Methods of fabricating large-scale optical devices having sub-micron dimensions are provided. A method is provided that includes projecting a beam to a mask, the mask corresponding to a section of an optical device pattern, the optical device pattern divided into four or more equal portions, each portion corresponding to a section of a substrate. The method further includes scanning the mask over a first section of the substrate to pattern a first portion of the optical device pattern, the substrate is positioned at a first rotation angle relative to the mask. The method further includes rotating the substrate to a second rotation angle, the second rotation angle corresponding to 360° divided by a total number of portions of the optical device pattern, scanning the mask over a second section of the substrate from the initial position to the final position to pattern a second portion of the optical device pattern.

A system and method for maskless direct write lithography are disclosed. The method includes receiving a plurality of pixels that represent an integrated circuit (IC) layout; identifying a first subset of the pixels that are suitable for a first compression method; and identifying a second subset of the pixels that are suitable for a second compression method. The method further includes compressing the first and second subset using the first and second compression method respectively, resulting in compressed data. The method further includes delivering the compressed data to a maskless direct writer for manufacturing a substrate. In embodiments, the first compression method uses a run-length encoding and the second compression method uses a dictionary-based encoding. Due to the hybrid compression method, the compressed data can be decompressed with a data rate expansion ratio sufficient for high-volume IC manufacturing.

A display device and a manufacturing method thereof are provided. The display device includes a display area and a non-display area. The display device includes a substrate, an element layer, an electrode pattern layer, a photoresist pattern layer, and a light-emitting element. The element layer is disposed on the substrate. The electrode pattern layer is disposed on the element layer, and the electrode pattern layer includes multiple electrodes. The photoresist pattern layer is disposed on the electrode pattern layer, and the photoresist pattern layer includes a first photoresist pattern disposed corresponding to the display area and corresponding to the electrodes; a second photoresist pattern disposed corresponding to the non-display area and between the electrodes. The light-emitting element is disposed on the photoresist pattern layer and is electrically connected to the electrodes of the electrode pattern layer.

A super-resolution system for nano-patterning is disclosed, comprising an exposure head that enables a super-resolution patterning exposures. The super-resolution exposures are carried out using electromagnetic radiation and plasmonic structure, and in some embodiments, plasmonic structures having specially designed super-resolution apertures, of which the “bow-tie” and “C-aperture” are examples. These apertures create small but bright images in the near-field transmission pattern. A writing head comprising one or more of these apertures is held in close proximity to a medium for patterning. In some embodiments, a data processing system is provided to re-interpret the data to be patterned into a set of modulation signals used to drive the multiple individual channels and multiple exposures, and a detection means is provided to verify the data as written.

Techniques herein include processes and systems by which a reproducible CD variation pattern can be mitigated or corrected to yield desirable CDs from microfabrication patterning processes, via resolution enhancement. A repeatable portion of CD variation across a set of wafers is identified, and then a correction exposure pattern is generated. A direct-write projection system exposes this correction pattern on a substrate as a component exposure, augmentation exposure, or partial exposure. A conventional mask-based photolithographic system executes a primary patterning exposure as a second or main component exposure. The two component exposures when combined enhance resolution of the patterning exposure to improve CDs on the substrate being processed without measure each wafer.

A double-sided digital lithography or exposure system and method are provided. The system includes a first optical engine 110 for exposing a front side of a substrate 910, a second optical engine 120 for exposing the back side of the substrate 910, a control system 710 for generating a first exposure pattern and a second exposure pattern aligned on the front and back surfaces of the substrate 910 based on the position information of the first optical engine 110 and the second optical engine 120, and controlling the first optical engine 110 and the second optical engine 120 to expose the front and back surfaces of the substrate 910 with the first exposure pattern and the second exposure pattern.

Integrated circuitry comprising an opaque material layer, such an interconnect metallization layer is first patterned with a maskless lithography to reveal an alignment feature, and is then patterned with masked lithography that aligns to the alignment feature. In some examples, the maskless lithography employs an I-line digital light processing (DLP) lithography system. In some examples the I-line DLP lithography system performs an alignment with IR illumination through a backside of a wafer. The maskless pattern may include dimensionally large windows within a frame around circuitry regions. A first etch of the opaque material layer may expose the alignment feature within the window, and a second etch of the opaque material may form IC features, such as interconnect metallization features.

The present invention is directed to refractive index contrast (“RIC”) polymers and methods for producing and using the same. In one particular embodiment, RIC polymers of the invention can be used as waveguides. RIC polymers of the invention are produced from a monomeric mixture comprising a first monomer and a second monomer comprising an acid-labile protecting group, where a first polymer produced from the first monomer has a different refractive index compared to the refractive index of a second polymer produced from the second monomer. The base refractive index of RIC polymers can be tuned by controlling the amount of the first and the second monomers. Furthermore, the refractive index of the waveguide can be modulated by the amount of acid-labile protecting group removal.

Systems and processes for making a flexo plate, and plates made thereby. Non-printing indicia defined by areas of presence and absence of polymer in the plate floor created using microdots imaged during a LAMS layer imaging step are readable downstream of the washing or other non-cured-polymer-removal step but not to print in the printing step. The non-printing indicia may define a repeating pattern of alphanumeric characters, non-text graphics, or a combination thereof. A difference in growth of plate structures corresponding to different types of microdots may be used for characterizing processing conditions.

A circuit pattern is quickly created or changed by exposing the circuit pattern on a board without using a photo mask on which the circuit pattern is formed. There is provided a circuit pattern manufacturing apparatus including a forming unit that forms a circuit pattern by irradiating, with a light beam, a circuit pattern forming sheet including an insulating sheet base material layer and a mixture layer made of a mixture containing a conductive material and a photo-curing resin. The forming unit includes, as an optical engine, a housing, a laser diode, a prism mirror, an inclined mirror, a bottom mirror, and a driving mirror.