first layer of particles, the layer of particles being contained by the particle containment structure; curing the first layer of particles; repeating the forming the particle containment structure, filling the particle containment structure with one or more additional layers of particles and curing the one or more additional layers of particles until a desired component dimension is achieved; forming, by additive manufacturing, a cover to encapsulate any exposed particles; and fully curing the particle containment structure, particles and cover.
Systems and methods for polymer tips using silanated supports
Polymer Pen Lithography materials that retain the simplicity characteristic for the fabrication of poly(dimethyl siloxane) tip arrays while preserving the control over feature dimensions and to understand the role of the mechanical properties of the different materials on Polymer Pen Lithography printing.
Method for producing a nano-structured element made of hexagonal boron nitride and device comprising such an element
A method is indicated for producing a nano-structured element (1) made of hexagonal boron nitride (hBN). The method comprises the steps of a.) generating a relief structure (4) in the surface (31) of a resist (3), the resist in particular being a polymer resist (3); of b.) placing the resist (3) on the hBN-element (1); and of c.) transferring the relief structure (4) from the resist (3) into the hBN-element (1) by means of etching. Furthermore, a device is indicated comprising one or several nano-structured hBN-elements (1), the one or several hBN-elements (1) having a relief structure (4) provided for the targeted influencing of the electronic, optical and/or mechanical properties of the device.