A lithography apparatus comprises a light source for emitting light; a mask mounting zone where a mask for reflecting the light is disposed; and a mask protective module disposed on the mask to transmit the light from the light source toward the mask. The mask protective module comprises a frame and a membrane supported by the frame, wherein the membrane includes a penetration region for transmitting the light and a peripheral region of which a light transmittance is lower than that of the penetration region.

A mounted hollow-core fiber arrangement includes a hollow-core fiber having a microstructure, and a mount arrangement including a plurality of mounting contacts configured to apply a force to an outer layer of the hollow-core fiber. A portion of the hollow-core fiber is located in a receiving region of the mount arrangement. The plurality of mounting contacts are positioned around the receiving region. The mounting contacts are distributed around the receiving region, the distribution of the mounting contacts corresponding to a distribution of features of the microstructure of the hollow-core fiber. The mounted hollow core fiber can be used in a radiation source apparatus for providing broadband radiation.

Embodiments described herein provide a lithographic system having two or more lithographic tools connected to a radiation source using two or more variable attenuation units. In some embodiments, the variable attenuation unit reflects a portion of the received light beam to the lithographic tool attached thereto and transmits a remaining portion of the received light beam to the lithographic tools downstream. In some embodiments, the radiation source includes two or more laser sources to provide laser beams with an enhanced power level and which can prevent operation interruption due to laser source maintenances and repair.

A mask protective module is provided. The mask protective module includes a frame and a membrane supported by the frame. The membrane may include regions of which light transmittances, heat conductivities and/or strengths are different from each other.

A deep ultraviolet (DUV) optical system includes: an optical source system including: a plurality of optical oscillators; a beam combiner; and a beam control apparatus between the optical oscillators and the beam combiner. The beam combiner is configured to receive and direct light emitted from any of the optical oscillators toward a scanner apparatus as an exposure light beam, and the beam control apparatus is configured to determine whether the beam combiner receives light from a particular one of the optical oscillators. The DUV optical lithography system also includes a control system coupled to the optical source system, the control system configured to: determine whether a condition exists in the DUV optical system, and based on a determination that the condition exists, perform a calibration action in a subset of the optical oscillators.

A mounted hollow-core fiber arrangement includes a hollow-core fiber having a microstructure, and a mount arrangement including a plurality of mounting contacts configured to apply a force to an outer layer of the hollow-core fiber. A portion of the hollow-core fiber is located in a receiving region of the mount arrangement. The plurality of mounting contacts are positioned around the receiving region. The mounting contacts are distributed around the receiving region, the distribution of the mounting contacts corresponding to a distribution of features of the microstructure of the hollow-core fiber. The mounted hollow core fiber can be used in a radiation source apparatus for providing broadband radiation.

According to one embodiment, a drawing method includes acquiring a first arrangement information indicating an arrangement state of a stepped portion on a substrate. The method further includes acquiring a height information indicating a height of the stepped portion. The method further includes measuring a height of the substrate. The method further includes calculating a focus map indicating a distribution of beam focus values of an electron beam according to a drawing location on the substrate on a basis of the acquired first arrangement information and the height information, and the measured height of the substrate. The method further includes drawing a pattern on the substrate by an electron beam with a beam focus value determined on a basis of the calculated focus map.

A gamma ray generator includes a plate, a plurality of holes and a plurality of gamma ray sources. The plate is configured to rotate along a rotational axis. The holes are disposed in the plate, and the holes are arranged in a matrix. The gamma ray sources are respectively placed in the holes.

A projection exposure apparatus for semiconductor lithography having a projection optical unit. The projection optical unit includes a sensor frame, a carrying frame, and a module. The module includes an optical element and actuators for positioning and orienting the optical element. The module is on the carrying frame, and the sensor frame is a reference for the positioning of the optical element. The module includes an infrastructure which includes interfaces for separating a module from the projection optical unit. A method exchanges the module of a projection optical unit of a projection exposure apparatus for semiconductor lithography, wherein the module includes an optical element, while the reference remains in the projection exposure apparatus.

An exposure device has a cylindrical peripheral wall member. The peripheral wall member forms a processing space in which a substrate is storable and has an upper opening and a lower opening. Further, a light emitter is provided in an upper portion of the peripheral wall member to close the upper opening. A lower lid member that is provided to be movable in an up-and-down direction and configured to be capable of closing and opening the lower opening is provided below the peripheral wall member. The atmosphere in the processing space is replaced with an inert gas with the substrate stored in the processing space and the lower opening closed by the lower lid member. In this state, vacuum ultraviolet rays are emitted to the substrate from the light emitter, and the substrate is exposed.