A stage assembly for positioning a device along a first axis, the stage assembly comprising: a base; a stage that retains the device and moves above the base; a mover assembly that moves the stage along the first axis relative to the base; a first sensor system that monitors the movement of the stage along the first axis, the first sensor system generating a first signal, the first sensor system having a first sensor accuracy; a second sensor system that monitors the movement of the stage along the first axis, the second sensor system having a second sensor accuracy that is different from the first sensor accuracy of the first sensor system, the second sensor generating a second signal; and a control system that controls the mover assembly using at least one of the first sensor and the second signal.

A sensor apparatus includes an illumination system, a detector system, and a processor. The illumination system is con-figured to transmit an illumination beam along an illumination path and includes an adjustable optic. The adjustable optic is configured to transmit the illumination beam toward a diffraction target on a substrate that is disposed adjacent to the illumination system. The transmitting generates a fringe pattern on the diffraction target. A signal beam includes diffraction order sub-beams that are diffracted by the diffraction target. The detector system is configured to collect the signal beam. The processor is configured to measure a char-acteristic of the diffraction target based on the signal beam. The adjustable optic is configured to adjust an angle of incidence of the illumination beam on the diffraction target to adjust a periodicity of the fringe pattern to match a periodicity of the diffraction target.

A compensator for manipulating a radiation beam traveling along an optical path. The compensator includes a fixed support holding a first optical wedge and an adjustable support holding a second optical wedge. The adjustable support includes a base, a stage holding the second optical wedge, first and second flexures, and a drive block. The stage defines a cavity and is movable relative to the base and the fixed support. The first and second flexures couple the stage to the base such that the stage translates along a stage path. The drive block is disposed in the cavity of the stage and is configured to translate along a drive block path perpendicular to the optical path and perpendicular to the stage path. The drive block includes first and second drive bearing surfaces configured to translate the stage in first and second stage directions, respectively, along the stage path.

An apparatus for measuring a position of a mark on a substrate, the apparatus comprising: an illumination system configured to condition at least one radiation beam to form a plurality of illumination spots spatially distributed in series such that during scanning of the substrate the plurality of illumination spots are incident on the mark sequentially, and a projection system configured to project radiation diffracted by the mark from the substrate, the diffracted radiation being produced by diffraction of the plurality of illumination spots by the mark; wherein the projection system is further configured to modulate the diffracted radiation and project the modulated radiation onto a detecting system configured to produce signals corresponding to each of the plurality of illumination spots, the signals being combined to determine the position of the mark.

A molding apparatus that molds a composition on a substrate with a mold includes a mold holding unit configured to hold the mold, a substrate holding unit configured to hold the substrate, a first elastic member configured to apply a first elastic force to the mold holding unit in a direction away from the substrate holding unit, and a control unit configured to cause the mold holding unit to move in the direction away from the substrate holding unit in a case where the control unit determines that an abnormality has occurred.

An interferometer system including: an optical system arranged to split a radiation beam from a laser source into a first beam along a first optical path and a second beam along a second optical path, and recombine the first beam and the second beam to a recombined beam, a detector to receive the recombined beam and to provide a detector signal based on the received recombined beam, and a processing unit, wherein a first optical path length of the first optical path and a second optical path length of the second optical path have an optical path length difference, and wherein the processing unit is arranged to determine a mode hop of the laser source on the basis of a phase shift in the detector signal.

A lithographic apparatus includes an illumination system to produce a beam of radiation, a support to support a patterning device to impart a pattern on the beam, a projection system to project the patterned beam onto a substrate, and a metrology system that includes a radiation source to generate radiation, an optical element to direct the radiation toward a target, a detector to receive a first and second radiation scattered by the target and produce a first and second measurement respectively based on the received first and second radiation, and a controller. The controller determines a correction for the first measurement, an error between the correction for the first measurement and the first measurement, and a correction for the second measurement based on the correction for the first measurement, the second measurement, and the error. The lithographic apparatus uses the correction to adjust a position of a substrate.

Apparatus for, and method of, measuring a parameter of an alignment mark on a substrate in which an optical system is arranged to receive at least one diffraction order from the alignment mark and the diffraction order is modulated at a pupil or a wafer conjugate plane of the optical system, a solid state optical device is arranged to receive the modulated diffraction order, and a spectrometer is arranged to receive the modulated diffraction order from the solid state optical device and to determine an intensity of one or more spectral components in the modulated diffraction order.

Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a bonded structure includes a first bonding layer including a first bonding contact and a first bonding alignment mark, a second bonding layer including a second bonding contact and a second bonding alignment mark, and a bonding interface between the first bonding layer and the second bonding layer. The first bonding alignment mark is aligned with the second bonding alignment mark at the bonding interface, such that the first bonding contact is aligned with the second bonding contact at the bonding interface. The first bonding alignment mark includes a plurality of first repetitive patterns. The second bonding alignment mark includes a plurality of second repetitive patterns different from the plurality of first repetitive patterns.

A lithographic apparatus includes an illumination system to produce a beam of radiation, a support to support a patterning device to impart a pattern on the beam, a projection system to project the patterned beam onto a substrate, and a metrology system that includes a radiation source to generate radiation, an optical element to direct the radiation toward a target, a detector to receive a first and second radiation scattered by the target and produce a first and second measurement respectively based on the received first and second radiation, and a controller. The controller determines a correction for the first measurement, an error between the correction for the first measurement and the first measurement, and a correction for the second measurement based on the correction for the first measurement, the second measurement, and the error. The lithographic apparatus uses the correction to adjust a position of a substrate.