G03F7/70375

Photoresist formulations 3D microprinting techniques

The present invention fits into the 3D microprinting sector and relates to a process for producing degradable 3D polymeric nano- or microstructures having sub-micrometre resolution. The process of the invention uses a photoresist formulation comprising a mixture of: (i) cyclic ketene acetal monomers; (ii) vinyl and/or (meth)acrylic monomers; and (iii) at least one photoinitiator. The process of the invention is based on two-photon polymerisation photoinitiated by focusing a laser beam within said photoresist formulation, with the obtainment of polymeric nano- or microstructures degradable under mild conditions and having sub-micrometre resolution.

LINE SCANNING TEMPORALLY FOCUSED TWO-PHOTON LITHOGRAPHY SYSTEM

The present invention presents improved systems and methods for performing multi-photon lithography. A line-scanning temporally focused two-photon lithography (LS-TFTPL) technique is capable of patterning three-dimensional structures with high throughput. An example LS-TFTPL system may include a pulsed laser, first optical components for expanding light pulses into an elongated or line cross section, a digital micromirror device for modulating the light pulses with a linear pattern and dispersing spectral components of the modulated light pulses, and second optical components for focusing the dispersed spectral components of the modulated light pulse at a line in or on a target material. The focused spectral components may alter the target material within selected voxels along the line, where the selected voxels spatially correspond to the linear pattern.

Device and method for measuring substrates for semiconductor lithography
12572085 · 2026-03-10 · ·

The invention relates to a device for measuring a substrate for semiconductor lithography, comprising an illumination optical unit, an imaging optical unit and a recording device arranged in the image plane of the imaging optical unit, a diffractive element being arranged in the pupil of the imaging optical unit. The invention also relates to a method for measuring a substrate for semiconductor lithography with a measuring device, the measuring device comprising an imaging optical unit with a pupil, with the following method steps: arranging a diffractive element in the pupil of the imaging optical unit for producing a multifocal imaging, capturing the imaging of a partial region of the substrate, and evaluating the imaging.

Process for creating a three-dimensional structure in a lithography material via a laser lithography device

Method (and apparatus) for producing a 3D target structure in lithographic material. Focus region of a laser writing beam travels through a scanning manifold through the lithographic material. In the focus region of the laser writing beam, an exposure dose is irradiated into the lithographic material, and a structure region is locally defined. At least one exposure data set which represents a local exposure dose for the scan manifold as a function of location is determined. A structure which approximates the target structure is defined based on at least one exposure data set. This structure is analyzed and at least one analysis data set which represents the analyzed structure is determined. Deviation data set which represents deviations of the already defined structure from the target structure is determined. At least one correction exposure data set is determined. Correction structure based on the at least one correction exposure data set is defined.