Methods and apparatus for fabricating high-resolution thin-layer metal patterns and 3D Metal structures are provided. The methods and apparatus operate via photo-(stereo)lithography at room temperature. The printed metal patterns, for example silver patterns, exhibit high electrical conductivity, comparable to or better than the conductivity of the silver printed by current laser sintering or thermal annealing at high temperature.

A maskless exposure apparatus includes a light source, an optical head including a light modulator and an optical system, and reflecting light from the light source to radiate the light to a substrate to be exposed, a stage supporting the substrate and moving the substrate in a scanning direction, where the substrate is rotated such that a reference line of the substrate is at a first angle with respect to the scanning direction, and an optical head rotating unit rotating the optical head. When patterns are formed on the substrate in a direction of a first row and an nth row that is substantially perpendicular to the reference line, the first angle is set such that illuminations accumulated, by a beam spot array, in first portions and second portions on the substrate respectively corresponding to the patterns of the first row and the patterns of the nth row vary.

A device (100) includes a light source (130) and a light guide (110). The light source (130) is configured to emit photoresist-curative electromagnetic radiation. The light guide (110) is arranged to receive the photoresist-curative electromagnetic radiation from the light source (130) and to guide the received radiation by total internal reflection, the light guide (110) including a pattern of emission points (210) on at least one surface of the light guide (110), the emission points (210) emitting the photoresist-curative electromagnetic radiation out of the light guide (110) by frustration of total internal reflection caused by the emission points (210).

In accordance with the disclosure, a method of forming a nanochannel is provided. The method includes depositing a photosensitive film stack over a substrate; forming a pattern on the film stack using interferometric lithography; depositing a plurality of silica nanoparticles to form a structure over the pattern; removing the pattern while retaining the structure formed by the plurality of silica nanoparticles, wherein the structure comprises one or more enclosed nanochannels, wherein each of the one or more nanochannels comprise one or more sidewalls and a roof; and partially sealing the roof of one or more nanochannels, wherein the roof comprises no more than one unsealed nanochannel per squared micron.

Provided is an image exposure device capable of recording a favorable image and capable of decreasing the size of the device. An image exposure device (10) includes an image display device (12) having pixels (13), a photosensitive recording medium support portion (21) that supports a photosensitive recording medium (14) for recording an image of the image display device (12) in a state in which an exposure surface (14A) of the photosensitive recording medium (14) faces the image display device (12), and a transmitted light control portion (16) that is provided between the image display device (12) and the photosensitive recording medium support portion (21) and is formed by laminating three or more layers of transmission members (100) that have a plurality of openings (102) formed therein and transmit only light incident on the openings (102).

A digital exposure machine and an exposure control method thereof are disclosed. The exposure control method of the digital exposure machine includes: determining a scanning direction of the digital exposure machine, wherein a plurality of sub-pixels in an array include multiple rows of sub-pixels arranged in the scanning direction, the multiple rows of sub-pixels including a first row of sub-pixels in the scanning direction; determining a starting scanning position, the starting scanning position being located on an outer side of the first row of sub-pixels in the scanning direction; and performing a plurality of scannings to expose a display region of the first display substrate to be exposed, wherein a scanning pitch for each of the plurality of scannings is integer times of a pitch of two adjacent rows of sub-pixels of the first display substrate in the scanning direction.

Dry stereolithography using solid thermoplastic photopolymer plates/sheets/films provides a new technique to make 3D printed objects. In this new additive manufacturing process, objects are built layer-wise using thermoplastic photopolymers and actinic radiation. The thermoplastic photopolymer compositions consist of a thermoplastic photopolymer layer sandwiched between a transparent flexible base without an anchoring layer and a release film. Uncrosslinked portions of the 3D printed object are removed by heat. Preferred method of radiation exposure is digital light processing (DLP).

A circuit pattern is quickly created or changed by exposing the circuit pattern on a board without using a photo mask on which the circuit pattern is formed. There is provided a circuit pattern manufacturing apparatus including a forming unit that forms a circuit pattern by irradiating, with a light beam, a circuit pattern forming sheet including an insulating sheet base material layer and a mixture layer made of a mixture containing a conductive material and a photo-curing resin. The forming unit includes, as an optical engine, a housing, a laser diode, a prism mirror, an inclined mirror, a bottom mirror, and a driving mirror.

A fiber-type electronic device comprising a pattern for electronic devices stacked on a fiber filament substrate is provided. It is possible to manufacture an electronic device directly on a fiber filament substrate by applying the pattern for electronic devices. Thus, it can be widely used for wearable devices and the like. The pattern for electronic devices is manufactured by a method for forming a pattern for electronic devices comprising an exposure process using a maskless exposure apparatus. Thus, it is possible to manufacture a pattern for electronic devices on a fiber filament substrate through a continuous process and thus to increase the process efficiency.

Embodiments of the present disclosure generally provide improved photolithography systems and methods using a digital micromirror device (DMD). The DMD comprises columns and rows of micromirrors disposed opposite a substrate. Light beams reflect off the micromirrors onto the substrate, resulting in a patterned substrate. Certain subsets of the columns and rows of micromirrors may be positioned to the off position, such that they dump light, in order to correct for uniformity errors, i.e., features larger than desired, in the patterned substrate. Similarly, certain subsets of the columns and rows of micromirrors may be defaulted to the off position and selectively allowed to return to their programmed position in order to correct for uniformity errors, i.e., features smaller than desired, in the patterned substrate.