A method for manufacturing an electroconductive pattern 40, provided with: a lamination step for laminating an acid generation film 10 containing an acid proliferation agent and a photoacid generator on a polymer film 20 containing an electroconductive polymer formed on a substrate 21; a masking step for masking the top of the acid generation film 10; a light irradiation step for irradiating the laminate from the acid-generation-film 10 side; a doping step for doping the electroconductive polymer with an acid generated and proliferated in the acid generation film 10 by the light irradiation; and a releasing step for releasing the acid generation film 10 from the polymer film 20. This method makes it possible to provide an electroconductive film and a method for manufacturing an electroconductive pattern in which photoacid generation and acid proliferation effects are utilized.

Customizable hydrogel patterned into arrays of microwells, microchannels, or other microfeatures, and a process to prepare patterned hydrogel adherent to a solid support, are provided. A pattern of light is applied to photopolymerizable hydrogel precursor solution on a solid support, resulting in the formation of a patterned hydrogel bonded to the solid support. Hydrogel precursor solution is held by a ring of a customized height secured to a photomask or to a surface allowing transmission of a pattern of light. This process allows for facile customization and repeated fabrications of hydrogel microwells of desired heights and geometries with a micron or submicron scale resolution, adherent on various solid supports.

Customizable hydrogel patterned into arrays of microwells, microchannels, or other microfeatures, and a process to prepare patterned hydrogel adherent to a solid support, are provided. A pattern of light is applied to photopolymerizable hydrogel precursor solution on a solid support, resulting in the formation of a patterned hydrogel bonded to the solid support. Hydrogel precursor solution is held by a ring of a customized height secured to a photomask or to a surface allowing transmission of a pattern of light. This process allows for facile customization and repeated fabrications of hydrogel microwells of desired heights and geometries with a micron or submicron scale resolution, adherent on various solid supports.

A method for manufacturing an electroconductive pattern 40, provided with: a lamination step for laminating an acid generation film 10 containing an acid proliferation agent and a photoacid generator on a polymer film 20 containing an electroconductive polymer formed on a substrate 21; a masking step for masking the top of the acid generation film 10; a light irradiation step for irradiating the laminate from the acid-generation-film 10 side; a doping step for doping the electroconductive polymer with an acid generated and proliferated in the acid generation film 10 by the light irradiation; and a releasing step for releasing the acid generation film 10 from the polymer film 20. This method makes it possible to provide an electroconductive film and a method for manufacturing an electroconductive pattern in which photoacid generation and acid proliferation effects are utilized.

This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.

Disclosed herein is a photoresist composition comprising a first polymer comprising an acid labile group; a photoacid generator; and an acid diffusion control agent that comprises a tri-alkyl amide compound having a lipophilicity (log P) value that is greater than 11.

Disclosed herein is a photoresist composition comprising a first polymer comprising an acid labile group; a photoacid generator; and an acid diffusion control agent that comprises a tri-alkyl amide compound having a lipophilicity (log P) value that is greater than 11.

Materials and methods to immobilize photoacid generators on semiconducting substrates are provided. PAG-containing monomers are copolymerized with monomers to allow the polymer to bind to a surface, and optionally copolymerized with monomers to enhance solubility to generate PAG-containing polymers. The PAG-containing monomers can be coated onto a surface, where the immobilized PAGs can then be used to pattern materials coated on top of the immobilized PAGs, allowing direct patterning without the use of a photoresist, thereby reducing process steps and cost. The disclosed materials and processes can be used to produce conformal coatings of controlled thicknesses.

Materials and methods to immobilize photoacid generators on semiconducting substrates are provided. PAG-containing monomers are copolymerized with monomers to allow the polymer to bind to a surface, and optionally copolymerized with monomers to enhance solubility to generate PAG-containing polymers. The PAG-containing monomers can be coated onto a surface, where the immobilized PAGs can then be used to pattern materials coated on top of the immobilized PAGs, allowing direct patterning without the use of a photoresist, thereby reducing process steps and cost. The disclosed materials and processes can be used to produce conformal coatings of controlled thicknesses.

A method for thermally developing a relief precursor comprising a supporting layer and photopolymer layer having cured and uncured portions comprising the steps: (a) fixing the relief precursor with the supporting layer adjacent to a movable support; (b) repeatedly moving the support with the relief precursor fixed thereon in a multitude of movement cycles; (c) heating the relief precursor to a temperature sufficient to cause the uncured portions of the photopolymer layer to soften or liquefy; (d) contacting the relief precursor with a development medium to allow the liquefied material of the uncured portions to be adhered to and removed by the development medium;
wherein the heating and contacting is carried out in cycles A, B, C or D each corresponding to a single movement cycle such that (i) in a cycle A, the relief precursor is heated with higher heating power and not contacted the relief precursor with the development medium; (ii) in a cycle B, the relief precursor is heated with higher heating power and contacted with the development medium; (iii) in a cycle C, the relief precursor is not heated or heated with lower heating power and contacted with the development medium; (iv) in a cycle D, the relief precursor is not heated or heated with lower heating power and not contacted with the development medium;
wherein cycle B is carried out once or more and at least one of cycles A, C or D is carried out once or more.