An initialization method including estimating a characteristic of a property of an object based on a plurality of measurements by the sensor of the property using a respective plurality of different measurement parameters, different ones of the measurements using different measurement parameters, the characteristic including a combination of respective outcomes of respective ones of the measurements weighted by a respective weighting coefficient; performing, for each of a plurality of models of the object, each model configured to enable respective simulation of the performing of the measurements, a respective simulation, the respective simulation including simulating the measurements under control of a respective plurality of different simulation parameters to obtain a respective plurality of simulated characteristics of the property, the different simulation parameters being indicative of the different measurement parameters; determining, for each of the models, a respective bias representative of a respective difference between a respective theoretical characteristic of the property in accordance with the respective model and a respective further combination of the simulated characteristics of the property in the respective model, the respective further combination of the simulated characteristics including the weight coefficients, each particular one of the weight coefficients associated with a particular one of the different simulation parameters; using a cost function configured to optimize a correspondence between the simulated characteristic of the property and the theoretical characteristic of the property, the cost function being a function of the respective biases of the models; and optimizing the cost function to derive the weight coefficients from the cost function; and using the weight coefficients and the associated simulation parameters in a controller associated with the sensor.

A gripper for an object handler includes an engaging surface for engaging a surface of an object, and a first channel connected to a first outlet, the first outlet being configured to operate, during use, as a vacuum clamp arranged to secure the engaging surface to the surface of the object. The gripper further includes a second channel arranged to be connected to a pressure source, and at least one second outlet arranged adjacent to the engaging surface and connected to the second channel.

A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.

An interface station of a coating and developing treatment system has: a cleaning unit cleaning at least a rear surface of a wafer before the wafer is transferred into an exposure apparatus; an inspection unit inspecting the rear surface of the cleaned wafer whether the wafer is exposable, before it is transferred into the exposure apparatus; wafer transfer mechanisms including arms transferring the wafer between the units and a wafer transfer control part controlling operations of the wafer transfer mechanisms. When it is determined that a state of the wafer becomes an exposable state by re-cleaning in the cleaning unit as a result of the inspection, the wafer transfer control part controls the wafer transfer mechanisms to transfer the wafer again to the cleaning unit.

An interface station of a coating and developing treatment system has: a cleaning unit cleaning at least a rear surface of a wafer before the wafer is transferred into an exposure apparatus; an inspection unit inspecting the rear surface of the cleaned wafer whether the wafer is exposable, before it is transferred into the exposure apparatus; wafer transfer mechanisms including arms transferring the wafer between the units and a wafer transfer control part controlling operations of the wafer transfer mechanisms. When it is determined that a state of the wafer becomes an exposable state by re-cleaning in the cleaning unit as a result of the inspection, the wafer transfer control part controls the wafer transfer mechanisms to transfer the wafer again to the cleaning unit.

An apparatus for bearing a lithography mask with a reticle stage includes a resting support holder for the lithography mask. The resting support holder has bearing points which bear the lithography mask. Optionally, the resting support holder optionally has exactly four bearing points. An associated method adjusts the height of the fourth bearing point until all bearing points bear the same supporting force.

A metrology system includes a timing estimator, a sensor, and a position estimator. The timing estimator receives a control signal transmitted at a first timing of a first control loop and estimates a second timing at which the control signal is transmitted in a second control loop subsequent to the first control loop. The sensor senses position information of a wafer. The position estimator estimates the position information of the wafer at the estimated second timing based on the sensed position information of the wafer and outputs the estimated position information of the wafer based on a position request signal.

A substrate holder for a lithographic apparatus has a planarization layer provided on a surface thereof. The planarization layer provides a smooth surface for the formation of a thin film stack forming an electronic component. The planarization layer is of substantially uniform thickness and/or its outer surface has a peak to valley distance of less than 10 m. The planarization layer may be formed by applying two solutions of different concentration. A surface treatment may be applied to the burls to repel a solution of the planarization layer material.

An exposure method and apparatus expose a substrate with illumination light via a projection optical system and a liquid of a liquid immersion area formed under the projection optical system. A second stage on which the substrate is held and a third stage are relatively moved, based on outer periphery positional information of the second stage, in order to cause the second stage to come close, from one side in a first direction, to the third stage that faces the projection optical system. The second and third stages that have come close together are moved from the one side to an other side in the first direction with respect to the projection optical system to place the second stage to face the projection optical system instead of the third stage while substantially maintaining the liquid immersion area under the projection optical system.

A lithography apparatus includes an original conveying path, a substrate conveying path, and a plurality of patterning devices each configured to perform patterning on a substrate using an original. The plurality of patterning devices are arranged in two rows. The substrate conveying path is provided between and along the two rows. The original conveying path is provided in each of two rows between and along which the two rows of the patterning devices are arranged.