An object of the present invention is to provide a resin membrane filter having excellent separation accuracy, toughness, and filtration speed, and a manufacturing method of the resin membrane filter.

The resin membrane filter of the present invention includes a first main surface, a second main surface, and a plurality of through-holes, in which the resin membrane filter is a single membrane, in the through-hole, in a case where an average area of an opening portion at a position A which is located at a distance of 10% of a thickness of the resin membrane filter from the first main surface is denoted as Sva and an average area of an opening portion at a position B which is located at a distance of 90% of the thickness of the resin membrane filter from the first main surface is denoted as Svb, Sva/Svb<0.80, and a number ratio Ra of through-holes in which an area of the opening portion at the position A is more than 1.2 times Sva is 3.0% or less.

The present invention discloses a separating device for a bonded cine film and a method therefor, which belong to the field of image file protection and repair technologies. The separating device comprises a pressurizing device, a separating device and a liquid nitrogen storage device; the pressurizing device is connected to the liquid nitrogen storage device for providing a pressure thereto; the liquid nitrogen storage device is connected to the separating device for providing liquid nitrogen thereto; the separating device is provided therein with a film receiving chamber for accommodating a film to be separated; the pressurizing device pressurizes the liquid nitrogen storage device to allow the liquid nitrogen to enter the film receiving chamber; due to a difference between expansion coefficients of a base layer and an emulsion layer of the film under a low temperature, micro-pores and gaps may be generated in the base layer and the emulsion layer of a bonded film roll; the liquid nitrogen penetrates into the micropores and gaps of the bonded film roll, a certain tension is generated during gasification, and viscosity of liquefied gelatin decreases under the low temperature, thereby achieving the purpose of separation; the entire separation process does not damage the pH, dimensional stability or mechanical properties of the film roll, and a non-destructive separation can be achieved.

The conductive pattern formation method according to the present invention comprises a step of providing a photosensitive conductive film including a conductive layer containing conductive fibers, a photosensitive resin layer containing a photosensitive resin and an inorganic filler, and a support film in this order, and laminating the conductive layer and the photosensitive resin layer on a base material such that the conductive layer side is closely bonded to the base material, and a step of exposing and developing the photosensitive resin layer and the conductive layer on the base material to form a conductive pattern.

A substrate treatment apparatus for applying a coating solution to a front surface of a substrate and developing an exposed coating film on the front surface of the substrate, includes a film forming unit configured to form a friction reducing film on a rear surface of the substrate before exposure processing, the friction reducing film reducing friction between the rear surface of the substrate and a holding surface for holding the rear surface of the substrate in the exposure processing.

A substrate treatment apparatus for applying a coating solution to a front surface of a substrate and developing an exposed coating film on the front surface of the substrate, includes a film forming unit configured to form a friction reducing film on a rear surface of the substrate before exposure processing, the friction reducing film reducing friction between the rear surface of the substrate and a holding surface for holding the rear surface of the substrate in the exposure processing.

The present disclosure concerns an electrical circuit pattern on a substrate, as well as a method and system for forming same. In a typical embodiment, a light pattern is projected through a transparent layer to cause a patterned release of adhesion between a continuous material layer and the transparent layer. A release layer adhered to the patterned material layer is pulled off the substrate to separate the material having lower adhesion while leaving the material that was not exposed to form the electrical circuit pattern thereon.

The present disclosure concerns an electrical circuit pattern on a substrate, as well as a method and system for forming same. In a typical embodiment, a light pattern is projected through a transparent layer to cause a patterned release of adhesion between a continuous material layer and the transparent layer. A release layer adhered to the patterned material layer is pulled off the substrate to separate the material having lower adhesion while leaving the material that was not exposed to form the electrical circuit pattern thereon.

This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.

An article is prepared with surface regions having different contact angles. A reactive silane material is attached to a surface having a reactive tail component that is contacted with a first corresponding reactant, followed by imagewise UV exposure to cause imagewise reaction of the reactive tail component and first corresponding reactant, forming reacted regions and latent reaction regions. After rinsing, a second corresponding reactant that is capable of reaction with the reactive moiety is applied. Uniform UV exposure leads to a second reaction product only in the latent reaction regions. After rinsing, first regions comprise exclusively the first reaction product and second regions comprising exclusively the second reaction product. These first and second regions have contact angles that differ by 10-110 degrees. A composition can be applied that is exclusively attracted to either the first regions or the second regions, but not to both the first and second regions.

An article is prepared with surface regions having different contact angles. A reactive silane material is attached to a surface having a reactive tail component that is contacted with a first corresponding reactant, followed by imagewise UV exposure to cause imagewise reaction of the reactive tail component and first corresponding reactant, forming reacted regions and latent reaction regions. After rinsing, a second corresponding reactant that is capable of reaction with the reactive moiety is applied. Uniform UV exposure leads to a second reaction product only in the latent reaction regions. After rinsing, first regions comprise exclusively the first reaction product and second regions comprising exclusively the second reaction product. These first and second regions have contact angles that differ by 10-110 degrees. A composition can be applied that is exclusively attracted to either the first regions or the second regions, but not to both the first and second regions.