A projection exposure apparatus for semiconductor lithography having a projection optical unit. The projection optical unit includes a sensor frame, a carrying frame, and a module. The module includes an optical element and actuators for positioning and orienting the optical element. The module is on the carrying frame, and the sensor frame is a reference for the positioning of the optical element. The module includes an infrastructure which includes interfaces for separating a module from the projection optical unit. A method exchanges the module of a projection optical unit of a projection exposure apparatus for semiconductor lithography, wherein the module includes an optical element, while the reference remains in the projection exposure apparatus.

A support table for a lithographic apparatus, a method of loading a substrate, a lithographic apparatus and a method for manufacturing a device using a lithographic apparatus. In one arrangement, a support table is configured to support a substrate. The support table has a base surface. The base surface faces a surface of the substrate when the substrate is supported by the support table. One or more gas cushion members are provided above the base surface. Each of the gas cushion members includes a recess. The recess is shaped and configured such that a lowering of the substrate into a position on the support table at which the substrate is supported by the support table causes a localised build-up of pressure within the recess. The localized build-up of pressure provides a localised gas cushioning effect during the lowering of the substrate.

A module for a projection exposure apparatus for semiconductor lithography includes at least one optical element arranged in a holder. At least one spacer is arranged between the holder and a further holder or a main body. The spacer is designed to semi-actively vary its extent. A method for positioning at least one holder in a projection exposure apparatus for semiconductor lithography includes using a semi-active spacer is to position the holder.

A substrate holder for a lithographic apparatus has a main body having a thin-film stack provided on a surface thereof. The thin-film stack forms an electronic or electric component such as an electrode, a sensor, a heater, a transistor or a logic device, and has a top isolation layer. A plurality of burls to support a substrate are formed on the thin-film stack or in apertures of the thin-film stack.

An object holder for a lithographic apparatus has a main body having a surface. A plurality of burls to support an object is formed on the surface or in apertures of a thin-film stack. At least one of the burls is formed by laser-sintering. At least one of the burls formed by laser-sintering may be a repair of a damaged burl previously formed by laser-sintering or another method.

A difficulty of contamination interfering with a grid plate positional measurement system is addressed. In one embodiment contamination is prevented from coming into contact with the grating or the sensor. In an embodiment, surface acoustic waves are used to detach contamination from a surface of the grating or sensor.

A projection exposure apparatus for semiconductor lithography having a projection optical unit. The projection optical unit includes a sensor frame, a carrying frame, and a module. The module includes an optical element and actuators for positioning and orienting the optical element. The module is on the carrying frame, and the sensor frame is a reference for the positioning of the optical element. The module includes an infrastructure which includes interfaces for separating a module from the projection optical unit. A method exchanges the module of a projection optical unit of a projection exposure apparatus for semiconductor lithography, wherein the module includes an optical element, while the reference remains in the projection exposure apparatus.

A substrate holder for a lithographic apparatus has a main body having a thin-film stack provided on a surface thereof. The thin-film stack forms an electronic or electric component such as an electrode, a sensor, a heater, a transistor or a logic device, and has a top isolation layer. A plurality of burs to support a substrate are formed on the thin-film stack or in apertures of the thin-film stack.

There is provided a method for molding a substrate storing container 1 including a container main body molding step of molding a container main body 2 in a state where a direction P2 perpendicular to a plane P1 passing through the entire periphery of an end edge of an opening circumferential portion 28 of the container main body 2 is inclined in a direction forming a predetermined angle a2, with respect to a horizontal direction L1 which is a movement direction of the movable die M1 with respect to the fixed die M2, and a pullout step of pulling the container main body 2 molded in the mold space M0 out from the movable die M1 by moving the movable die M1 so as to retreat from the fixed die M2.

A sub-lithographic device, and a method of fabricating the device, is provided. The method includes determining a lithographic size constraint, and determining size and position of sub-lithographic components of the device. A resist layer is deposited on a substrate, and a mask is positioned over the substrate. The mask includes an aperture corresponding to a first region of the resist layer. After positioning the mask, the resist layer is partially exposed to a radiant energy. The mask is adjusted such that the aperture corresponds to a second region of the resist layer. The overlap of the first region and the second region corresponds to the position of a component of the device. The resist layer is partially exposed again to the radiant energy. An opening is formed in the resist layer by removing fully exposed portion of the resist layer. Subsequently, material for the component is deposited within the opening.