Patent classifications
G03F7/22
PHOTOSENSITIVE RESIN COMPOSITION
A photosensitive resin composition including an alkali-soluble resin, a photoacid generator, a first organic solvent, and a second organic solvent different from the first organic solvent, in which the alkali-soluble resin includes at least one selected from a polyimide resin, a polyimide resin, and precursors thereof, the second organic solvent includes a heterocyclic compound having a carbonyl Group (provided that N-methyl-2-pvrrolidone is excluded), and the amount or the second organic solvent is 0.001% by mass or more and 4.0% by mass or less with respect to the entire photosensitive resin composition.
EXPOSURE APPARATUS, MANUFACTURING METHOD OF FLAT-PANEL DISPLAY, DEVICE MANUFACTURING METHOD, AND EXPOSURE METHOD
A liquid crystal exposure apparatus that moves a substrate supported in a noncontact manner by a noncontact holder to a projection optical system, and performs scanning exposure to the substrate equipped with: holding pads that hold a part of the substrate located at a first position above the noncontact holder; adsorption pads that hold another part of the substrate; a first drive section moves the holding pads from below the substrate direction intersecting a vertical direction, where the substrate is located at the first position held by the adsorption pads; and a second drive section that moves the adsorption pads holding the substrate, to a second position where the substrate is supported in a noncontact manner by the noncontact holder, wherein the scanning exposure, the second drive section moves the adsorption pads holding the substrate supported in a noncontact manner by the noncontact holder to the projection optical system.
Exposure apparatus, surface position control method, exposure method, and semiconductor device manufacturing method
According to one embodiment, there is provided an exposure apparatus, including a focus detecting system, a stage, and a controller. On the stage, a substrate is to be mounted. The controller performs focus measurement on an incomplete shot area, part of which is outside a pattern forming area of the substrate, by the focus detecting system. The controller obtains amounts of defocus of a plurality of planes that are candidates for approximating the incomplete shot area according to the result of measuring the incomplete shot area. The controller decides on a plane to approximate the incomplete shot area from among the plurality of planes according to the amounts of defocus of the plurality of planes. The controller drives the stage using a focus-leveling value according to the decided-on plane so as to control a surface position of the incomplete shot area.
Exposure apparatus, surface position control method, exposure method, and semiconductor device manufacturing method
According to one embodiment, there is provided an exposure apparatus, including a focus detecting system, a stage, and a controller. On the stage, a substrate is to be mounted. The controller performs focus measurement on an incomplete shot area, part of which is outside a pattern forming area of the substrate, by the focus detecting system. The controller obtains amounts of defocus of a plurality of planes that are candidates for approximating the incomplete shot area according to the result of measuring the incomplete shot area. The controller decides on a plane to approximate the incomplete shot area from among the plurality of planes according to the amounts of defocus of the plurality of planes. The controller drives the stage using a focus-leveling value according to the decided-on plane so as to control a surface position of the incomplete shot area.
Phase shift mask
A phase shift mask includes a substrate, a second phase shift pattern on the substrate, the second phase shift pattern extending to an outermost perimeter of the substrate, the second phase shift pattern being formed of a material that is semi-transmissive to light of a first wavelength and the substrate being substantially transparent to the light of the first wavelength such that the mask transmits about 2 to about 10% of the light of the first wavelength at the second phase shift pattern, and a first phase shift pattern on the substrate, the second phase shift pattern being disposed between the outermost perimeter of the substrate and the first phase shift pattern.
Phase shift mask
A phase shift mask includes a substrate, a second phase shift pattern on the substrate, the second phase shift pattern extending to an outermost perimeter of the substrate, the second phase shift pattern being formed of a material that is semi-transmissive to light of a first wavelength and the substrate being substantially transparent to the light of the first wavelength such that the mask transmits about 2 to about 10% of the light of the first wavelength at the second phase shift pattern, and a first phase shift pattern on the substrate, the second phase shift pattern being disposed between the outermost perimeter of the substrate and the first phase shift pattern.
Digital exposure machine and exposure control method thereof
A digital exposure machine and an exposure control method thereof are disclosed. The exposure control method of the digital exposure machine includes: determining a scanning direction of the digital exposure machine, wherein a plurality of sub-pixels in an array include multiple rows of sub-pixels arranged in the scanning direction, the multiple rows of sub-pixels including a first row of sub-pixels in the scanning direction; determining a starting scanning position, the starting scanning position being located on an outer side of the first row of sub-pixels in the scanning direction; and performing a plurality of scannings to expose a display region of the first display substrate to be exposed, wherein a scanning pitch for each of the plurality of scannings is integer times of a pitch of two adjacent rows of sub-pixels of the first display substrate in the scanning direction.
Digital exposure machine and exposure control method thereof
A digital exposure machine and an exposure control method thereof are disclosed. The exposure control method of the digital exposure machine includes: determining a scanning direction of the digital exposure machine, wherein a plurality of sub-pixels in an array include multiple rows of sub-pixels arranged in the scanning direction, the multiple rows of sub-pixels including a first row of sub-pixels in the scanning direction; determining a starting scanning position, the starting scanning position being located on an outer side of the first row of sub-pixels in the scanning direction; and performing a plurality of scannings to expose a display region of the first display substrate to be exposed, wherein a scanning pitch for each of the plurality of scannings is integer times of a pitch of two adjacent rows of sub-pixels of the first display substrate in the scanning direction.
COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RADIATION-SENSITIVE COMPOSITION, METHOD FOR PRODUCING AMORPHOUS FILM, RESIST PATTERN FORMATION METHOD, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, COMPOSITION FOR OPTICAL MEMBER FORMATION, RESIN FOR UNDERLAYER FILM FORMATION, RESIST RESIN, RADIATION-SENSITIVE RESIN, AND RESIN FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY
A composition for film formation containing a polycyclic polyphenolic resin having repeating units derived from at least one monomer selected from the group consisting of aromatic hydroxy compounds represented by the formulas (1-0), (1A), and (1B), wherein the repeating units are linked by a direct bond between aromatic rings:
##STR00001##
POLYMER, COMPOSITION, METHOD FOR PRODUCING POLYMER, COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, RADIATION-SENSITIVE COMPOSITION, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, CIRCUIT PATTERN FORMATION METHOD, AND COMPOSITION FOR OPTICAL MEMBER FORMATION
A polymer having a constituent unit derived from a monomer represented by the following formula (0), wherein the polymer has sites in which the constituent units are linked by direct bonding between aromatic rings of the monomer represented by the formula (0):
##STR00001##
wherein R is a monovalent group, and m is an integer of 1 to 5, wherein at least one R is a hydroxyl group, an alkoxy group having 1 to 40 carbon atoms and optionally having a substituent, or an amino group having 0 to 40 carbon atoms and optionally having a substituent.