Vacuum-integrated photoresist-less methods and apparatuses for forming metal hardmasks can provide sub-30 nm patterning resolution. A metal-containing (e.g., metal salt or organometallic compound) film that is sensitive to a patterning agent is deposited on a semiconductor substrate. The metal-containing film is then patterned directly (i.e., without the use of a photoresist) by exposure to the patterning agent in a vacuum ambient to form the metal mask. For example, the metal-containing film is photosensitive and the patterning is conducted using sub-30 nm wavelength optical lithography, such as EUV lithography.

Vacuum-integrated photoresist-less methods and apparatuses for forming metal hardmasks can provide sub-30 nm patterning resolution. A metal-containing (e.g., metal salt or organometallic compound) film that is sensitive to a patterning agent is deposited on a semiconductor substrate. The metal-containing film is then patterned directly (i.e., without the use of a photoresist) by exposure to the patterning agent in a vacuum ambient to form the metal mask. For example, the metal-containing film is photosensitive and the patterning is conducted using sub-30 nm wavelength optical lithography, such as EUV lithography.

The present disclosure relates to a film formed with an organotin(II) compound, as well as methods for forming and employing such films. The film can be employed as a photopatternable film or a radiation-sensitive film. In non-limiting embodiments, the radiation can include extreme ultraviolet (EUV) or deep ultraviolet (DUV) radiation

The present disclosure relates to use of a metal chelator to treat an exposed photoresist film. In particular embodiments, the metal chelator is employed to remove an interfacial area that is disposed between exposed and unexposed areas or disposed within an exposed area, thereby enhancing patterning quality.

A substrate processing method includes a processing film forming step in which a processing liquid is supplied to a front surface of a substrate to solidify or cure the processing liquid on the front surface of the substrate, thereby forming a processing film on the front surface of the substrate, an etching component forming step in which the processing film is subjected to etching component forming processing to form an etching component in the processing film, an etching step in which a surface layer portion of the substrate is etched by the etching component formed in the etching component forming step, and a processing film removing step in which a peeling liquid is supplied to a front surface of the processing film, thereby peeling the processing film from the front surface of the substrate and removing the processing film from the front surface of the substrate.

A substrate processing method includes a processing film forming step in which a processing liquid is supplied to a front surface of a substrate to solidify or cure the processing liquid on the front surface of the substrate, thereby forming a processing film on the front surface of the substrate, an etching component forming step in which the processing film is subjected to etching component forming processing to form an etching component in the processing film, an etching step in which a surface layer portion of the substrate is etched by the etching component formed in the etching component forming step, and a processing film removing step in which a peeling liquid is supplied to a front surface of the processing film, thereby peeling the processing film from the front surface of the substrate and removing the processing film from the front surface of the substrate.

The present disclosure relates to methods of manufacturing at least a portion of a magnetic layer of a magnetic recording disk. The methods include forming a plurality of sacrificial, discrete structures via imprint lithography. The sacrificial, discrete structures are used to form a plurality of three-dimensional segregant structures in a magnetic layer of the magnetic recording disk. The present disclosure also relates to corresponding magnetic recording disks.

The present disclosure relates to methods of manufacturing at least a portion of a magnetic layer of a magnetic recording disk. The methods include forming a plurality of sacrificial, discrete structures via imprint lithography. The sacrificial, discrete structures are used to form a plurality of three-dimensional segregant structures in a magnetic layer of the magnetic recording disk. The present disclosure also relates to corresponding magnetic recording disks.

The invention relates to a method for producing pictorial relief structures on a layer construction. The method comprises the provision of a layer construction having a substrate layer. After this, at least one fluid containing at least one first reactive component is applied pictorially to the substrate, wherein the pictorial application takes place in the form of a plurality of droplets with a droplet volume of less than 2 μl, and wherein the droplets are positioned pictorially. After this, there is an at least partial diffusing of the at least one first reactive component into the substrate layer for a predefined exposure time and/or an at least partial diffusing of at least one second reactive component into the pictorially positioned droplets of fluid for a predefined exposure time, wherein the substrate layer comprises the at least one second reactive component. The created relief is then fixed under the influence of heat and/or radiation via a reaction involving the first reactive component and/or the second reactive component. Further aspects of the invention relate to a pictorial relief structure produced according to the method and to the use of the pictorial relief structure as a printing form, as a microfluidic component, as a microreactor, as a phoretic cell, as a light-controlling element for color representation, as photonic crystals or as flexible parts of items of clothing.

The invention relates to a method for producing pictorial relief structures on a layer construction. The method comprises the provision of a layer construction having a substrate layer. After this, at least one fluid containing at least one first reactive component is applied pictorially to the substrate, wherein the pictorial application takes place in the form of a plurality of droplets with a droplet volume of less than 2 μl, and wherein the droplets are positioned pictorially. After this, there is an at least partial diffusing of the at least one first reactive component into the substrate layer for a predefined exposure time and/or an at least partial diffusing of at least one second reactive component into the pictorially positioned droplets of fluid for a predefined exposure time, wherein the substrate layer comprises the at least one second reactive component. The created relief is then fixed under the influence of heat and/or radiation via a reaction involving the first reactive component and/or the second reactive component. Further aspects of the invention relate to a pictorial relief structure produced according to the method and to the use of the pictorial relief structure as a printing form, as a microfluidic component, as a microreactor, as a phoretic cell, as a light-controlling element for color representation, as photonic crystals or as flexible parts of items of clothing.