Organometallic precursors are described for the formation of high resolution lithography patterning coatings based on metal oxide hydroxide chemistry. The precursor compositions generally comprise ligands readily hydrolysable by water vapor or other OH source composition under modest conditions. The organometallic precursors generally comprise a radiation sensitive organo ligand to tin that can result in a coating that can be effective for high resolution patterning at relatively low radiation doses and is particularly useful for EUV patterning. The precursors compositions are readily processable under commercially suitable conditions. Solution phase processing with in situ hydrolysis or vapor based deposition can be used to form the coatings.

[Problem] To obtain a substrate cleaning solution capable of cleaning a substrate and removing particles. [Means for Solution] To provide a substrate cleaning solution comprising an insoluble or hardly soluble solute (A), a soluble solute (B), and a solvent (C), wherein the solvent (C) comprises water (C-1); and the content of the soluble solute (B) is 0.1 to 500 mass % based on water (C-1).

The present application relates to a compound of Chemical Formula 1, a binder resin, a negative-type photosensitive resin composition, and a display apparatus including a black bank formed using the same.

Provided are a curable composition used for forming an interlayer existing between a base material and a curable layer, the curable composition including a curable main agent having a polymerizable functional group, a polymerization inhibitor, and a solvent, in which a content of the polymerization inhibitor is 1 part by mass or greater and lower than 1,000 parts by mass with respect to 1,000,000 parts by mass of the curable main agent; a kit including the curable composition; an interlayer formed from the curable composition; a laminate including the interlayer; an imprint pattern producing method using the laminate; and a method for manufacturing a device including the imprint pattern producing method.

Provided are a curable composition used for forming an interlayer existing between a base material and a curable layer, the curable composition including a curable main agent having a polymerizable functional group, a polymerization inhibitor, and a solvent, in which a content of the polymerization inhibitor is 1 part by mass or greater and lower than 1,000 parts by mass with respect to 1,000,000 parts by mass of the curable main agent; a kit including the curable composition; an interlayer formed from the curable composition; a laminate including the interlayer; an imprint pattern producing method using the laminate; and a method for manufacturing a device including the imprint pattern producing method.

The present disclosure provides a method of manufacturing a conductive pattern and applications thereof, the method including: a step of preparing a laminate including a transparent substrate, a light shielding pattern that is formed on the transparent substrate, and a negative tone photosensitive resin layer that is disposed on the transparent substrate and the light shielding pattern and is in contact with the transparent substrate; a step of irradiating a surface of the transparent substrate opposite to a surface facing the light shielding pattern with light; a step of developing the negative tone photosensitive resin layer to form a resin pattern in a region defined by the transparent substrate and the light shielding pattern; and a step of forming a conductive pattern on the light shielding pattern.

A method of processing a substrate includes: providing structures on a surface of a substrate; depositing a self-assembled monolayer (SAM) over the structures and the substrate, the SAM being reactive to a predetermined wavelength of radiation; determining a first pattern of radiation exposure, the first pattern of radiation exposure having a spatially variable radiation intensity across the surface of the substrate and the structures; exposing the SAM to radiation according to the first pattern of radiation exposure, the SAM being configured to react with the radiation; developing the SAM with a predetermined removal fluid to remove portions of the SAM that are not protected from the predetermined fluid; and depositing a spacer material on the substrate and the structures, the spacer material being deposited at varying thicknesses based on an amount of the SAM remaining on the surface of the substrate and the structures.

A chemically amplified photosensitive composition capable of forming a template for plating which can form a plated article with uniform dimensions by photolithography method; a photosensitive dry film including a photosensitive layer consisting of this chemically amplified photosensitive composition; a production method of a substrate having a template for plating using the aforementioned chemically amplified photosensitive composition; and a production method of a plated article using the substrate having the template formed by the aforementioned method. A coumarin compound is blended into a chemically amplified photosensitive composition containing an acid generator which generates an acid by irradiation of active rays or radioactive rays.

An object of the present invention is to provide a chemical liquid supply method capable of reducing the content of impurities in a chemical liquid. Another object of the present invention is to provide a pattern forming method.

The chemical liquid supply method according to an embodiment of the present invention is a chemical liquid supply method of supplying a chemical liquid containing an organic solvent through a pipe line that an apparatus for semiconductor devices comprises, the chemical liquid supply method having a gas pumping step of sending the chemical liquid by pressurization using a gas, in which a moisture content in the gas is 0.00001 to 1 ppm by mass with respect to a total mass of the gas.

An object of the present invention is to provide a chemical liquid supply method capable of reducing the content of impurities in a chemical liquid. Another object of the present invention is to provide a pattern forming method.

The chemical liquid supply method according to an embodiment of the present invention is a chemical liquid supply method of supplying a chemical liquid containing an organic solvent through a pipe line that an apparatus for semiconductor devices comprises, the chemical liquid supply method having a gas pumping step of sending the chemical liquid by pressurization using a gas, in which a moisture content in the gas is 0.00001 to 1 ppm by mass with respect to a total mass of the gas.