The disclosure provides a prebaking device and a prebaking system for display substrate. The prebaking device includes a top plate, a bottom plate, a first side plate, a second side plate, a third side plate defined opposite to the first side plate and a fourth side plate defined opposite to the second side plate, the top plate, the bottom plate, the first side plate, the second side plate, the third side plate and the fourth side plate form a chamber cooperatively, the first side plate is defined with a window, the second side plate is defined with an air inlet hole to connect an air supply pipe of a hot air system, the fourth side plate is defined with an air exhaust hole to connect an exhaust system, the inner surface of the top plate is defined with an anti-adhere film.

The disclosure provides a prebaking device and a prebaking system for display substrate. The prebaking device includes a top plate, a bottom plate, a first side plate, a second side plate, a third side plate defined opposite to the first side plate and a fourth side plate defined opposite to the second side plate, the top plate, the bottom plate, the first side plate, the second side plate, the third side plate and the fourth side plate form a chamber cooperatively, the first side plate is defined with a window, the second side plate is defined with an air inlet hole to connect an air supply pipe of a hot air system, the fourth side plate is defined with an air exhaust hole to connect an exhaust system, the inner surface of the top plate is defined with an anti-adhere film.

The invention aims to provide a cured film that is high in sensitivity, able to form a pattern having a small-tapered shape after a development step and after a heat curing step, helpful to depress the difference in the width of patterned openings between before and after the heat curing step, and high in light-shielding capability and also aims to provide a negative type photosensitive resin composition that serves for the production thereof. The negative type photosensitive resin composition includes an alkali-soluble resin (A), a radical polymerizable compound (B), a photo initiator (C1), and a black colorant (Da); the alkali-soluble resin (A) including a first resin (A1) containing one or more selected from the group consisting of polyimide (A1-1), polyimide precursor (A1-2), polybenzoxazole (A1-3), polybenzoxazole precursor (A1-4), and polysiloxane (A1-5); and the radical polymerizable compound (B) including one or more selected from the group consisting of a fluorene backbone-containing radical polymerizable compound (B1) and an indane backbone-containing radical polymerizable compound (B2).

Methods and apparatuses for minimizing line edge/width roughness in lines formed by photolithography are provided. In one example, a method of processing a substrate includes applying a photoresist layer comprising a photoacid generator to on a multi-layer disposed on a substrate, wherein the multi-layer comprises an underlayer formed from an organic material, inorganic material, or a mixture of organic and inorganic materials, exposing a first portion of the photoresist layer unprotected by a photomask to a radiation light in a lithographic exposure process, and applying an electric field or a magnetic field to alter movement of photoacid generated from the photoacid generator substantially in a vertical direction.

Embodiments provided herewith are directed to self-assembled methods of preparing a patterned surface for sequencing applications including, for example, a patterned flow cell or a patterned surface for digital fluidic devices. The methods utilize photolithography to create a patterned surface with a plurality of microscale or nanoscale contours, separated by hydrophobic interstitial regions, without the need of oxygen plasma treatment during the photolithography process. In addition, the methods avoid the use of any chemical or mechanical polishing steps after the deposition of a gel material to the contours.

A photoresist composition includes a photoactive compound and a polymer. The polymer has a polymer backbone including one or more groups selected from: ##STR00001##
The polymer backbone includes at least one group selected from B, C-1, or C-2, wherein ALG is an acid labile group, and X is linking group.

A photoresist composition includes a photoactive compound and a polymer. The polymer has a polymer backbone including one or more groups selected from: ##STR00001##
The polymer backbone includes at least one group selected from B, C-1, or C-2, wherein ALG is an acid labile group, and X is linking group.

In this work is presented a method for fabrication of high-aspect ratio structures through spalling effect. The spalling is achieved through lithography, etching and sputtering processes, thus providing the flexibility to position the spalled structures according to the application requirements. This method has been successfully demonstrated for metal-oxides and metals. The width of the fabricated structures is dependent on the thickness of the film deposited by sputtering, where structures as small as 20 nm in width have been obtained.

A hardmask composition, a hardmask layer manufactured from the hardmask composition, and a method of forming patterns from the hardmask composition, the composition including a solvent; and a polymer including a structural unit represented by Chemical Formula 1,

##STR00001##

A hardmask composition, a hardmask layer manufactured from the hardmask composition, and a method of forming patterns from the hardmask composition, the composition including a solvent; and a polymer including a structural unit represented by Chemical Formula 1,

##STR00001##