A method of determining a desired relative position between a first object of a lithographic apparatus and a second object of the lithographic apparatus. Generating a measurement signal representing a position of the first object relative to the second object, at an initial relative position. Determining a gradient associated with the initial relative position, based on the measurement signal. Determining a position set point based on the gradient and wherein the position set point comprises a three-dimensional dither signal. Controlling the position of the first object relative to the second object to a further relative position, based on the position set point.

Actual physical locations of dies on a substrate package may be identified without using a full metrology scan of the substrate. Instead, one or more cameras may be used to efficiently locate the approximate location of any of the alignment features based on their expected positioning in the design file for the packages are substrate. The cameras may then be moved to locations where alignment features should be, and images may be captured to determine the actual location of the alignment feature. These actual locations of the alignment features may then be used to identify coordinates for the dies, as well as rotations and/or varying heights of the dies on the packages. A difference between the expected location from the design file and the actual physical location may be used to adjust instructions for the digital lithography system to compensate for the misalignment of the dies.

A method for correcting misalignments is provided. An alignment for each device of a group of devices mounted on a substrate is determined. An alignment error for the group of devices mounted on the substrate is determined based on the respective alignment for each device. One or more correction factors are calculated based on the alignment error. The alignment error is corrected based on the one or more correction factors.

A lithography system is provided with: a measurement device measuring position information of marks on a substrate held in a first stage; and an exposure apparatus on a second stage, the substrate for which the position information measurement for the marks has been completed, performs alignment measurement to measure position information for part of marks selected from among the marks on the substrate, and performs exposure. The measurement device measures position information of marks on the substrate to obtain higher-degree components of correction amounts of an arrangement of divided areas, and the exposure apparatus measures position information of a small number of marks on the substrate to obtain lower-degree components of the correction amounts of the arrangement of the divided areas and exposes the plurality of divided areas while controlling the position of the substrate by using the obtained lower-degree components and the higher-degree components obtained by the measurement device.

Embodiments of the present disclosure provide a substrate measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective portions of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.

A lithography system is provided with: a measurement device measuring position information of marks on a substrate held in a first stage; and an exposure apparatus on a second stage, the substrate for which the position information measurement for the marks has been completed, performs alignment measurement to measure position information for part of marks selected from among the marks on the substrate, and performs exposure. The measurement device measures position information of marks on the substrate to obtain higher-degree components of correction amounts of an arrangement of divided areas, and the exposure apparatus measures position information of a small number of marks on the substrate to obtain lower-degree components of the correction amounts of the arrangement of the divided areas and exposes the plurality of divided areas while controlling the position of the substrate by using the obtained lower-degree components and the higher-degree components obtained by the measurement device.

Described herein are methods of determining an alignment model associated with a mark layout. A method includes obtaining (a) first measurement data a relatively dense mark layout (e.g., more than 200 marks) in comparison with a relatively sparse mark layout (e.g., less than 65 marks) and a second measurement data associated with the relatively sparse mark layout, and (b) a first fitted model that describes object deformation for the relatively dense overlay mark layout; and determining the alignment model based on a second fitted model that describes object deformation for the relatively sparse mark layout, via an fitting technique, based on generalized squares fitting employing an oblique inner product matrix (e.g., W) or an oblique projection least squares fitting employing an oblique projection matrix (e.g., P).

A method of determining a desired relative position between a first object of a lithographic apparatus and a second object of the lithographic apparatus. Generating a measurement signal representing a position of the first object relative to the second object, at an initial relative position. Determining a gradient associated with the initial relative position, based on the measurement signal. Determining a position set point based on the gradient and wherein the position set point comprises a three-dimensional dither signal. Controlling the position of the first object relative to the second object to a further relative position, based on the position set point.

Systems and methods described herein relate to the manufacture of optical elements and optical systems. An example method includes overlaying a first mask on a photoresist material and a substrate, and causing a light source to illuminate the photoresist material through the first mask during a first exposure so as to define a first feature. During the first exposure, the light source is positioned at a non-normal angle with respect to a plane parallel to the substrate. The method includes developing the photoresist material so as to retain an elongate portion of the photoresist material on the substrate. A first end of the elongate portion includes an angled portion that is sloped at an angle with respect to a long axis of the elongate portion. The method also includes depositing a reflective material through a second mask onto the angled portion.

The preset invention provides a method of obtaining an array of a plurality of regions on a substrate, including obtaining, using a prior distribution representing a probability distribution of parameters of a regression model used to estimate the array, a first posterior distribution representing the probability distribution of the parameters, obtaining, using the first posterior distribution as the prior distribution representing the probability distribution of the parameters, a second posterior distribution representing the probability distribution of the parameters, and updating the regression model by deciding the parameters based on the second posterior distribution and obtaining, using the updated regression model, the array of the plurality of regions on a substrate from the second position measurement data.